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  • Processes data efficiently to support embedded system tasks with reliable performance.
  • Features a compact package type that enables board-space savings in tight hardware designs.
  • Operates with optimized power consumption, suitable for energy-conscious applications.
  • Ideal for industrial control systems where consistent operation under varying conditions is required.
  • Manufactured following strict quality controls to ensure long-term reliability and durability.
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产品上方询盘

CIMMA8MIJP01914$ Overview

The CIMMA8MIJP01914$ is a high-performance semiconductor device designed for advanced industrial and electronic applications. Featuring robust technical specifications and reliable operation, this component supports efficient power management and precise signal processing. Its compact design ensures easy integration into complex systems, optimizing overall device performance. Engineers and sourcing specialists benefit from its dependable operation in demanding environments. For further details and purchase options, visit IC Manufacturer.

CIMMA8MIJP01914$ Technical Specifications

ParameterSpecification
Operating Voltage3.3 V to 5 V
Maximum Operating Temperature125??C
Package TypeQFN 32-pin
Interface TypeI2C / SPI Compatible
Power ConsumptionTypical 150 mW
Data RateUp to 10 Mbps
Signal-to-Noise Ratio85 dB
Dimensions5 mm ?? 5 mm ?? 0.9 mm
Operating Humidity10% to 90% RH (non-condensing)

CIMMA8MIJP01914$ Key Features

  • High-speed data interface: Supports up to 10 Mbps, enabling fast and efficient communication for time-sensitive applications.
  • Wide operating temperature range: Operates reliably from -40??C to 125??C, suitable for harsh industrial environments.
  • Low power consumption: Typical 150 mW power usage reduces thermal load and extends system battery life.
  • Compact QFN package: Facilitates easy PCB integration while maintaining excellent thermal dissipation.

Typical Applications

  • Industrial automation systems requiring precise control and communication in variable temperature conditions.
  • High-speed data acquisition modules for measurement and test equipment.
  • Embedded systems in automotive electronics demanding robust performance and reliability.
  • Consumer electronics with power-sensitive designs needing efficient data transfer interfaces.

CIMMA8MIJP01914$ Advantages vs Typical Alternatives

This device offers superior integration with both I2C and SPI interfaces, providing flexibility not always found in similar components. Its wide operating temperature range and low power consumption enhance system reliability and efficiency. Compared to typical alternatives, it delivers improved signal integrity with a high signal-to-noise ratio and supports higher data rates, making it an ideal choice for demanding industrial and embedded applications.

CIMMA8MIJP01914$ Brand Info

The CIMMA8MIJP01914$ is manufactured by a leading global semiconductor company known for precision analog and mixed-signal ICs. This brand specializes in delivering innovative, reliable components optimized for industrial, automotive, and consumer markets. Their products are recognized for stringent quality standards, global availability, and comprehensive technical support, ensuring seamless integration and long-term operational stability for professional engineering teams.

FAQ

What voltage range does this device support?

The component operates within a voltage range of 3.3 V to 5 V, making it compatible with a broad range of standard digital and analog systems typically used in industrial and embedded applications.

Can this device handle high-temperature environments?

Yes, it is designed to function reliably at temperatures up to 125??C, making it suitable for harsh industrial conditions where elevated temperatures are common.

What communication protocols are supported?

This product supports both I2C and SPI communication protocols, providing versatile interface options to accommodate various system designs and data transfer requirements.

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产品中间询盘

How does the power consumption impact system design?

With a typical power consumption of 150 mW, this device minimizes energy usage, which helps reduce heat generation and improves battery life in portable or power-sensitive applications.

What package type does this device come in?

The device is housed in a 32-pin QFN package, offering a compact footprint with excellent thermal dissipation properties, aiding efficient PCB layout and mechanical stability.

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