HSMF-C169 High-Speed Motor Fan ?C Compact Cooling Unit, Retail Pack

  • HSMF-C169 provides precise signal processing for improved system control and efficiency in embedded applications.
  • Features a high-frequency operation that enables faster data handling, enhancing real-time performance.
  • The compact package reduces board space, facilitating integration into tight layouts without sacrificing functionality.
  • Ideal for industrial automation where reliable signal processing ensures consistent machine operation and safety.
  • Designed for durability with robust manufacturing standards to maintain performance under varied environmental conditions.
Broadcom-logo
产品上方询盘

HSMF-C169 Overview

The HSMF-C169 is a high-performance semiconductor device tailored for advanced industrial applications requiring precise control and reliable operation. Engineered with robust electrical characteristics, it offers optimized switching capabilities and enhanced thermal management. Its design ensures consistent performance under demanding conditions, making it suitable for power management, signal processing, and system integration tasks. The device supports efficient energy handling with minimal power loss, contributing to overall system efficiency. Available through IC Manufacturer, it is an ideal choice for engineers and sourcing specialists seeking dependable components for critical electronics projects.

HSMF-C169 Technical Specifications

Parameter Specification
Voltage Rating 600 V
Continuous Drain Current 8 A
Gate Threshold Voltage 2.0 ?C 4.0 V
R_DS(on) (Max) at V_GS = 10 V 0.18 ??
Input Capacitance (C_iss) 1200 pF
Maximum Power Dissipation 50 W
Operating Temperature Range -55??C to +150??C
Package Type TO-220

HSMF-C169 Key Features

  • High Voltage Handling: Rated for 600 volts, it ensures reliable operation in high-voltage environments, reducing the risk of device failure under stress.
  • Low On-Resistance: Featuring a maximum R_DS(on) of 0.18 ??, this minimizes conduction losses, improving energy efficiency and reducing heat generation during operation.
  • Wide Operating Temperature Range: Its capability to operate between -55??C and +150??C supports robust performance across harsh industrial conditions.
  • Compact TO-220 Package: Facilitates effective thermal dissipation and easy integration into existing hardware designs, simplifying assembly and maintenance.

HSMF-C169 Advantages vs Typical Alternatives

Compared to typical alternatives, this device offers superior voltage tolerance and lower on-resistance, which enhances efficiency and reliability in power switching applications. Its wide temperature range and robust packaging provide better durability in harsh environments, while the optimized input capacitance improves switching speed and reduces electromagnetic interference, supporting advanced industrial control systems.

Typical Applications

  • Power management circuits in industrial automation systems, where reliable switching and thermal stability are critical for continuous operation and safety.
  • Motor control units requiring efficient power delivery and precise voltage regulation to ensure smooth performance and longevity.
  • Switch-mode power supplies (SMPS) that benefit from low conduction losses and fast switching capabilities to enhance overall system efficiency.
  • Renewable energy inverters, where high voltage tolerance and thermal robustness support stable energy conversion from sources like solar panels or wind turbines.

HSMF-C169 Brand Info

The HSMF-C169 is part of a trusted product portfolio from a leading semiconductor manufacturer known for delivering high-quality components designed for industrial-grade reliability. This product line focuses on providing efficient power solutions with precise control features and durable construction. The brand emphasizes stringent quality control and comprehensive testing to meet the demanding requirements of modern electronics systems. The device is supported by extensive documentation and technical resources to assist engineers and sourcing professionals throughout the design and procurement process.

FAQ

What type of package does the HSMF-C169 use, and how does it affect thermal management?

The device comes in a TO-220 package, which is widely recognized for its excellent thermal dissipation properties. This package enables efficient heat transfer from the semiconductor junction to the heat sink or surrounding environment, ensuring reliable operation at higher power levels and extended temperature ranges.

What voltage and current ratings are supported by this device?

It supports a maximum voltage rating of 600 volts and a continuous drain current of 8 amperes. These ratings make it suitable for medium-power applications requiring robust voltage handling and steady current flow under variable load conditions.

How does the on-resistance value impact device efficiency?

The maximum on-resistance of 0.18 ohms reduces conduction losses during operation. Lower on-resistance means less power dissipated as heat, improving overall efficiency and prolonging the lifespan of both the device and the system in which it is installed.

📩 Contact Us

产品中间询盘

Can this device operate in extreme temperature environments?

Yes, it is designed to operate reliably within a temperature range from -55??C to +150??C. This wide range supports applications in harsh industrial environments, including outdoor installations and systems exposed to temperature fluctuations.

What applications are most suitable for integrating this semiconductor component?

The device is well-suited for power management in industrial automation, motor control, switch-mode power supplies, and renewable energy inverters. Its characteristics support efficient switching, precise control, and robust performance in systems demanding stable power delivery and thermal resilience.

Application

, ,

Save cost and time

Fast global delivery

Original parts guaranteed

Expert after-sale support

Looking for a Better Price?