IPQ-5300-0-MRQFN251-TR-03-0 Wi-Fi 6 SoC, MRQFN251 package

  • IPQ-5300-0-MRQFN251-TR-03-0 delivers high-performance networking silicon for low latency and responsiveness.
  • 251-pin MRQFN package enables dense I/O routing, improving system integration.
  • Compact MRQFN251 footprint reduces board space, aiding thermals, power efficiency.
  • In access points, delivers sustained throughput and consistent client performance.
  • Manufactured to industry test standards, ensuring reliability and predictable performance.
Qualcomm-logo
产品上方询盘

IPQ-5300-0-MRQFN251-TR-03-0 Overview

The IPQ-5300-0-MRQFN251-TR-03-0 is a high-density packaged network SoC family member optimized for board-level integration where pin count and assembly volume matter. The part number identifies a MRQFN package with 251 leads and a tape-and-reel ordering suffix. It targets compact, high-I/O designs and production runs that benefit from automated pick-and-place. Learn more components and sourcing options at IC Manufacturer.

IPQ-5300-0-MRQFN251-TR-03-0 Technical Specifications

Attribute Value
Part Number IPQ-5300-0-MRQFN251-TR-03-0
Series Identifier 5300
Package Type MRQFN
Pin Count 251
Packaging Format TR (Tape & Reel)
Ordering Suffix 03-0
Tape & Reel Quantity (suffix) 3000 (03 = 3000 typical reel)
Variant ID 0
Mounting Surface-mount
Identifying Numerics 5300, 251, 03, 0

IPQ-5300-0-MRQFN251-TR-03-0 Key Features

  • High pin density: 251 leads provide greater I/O count for complex board designs and denser signal routing.
  • Compact MRQFN package: reduces PCB footprint compared with larger BGA alternatives while keeping similar I/O capacity.
  • Tape-and-reel ordering: TR suffix supports high-volume automated assembly and predictable reel quantities for manufacturing.
  • Clear variant coding: numeric suffixes (5300, 0, 03-0) allow simple BOM management and faster cross-referencing between suppliers.

Typical Applications

  • Enterprise access points and wireless routers where high I/O count and compact MRQFN packaging enable small form-factor PCB designs and multi?radio interfaces.
  • Carrier-grade gateways and network appliances that require large numbers of external interfaces and reliable, production-friendly tape-and-reel supply chains.
  • High-density switch modules and line cards that need many signal lines routed to a single SoC while keeping board area limited and thermal paths manageable.
  • OEM embedded networking platforms where repeatable assembly (tape & reel) and consistent part coding reduce procurement complexity across multiple production runs.

IPQ-5300-0-MRQFN251-TR-03-0 Advantages vs Typical Alternatives

The 251-pin MRQFN option brings higher I/O than many QFN parts and a smaller profile than equivalent BGAs. For designs prioritizing board area and assembly throughput, the MRQFN offers a practical trade-off: more accessible pins for debugging and rework and better pick-and-place compatibility than larger packages. The tape-and-reel suffix simplifies procurement for volumes in the thousands, making it more convenient versus single-piece packaging or non-standard reels.

IPQ-5300-0-MRQFN251-TR-03-0 Brand Info

The IPQ family is associated with Qualcomm Networking platforms. The brand emphasizes high-performance network SoCs for Wi?Fi and routing applications. This part carries the IPQ series naming convention used by Qualcomm’s networking solutions group, aligning with enterprise and carrier product roadmaps focused on reliability and integration.

FAQ

What does MRQFN251 mean?

MRQFN251 indicates a micro rectangular QFN package with 251 terminals. The code identifies package style and the exact pin count for PCB footprint and assembly planning.

Does TR imply tape & reel?

Yes. The TR suffix denotes tape-and-reel packaging. That format supports automated pick-and-place and typical production reel handling processes.

How many parts per reel?

The part number includes 03 in the suffix. That code commonly maps to a 3000-unit reel. Confirm exact reel quantity with the distributor or datasheet before ordering.

📩 Contact Us

产品中间询盘

How should this part be mounted?

It is a surface-mount device designed for SMT assembly. Use the vendor-recommended land pattern, reflow profile, and inspection criteria to ensure reliable solder joints.

Where can I find the datasheet?

Refer to the manufacturer’s product page or authorized distributor listings for the full datasheet. The datasheet provides electrical specs, thermal data, recommended footprints, and reflow profiles.

Application

, ,

Save cost and time

Fast global delivery

Original parts guaranteed

Expert after-sale support

Looking for a Better Price?