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  • Designed for efficient data processing, CIMMA8MIJP01916$ enhances system responsiveness in embedded applications.
  • Features a high-speed interface that supports rapid communication, reducing latency in critical operations.
  • The compact LFCSP package minimizes board space, enabling integration into constrained hardware environments.
  • Ideal for industrial automation systems, this component ensures stable performance under continuous workload.
  • Manufactured with rigorous quality controls to maintain durability and consistent operation over extended periods.
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产品上方询盘

CIMMA8MIJP01916$ Overview

The CIMMA8MIJP01916$ is a precision semiconductor device designed for high-reliability industrial applications. Engineered to deliver consistent performance in demanding environments, this component offers robust electrical characteristics and stable operation across a wide temperature range. Its compact package and efficient design make it ideal for integration into complex electronic systems requiring dependable signal processing and power management. Sourcing specialists and engineers can rely on this product to meet stringent quality standards and enhance overall system efficiency. For more detailed specifications and support, visit the IC Manufacturer.

CIMMA8MIJP01916$ Technical Specifications

ParameterSpecification
Package TypeSurface-mount (SMD)
Operating Voltage Range3.0 V to 3.6 V
Maximum Operating Temperature+85??C
Minimum Operating Temperature-40??C
Input CurrentMax 1.2 mA
Output CurrentUp to 10 mA
Signal InterfaceDigital I/O compatible
Package Dimensions4.5 mm ?? 3.2 mm ?? 1.0 mm

CIMMA8MIJP01916$ Key Features

  • Stable Operating Voltage Range: Supports 3.0 V to 3.6 V, ensuring compatibility with various power supply systems for consistent performance.
  • Wide Temperature Tolerance: Operates reliably from -40??C up to +85??C, suitable for industrial environments with fluctuating conditions.
  • Low Power Consumption: Consumes a maximum of 1.2 mA input current, enabling energy-efficient system designs and reduced thermal stress.
  • Compact Surface-Mount Package: Small footprint facilitates easy PCB layout and integration into space-constrained applications.

Typical Applications

  • Industrial control systems requiring reliable digital signal processing under harsh environmental conditions, ensuring operational stability.
  • Embedded power management circuits in automation equipment, optimizing energy use and reducing heat generation.
  • Sensors and measurement devices that demand accurate signal interfacing within compact electronic assemblies.
  • Communication modules where stable voltage and low noise contribute to enhanced signal integrity and device longevity.

CIMMA8MIJP01916$ Advantages vs Typical Alternatives

This semiconductor device offers superior operating temperature range and low power consumption compared to typical alternatives, making it ideal for industrial applications where reliability and energy efficiency are critical. Its compact surface-mount package simplifies integration, while the stable voltage range ensures consistent performance. These advantages contribute to enhanced system durability and reduced maintenance costs in demanding environments.

CIMMA8MIJP01916$ Brand Info

The CIMMA8MIJP01916$ is manufactured by a leading global semiconductor company known for its innovation and quality in industrial-grade integrated circuits. This product exemplifies the brand??s commitment to delivering high-performance components that meet stringent industry standards. The brand??s extensive portfolio includes solutions for power management, signal processing, and embedded control, supporting engineers in developing reliable and efficient electronic systems.

FAQ

What is the recommended operating voltage range for this device?

The recommended operating voltage range for this device is between 3.0 V and 3.6 V. Operating within this range ensures optimal performance and prevents damage to the semiconductor.

Can this device operate in extreme temperature conditions?

Yes, it is designed to operate reliably in temperatures ranging from -40??C to +85??C, making it suitable for industrial environments with wide temperature variations.

What type of package does this component use?

This device comes in a compact surface-mount package, specifically sized at 4.5 mm by 3.2 mm by 1.0 mm, which facilitates easy integration into printed circuit boards.

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产品中间询盘

How does the low power consumption benefit system design?

Low power consumption, with a maximum input current of 1.2 mA, reduces heat generation and energy

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