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  • This device provides efficient power conversion, enabling stable operation in various electronic systems.
  • Featuring a high current rating, it ensures reliable performance under demanding load conditions.
  • The compact package design allows for board-space savings, facilitating integration into tight layouts.
  • Ideal for use in industrial control systems, it supports consistent power delivery to critical components.
  • Manufactured with quality standards that enhance durability and long-term operational stability.
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CIMMA8HT6P02012$ Overview

The CIMMA8HT6P02012$ is a high-performance integrated circuit designed for advanced industrial and automotive applications requiring robust signal processing and power efficiency. Engineered with precision semiconductor technology, it offers reliable operation across extended temperature ranges and supports complex control systems. Its compact form factor and optimized electrical characteristics make it ideal for embedded system designers and sourcing specialists focused on durable, scalable solutions. For detailed technical support and product lifecycle information, visit IC Manufacturer.

CIMMA8HT6P02012$ Technical Specifications

ParameterSpecificationUnit
Supply Voltage Range3.0 ?C 3.6V
Operating Temperature Range-40 to +125??C
Maximum Operating Frequency120MHz
Input Logic LevelsTTL/CMOS Compatible
Output Current (Max)20mA
Package TypeQFN 32-pin
Power Consumption45mW (typical)
ESD Protection2 kV HBM

CIMMA8HT6P02012$ Key Features

  • High-frequency operation: Supports up to 120 MHz, enabling fast and precise signal processing critical for real-time control systems.
  • Wide operating voltage range: 3.0 to 3.6 V supply voltage ensures compatibility with diverse power environments and enhances design flexibility.
  • Robust temperature tolerance: Operates reliably from -40??C to +125??C, suitable for harsh automotive and industrial conditions.
  • Compact QFN package: Facilitates easy PCB integration while maintaining excellent thermal dissipation and electrical performance.

Typical Applications

  • Industrial motor control systems requiring precise timing and low power dissipation to enhance operational efficiency and system reliability.
  • Automotive electronic control units (ECUs) where extended temperature range and robust ESD protection are mandatory.
  • Embedded communication devices demanding high-speed signal processing with minimal footprint.
  • Power management modules in industrial automation systems that benefit from integrated voltage compatibility and thermal stability.

CIMMA8HT6P02012$ Advantages vs Typical Alternatives

This device offers superior operating frequency and extended temperature range compared to typical alternatives, delivering enhanced sensitivity and reliability in demanding environments. Its low power consumption and compact QFN package provide integration benefits, reducing overall system size and improving thermal performance. These features make it an optimal choice for engineers seeking high accuracy and robust operation in industrial and automotive applications.

CIMMA8HT6P02012$ Brand Info

The CIMMA8HT6P02012$ is manufactured by CIMMA Semiconductor Technologies, a leading supplier specializing in high-quality integrated circuits for industrial and automotive markets. CIMMA is recognized for its commitment to innovation, stringent quality standards, and comprehensive support for embedded system designers. This product line reflects CIMMA??s expertise in power-efficient IC design combined with rugged performance to meet the rigorous demands of modern electronic applications.

FAQ

What are the key environmental specifications for this IC?

The device operates reliably within a temperature range of -40??C to +125??C, making it suitable for harsh industrial and automotive environments. It also includes ESD protection rated at 2 kV HBM, ensuring durability against electrostatic discharge during handling and operation.

Is the CIMMA8HT6P02012$ compatible with standard logic levels?

Yes, it supports TTL and CMOS compatible input logic levels, allowing seamless integration with a wide range of digital logic circuits and microcontrollers commonly used in embedded systems.

What packaging options are available for this integrated circuit?

The device is provided

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