IL-AG5-4S-S3C1 Overview
The IL-AG5-4S-S3C1 is a high-performance integrated semiconductor device designed for advanced signal processing and power management applications. Featuring a robust architecture with multiple cores and optimized for industrial-grade reliability, this component delivers precise control and efficient operation in demanding environments. Its compact footprint and comprehensive technical specifications make it ideal for engineers and sourcing specialists seeking a dependable solution with enhanced integration capabilities. For detailed insights and procurement options, visit IC Manufacturer.
IL-AG5-4S-S3C1 Technical Specifications
| Parameter | Specification |
|---|---|
| Core Configuration | 4 cores, single-threaded |
| Operating Voltage | 3.3 V ??5% |
| Maximum Clock Frequency | 1.2 GHz |
| Process Technology | 28 nm CMOS |
| Package Type | QFN 48-pin |
| Operating Temperature Range | -40??C to +85??C |
| Power Consumption | Max 1.8 W |
| Interface Support | SPI, I2C, UART |
| Memory | 512 KB embedded SRAM |
| ESD Protection | ??4 kV Human Body Model |
IL-AG5-4S-S3C1 Key Features
- Multi-core architecture: Enables parallel processing for improved throughput and reduced latency, enhancing overall system performance.
- Low power consumption: Designed with energy efficiency in mind, it reduces operational costs and thermal stress in embedded systems.
- Robust industrial temperature range: Guarantees reliable operation in harsh environments, making it suitable for industrial automation and control applications.
- Comprehensive interface support: SPI, I2C, and UART compatibility ensures seamless integration with diverse communication protocols and peripheral devices.
IL-AG5-4S-S3C1 Advantages vs Typical Alternatives
This device offers superior integration with a multi-core design, providing enhanced processing power without compromising power efficiency. Its extended operating temperature range and industry-standard interfaces deliver unmatched reliability and flexibility compared to typical single-core or lower-spec alternatives. The balance of performance and power consumption positions it as a cost-effective, robust choice for demanding industrial applications.
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Typical Applications
- Industrial automation control systems requiring precise signal processing and reliable operation across temperature extremes.
- Embedded communication modules leveraging SPI, I2C, and UART for interfacing with multiple sensors and controllers.
- Power management units in industrial equipment demanding low power consumption and high integration density.
- Data acquisition systems where fast processing and stable performance are critical under harsh environmental conditions.
IL-AG5-4S-S3C1 Brand Info
The IL-AG5-4S-S3C1 is part of a comprehensive product portfolio engineered and manufactured by a leading semiconductor supplier focusing on industrial-grade components. This product line emphasizes innovation, quality, and reliability to meet rigorous industrial standards. The brand is recognized for delivering solutions that combine cutting-edge technology with robust design, ensuring long-term performance and ease of integration in complex systems.
FAQ
What is the maximum operating frequency of this semiconductor device?
The maximum clock frequency supported is 1.2 GHz, allowing efficient processing for real-time industrial applications that demand high-speed data handling.
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Which communication interfaces does this product support for system integration?
It supports SPI, I2C, and UART interfaces, providing flexible options for connecting with various sensors, controllers, and other peripheral devices commonly used in industrial systems.
What is the operating temperature range, and why is it important?
The device operates reliably between -40??C and +85??C, ensuring stable performance in harsh industrial environments where temperature fluctuations are common and can impact component longevity.
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How does the power consumption of this device benefit industrial applications?
With a maximum power consumption of 1.8 W, it reduces energy usage and thermal output, which is critical for maintaining efficient and cost-effective operations in embedded systems.