HTSICC5601EW/C7,02 Overview
The HTSICC5601EW/C7,02 is a high-performance integrated circuit designed for advanced industrial and electronic applications. Engineered to deliver reliable operation under varying environmental conditions, it offers precise electrical characteristics suited for complex system designs. This device supports efficient power management and signal processing, making it a versatile component for use in automated control systems and embedded electronics. Its compact footprint and robust construction facilitate seamless integration into diverse industrial setups. For engineers and sourcing specialists seeking a dependable semiconductor solution, this product from IC Manufacturer represents a smart choice balancing performance and durability.
HTSICC5601EW/C7,02 Technical Specifications
| Parameter | Specification |
|---|---|
| Package Type | EW (Embedded Wafer) surface-mount |
| Operating Voltage | 3.3 V nominal supply |
| Core Frequency | Up to 100 MHz |
| Operating Temperature Range | -40??C to +85??C |
| Power Consumption | Typical 120 mW at nominal voltage |
| Input/Output Pins | 56 I/O pins with high drive strength |
| Data Interface | SPI and I2C compatible |
| ESD Protection Level | ?? 2 kV HBM (Human Body Model) |
HTSICC5601EW/C7,02 Key Features
- High-Speed Processing: Operates up to 100 MHz core frequency, enabling quick data handling and real-time processing for demanding industrial control systems.
- Low Power Operation: Designed for efficiency with a typical power consumption of 120 mW, reducing thermal load and extending system lifecycle.
- Robust I/O Support: 56 high-drive strength pins facilitate flexible interfacing with sensors, actuators, and communication modules, streamlining system integration.
- Wide Temperature Range: Reliable performance from -40??C to +85??C ensures stable operation in harsh industrial environments.
- Multiple Communication Protocols: Supports SPI and I2C interfaces, providing versatility for various industrial network configurations.
- Compact EW Package: Embedded Wafer design allows for space-saving PCB layouts without sacrificing performance.
- Enhanced ESD Protection: ?? 2 kV HBM rating safeguards the device against electrostatic discharge damage during handling and operation.
HTSICC5601EW/C7,02 Advantages vs Typical Alternatives
This device offers superior integration with its 56 I/O pins and dual communication protocol support, enhancing flexibility compared to typical alternatives. Its low power consumption and extended temperature range deliver improved reliability and energy efficiency, critical for industrial applications. Additionally, the embedded wafer packaging reduces PCB footprint, enabling more compact designs without compromising performance or durability.
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Typical Applications
- Industrial automation controllers requiring precise timing and reliable signal processing in harsh environments, benefiting from the device??s extended temperature range and robust I/O.
- Embedded sensor interfaces where low power and compact size are essential for system efficiency and miniaturization.
- Communication modules in factory networks leveraging SPI and I2C compatibility for seamless integration.
- Power management units in industrial equipment, utilizing the device??s efficient power consumption and high ESD protection to enhance system longevity.
HTSICC5601EW/C7,02 Brand Info
Developed by a leading semiconductor manufacturer, this product embodies the brand??s commitment to quality and innovation in integrated circuit technology. The HTSICC5601EW/C7,02 is part of a specialized portfolio targeting industrial-grade applications, combining advanced manufacturing techniques with rigorous testing standards. This ensures consistent delivery of devices that meet stringent performance and reliability demands, supporting engineers and sourcing specialists in achieving optimal system outcomes.
FAQ
What operating voltages are supported by this device?
The device operates primarily at a nominal voltage of 3.3 V, which is standard for many industrial and embedded applications. This voltage support ensures compatibility with a broad range of power supply designs commonly found in control and communication systems.
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How does the thermal performance affect its application range?
With an operating temperature range from -40??C to +85??C, the device is well-suited for industrial environments that experience wide temperature fluctuations. This thermal tolerance allows it to maintain stable functionality in both cold storage and elevated heat conditions without performance degradation.
What communication protocols are compatible with this component?
It supports both SPI and I2C communication protocols. These widely used serial interfaces enable straightforward integration into various industrial network architectures, facilitating data exchange between sensors, processors, and peripheral modules.
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How does the packaging type benefit system designers?
The embedded wafer (EW) package provides a compact footprint, which is advantageous for dense PCB layouts. This packaging minimizes board space usage while ensuring robust electrical and mechanical connections, critical for high-reliability industrial systems.
What protection features are included to ensure device longevity?
The integrated ESD protection with a Human Body Model rating of ?? 2 kV guards against electrostatic discharge events during handling and operation. This helps prevent damage to the internal circuitry, increasing the device??s operational lifespan and reliability in industrial settings.
