HSMY-C170 Overview
The HSMY-C170 is a precision semiconductor device designed for industrial and embedded applications requiring reliable performance and efficient power management. Featuring a robust architecture, it supports stable operation across a wide range of environmental conditions. This component integrates advanced functionality that enhances signal integrity and system responsiveness. Ideal for engineers and sourcing specialists, the device ensures seamless integration into complex systems, contributing to optimized design workflows. For detailed technical support and procurement options, visit IC Manufacturer.
HSMY-C170 Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage | 3.3 V ?? 5% |
| Operating Temperature Range | -40??C to +85??C |
| Input Signal Frequency | Up to 170 MHz |
| Power Consumption | Max 250 mW |
| Package Type | QFN-32 |
| Output Type | LVDS Differential |
| Jitter Performance | < 1 ps RMS |
| Supply Current | 75 mA Typical |
HSMY-C170 Key Features
- High-frequency operation: Supports input signal frequencies up to 170 MHz, enabling fast data processing essential for high-speed communication systems.
- Low power consumption: Consumes a maximum of 250 mW, which reduces thermal stress and enhances energy efficiency in embedded designs.
- Robust temperature tolerance: Operates reliably from -40??C to +85??C, ensuring stable performance in harsh industrial environments.
- Low jitter output: Less than 1 ps RMS jitter maintains signal fidelity, critical for applications demanding precise timing and synchronization.
HSMY-C170 Advantages vs Typical Alternatives
This device offers superior power efficiency and jitter performance compared to typical alternatives in its class. Its wide operating temperature range ensures reliability under diverse environmental conditions. The combination of LVDS differential output and a compact QFN-32 package facilitates easy integration with minimal signal loss, improving overall system accuracy and operational stability.
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Typical Applications
- High-speed data communication systems where precise timing and low jitter are essential for signal integrity and transmission reliability.
- Industrial automation equipment requiring components that withstand extended temperature ranges and maintain consistent performance.
- Embedded systems demanding low power consumption to extend operational life and reduce heat generation.
- Signal processing units in measurement and control devices where accurate frequency handling enhances overall system responsiveness.
HSMY-C170 Brand Info
The HSMY-C170 is a product of a leading industrial semiconductor manufacturer specializing in high-quality integrated circuits for demanding applications. This device embodies the brand??s commitment to precision engineering, durability, and innovation. Designed for seamless integration, it supports a broad spectrum of industries including communications, automation, and embedded electronics. Backed by comprehensive technical support, the product aligns with the manufacturer??s standards for performance and reliability.
FAQ
What is the typical power consumption of this device during operation?
The device typically consumes around 250 mW during operation, enabling efficient power management and reducing thermal load in system designs.
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Can this component operate reliably in extreme temperature conditions?
Yes, it is rated for operation between -40??C and +85??C, making it suitable for harsh industrial environments where temperature fluctuations are common.
What type of output signal does it provide?
It delivers LVDS differential output signals, which are beneficial for maintaining signal integrity over longer transmission lines and minimizing noise interference.
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How does the jitter performance impact system applications?
With jitter under 1 ps RMS, the device ensures highly stable timing signals, which is critical for precise synchronization in communication and data processing systems.
What packaging options are available for this product?
This device comes in a compact QFN-32 package, facilitating easy PCB integration and contributing to space-saving designs without compromising thermal performance.
