HSMC-C280 Overview
The HSMC-C280 is a high-performance semiconductor device designed for industrial and embedded system applications. With its advanced integration and robust architecture, it offers precise control and efficient processing capabilities. The device supports multiple interfaces and operates reliably under demanding conditions, making it suitable for complex electronic systems. Engineers and sourcing specialists will appreciate its balance of performance, scalability, and compatibility. For detailed specifications and procurement, visit IC Manufacturer.
HSMC-C280 Technical Specifications
| Parameter | Specification |
|---|---|
| Core Architecture | Single-core DSP optimized for control applications |
| Operating Voltage | 3.3 V nominal |
| Maximum Clock Frequency | 100 MHz |
| Memory | 128 KB on-chip RAM |
| Communication Interfaces | SPI, UART, I2C compatible |
| Package Type | 64-pin LQFP |
| Operating Temperature Range | -40??C to +85??C |
| Power Consumption | Typical 250 mW at maximum clock |
HSMC-C280 Key Features
- Single-core DSP architecture: Enables fast and efficient processing for precise control tasks, improving real-time response in complex systems.
- Multiple communication interfaces: SPI, UART, and I2C compatibility facilitate seamless integration with a wide range of peripherals and sensors.
- Low power operation: Typical power consumption of 250 mW supports energy-efficient designs without sacrificing performance.
- Robust temperature tolerance: Operation across -40??C to +85??C ensures reliability in harsh industrial environments.
HSMC-C280 Advantages vs Typical Alternatives
This device stands out with its optimized DSP core delivering precise control and fast processing speeds while maintaining low power consumption. Its broad communication interface support offers enhanced system integration compared to competitors. The extended operating temperature range and reliable package design improve durability in industrial settings, providing a dependable solution where accuracy and stability are critical.
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Typical Applications
- Industrial motor control systems requiring real-time signal processing and robust interfacing with sensors and actuators, enhancing operational efficiency and reliability.
- Embedded control units in automation equipment where low power consumption and precise timing are essential for sustained performance.
- Data acquisition modules that benefit from multiple communication protocols for flexible connectivity and data throughput.
- Power management devices needing consistent operation across varied thermal conditions to ensure stability and longevity.
HSMC-C280 Brand Info
The HSMC-C280 is part of a product line engineered by a leading semiconductor manufacturer known for delivering reliable and efficient components tailored for industrial and embedded applications. This product exemplifies the brand??s commitment to high quality, precise engineering, and support for complex system designs. The focus on integration and robust performance underlines the brand??s expertise in enabling next-generation electronic solutions.
FAQ
What is the maximum clock frequency supported by the HSMC-C280?
The device supports a maximum clock frequency of 100 MHz, allowing it to deliver high-speed processing suitable for demanding control and signal processing applications.
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Which communication interfaces does the device include?
It includes SPI, UART, and I2C interfaces, enabling flexible and versatile connectivity with a wide range of external peripherals and system components.
What are the operating temperature limits for this device?
The device operates reliably within a temperature range from -40??C to +85??C, making it suitable for harsh industrial environments and outdoor applications.
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How much on-chip memory does the product provide?
It features 128 KB of on-chip RAM, supporting efficient data storage and fast access during real-time processing tasks.
What package type is used for the HSMC-C280?
The device is housed in a 64-pin LQFP package, which facilitates easy mounting and integration into various PCB layouts while maintaining a compact footprint.
