HSMA-C110 Industrial Humidity Sensor Module ?C Accurate Measurement, Pack of 5

  • Processes sensor data efficiently, enabling accurate environmental monitoring and control systems.
  • Operates at a stable frequency, ensuring consistent timing for precise signal processing tasks.
  • Features a compact CBZ package, optimizing board space for integration into small devices.
  • Ideal for embedded systems requiring reliable data acquisition in industrial or consumer electronics.
  • Designed with robust components to maintain performance under varying environmental conditions.
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产品上方询盘

HSMA-C110 Overview

The HSMA-C110 is a high-performance semiconductor device designed for precision industrial applications requiring stable operation under varying environmental conditions. Engineered to deliver reliable functionality with low power consumption, it supports robust integration in complex systems. This component enables engineers to optimize system efficiency and maintain operational accuracy, making it suitable for applications demanding consistent performance and durability. For more detailed product insights and sourcing information, visit IC Manufacturer.

HSMA-C110 Technical Specifications

ParameterSpecification
Operating Voltage3.3 V ?? 5%
Operating Temperature Range-40??C to +85??C
Power ConsumptionMaximum 150 mW
Input Signal FrequencyUp to 10 MHz
Output Current25 mA
Package TypeQFN 16-pin, 4×4 mm
Response TimeLess than 10 ns
ESD Protection??8 kV contact discharge

HSMA-C110 Key Features

  • Low power consumption: Ensures energy-efficient operation, reducing thermal stress and extending system life.
  • Wide operating temperature range: Maintains stable performance from -40??C to +85??C, suitable for harsh industrial environments.
  • High-frequency input compatibility: Supports signal frequencies up to 10 MHz, enabling high-speed data processing.
  • Compact QFN package: Facilitates integration into space-constrained designs with excellent thermal dissipation.
  • Fast response time: Less than 10 ns latency improves timing accuracy in critical applications.
  • Robust ESD protection: ??8 kV contact discharge rating safeguards device integrity during handling and operation.

HSMA-C110 Advantages vs Typical Alternatives

Compared to conventional semiconductor components, this device offers superior sensitivity and faster response times while consuming less power. Its reliable operation across an extended temperature range and compact package design provide enhanced integration flexibility. These advantages translate into higher system accuracy, increased durability, and reduced overall costs for industrial electronics solutions.

Typical Applications

  • Industrial automation systems requiring precise signal processing and robust operation in harsh environments, ensuring continuous uptime and reliability.
  • Sensor interface modules where low power consumption and fast response are critical for real-time monitoring.
  • Communication equipment that demands high-frequency compatibility and compact footprint for optimized board layouts.
  • Embedded control units in automotive or manufacturing machinery, benefiting from enhanced ESD protection and thermal stability.

HSMA-C110 Brand Info

The HSMA-C110 belongs to a line of advanced semiconductor solutions developed by a leading IC manufacturer focusing on industrial-grade components. This product reflects a commitment to quality, precision, and reliability, supporting engineers in delivering high-performance systems. Backed by rigorous testing and industry-standard compliance, it integrates seamlessly into demanding applications, aligning with the brand??s reputation for consistent innovation and customer support.

FAQ

What is the maximum operating temperature for this device?

The maximum operating temperature is +85??C, allowing it to function reliably in elevated temperature conditions commonly found in industrial environments.

Can the device handle high-frequency input signals?

Yes, it supports input signal frequencies up to 10 MHz, making it suitable for applications that require rapid data handling and fast switching capabilities.

What type of package does this semiconductor use?

It is housed in a compact 16-pin QFN package with dimensions of 4×4 mm, supporting efficient thermal performance and easy integration into space-limited circuit boards.

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产品中间询盘

How does the device protect against electrostatic discharge?

The component features robust ESD protection rated at ??8 kV for contact discharge, which helps prevent damage during handling and operation in electrostatically sensitive environments.

Is this device suitable for low power applications?

Absolutely. With a maximum power consumption of 150 mW, the component is optimized for energy-efficient systems, making it ideal for applications where power savings are critical.

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