IM323M6G2XKMA1 Overview
The IM323M6G2XKMA1 is a high-performance, industrial-grade component designed for demanding electronic applications. With robust electrical parameters and a compact surface-mount package, it delivers reliable operation for modern circuit designs. Its advanced integration and efficiency features make it a strong choice for engineers seeking streamlined solutions in automation, power control, and embedded system environments. For detailed sourcing and manufacturer information, visit IC Manufacturer.
IM323M6G2XKMA1 Technical Specifications
| Parameter | Value |
|---|---|
| Manufacturer Part Number | IM323M6G2XKMA1 |
| RoHS | Compliant |
| Mounting Type | Surface Mount |
| Package / Case | SMD-24 |
| ECCN | EAR99 |
| Lead Free Status | Lead Free |
| Moisture Sensitivity Level (MSL) | 3 |
| Weight | 0.12g |
IM323M6G2XKMA1 Key Features
- Surface mount design enables automated assembly and efficient utilization of PCB space, streamlining production and saving valuable board area.
- RoHS and Lead-Free compliance ensures suitability for environmentally regulated markets, reducing hazardous materials in end products.
- MSL 3 rating provides good moisture sensitivity protection, supporting reliable operation during challenging manufacturing and storage conditions.
- Compact SMD-24 package allows for integration into high-density system layouts, facilitating advanced miniaturization.
IM323M6G2XKMA1 Advantages vs Typical Alternatives
This device stands out with its robust RoHS compliance, improved environmental safety, and a compact SMD-24 form factor for space-constrained designs. The MSL 3 rating enhances reliability during assembly, while the lead-free status aligns with global safety requirements. Its optimized packaging and mounting flexibility offer distinct integration and operational benefits over typical alternatives.
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Typical Applications
- Industrial automation systems requiring compact, surface-mount devices for efficient circuit assembly and increased reliability in harsh environments.
- Embedded control units where high-density board layouts and strict environmental compliance are essential for long-term operation.
- Power management modules in equipment that must meet global lead-free and RoHS directives.
- General purpose electronic systems where robust moisture sensitivity and assembly compatibility are crucial for maintaining product quality.
IM323M6G2XKMA1 Brand Info
The IM323M6G2XKMA1 is engineered by an industry-leading manufacturer known for delivering high-quality, compliant semiconductor solutions. This device exemplifies a focus on advanced packaging, reliability, and alignment with international environmental standards. Its integration into electronics platforms supports the creation of efficient, sustainable, and modern end-products across a variety of industrial applications.
FAQ
What is the mounting configuration of the IM323M6G2XKMA1?
This product utilizes a surface mount design, specifically housed in an SMD-24 package. This configuration allows for automated assembly and makes the device ideal for use in high-density printed circuit boards.
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Is the IM323M6G2XKMA1 RoHS compliant and lead-free?
Yes, the device is fully RoHS compliant and lead-free. This ensures it meets strict environmental regulations and is suitable for markets that require reduced hazardous material content in electronic products.
What is the Moisture Sensitivity Level for this device?
The IM323M6G2XKMA1 is rated at MSL 3, which means it can withstand standard handling and assembly processes but must be mounted within the specified time after opening to avoid moisture-related issues.
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In what applications is this component typically used?
This device is typically found in industrial automation, embedded control units, power management systems, and other general-purpose electronic systems that demand compact, reliable, and compliant solutions.
What is the weight and why is it important in system design?
The component weighs 0.12g, which contributes to its suitability for lightweight and compact designs. This low weight supports the trend toward miniaturization and high-density assemblies in modern electronics.






