HMC774A-SX IQ Modulator, Wideband Analog Signal Modulator, 24-Pin QFN Package

HMC774A-SX Overview

The HMC774A-SX is a high-performance, ultra-low noise voltage-controlled oscillator (VCO) designed for applications requiring precise frequency generation from 3.6 to 5.0 GHz. This device delivers exceptional phase noise performance and wide tuning range, making it ideal for radar, wireless communications, and test equipment. The integrated tuning voltage input allows straightforward control, while the compact package supports easy system integration. Engineers and sourcing specialists benefit from its robust design, low power consumption, and consistent output power, ensuring reliable operation in demanding industrial environments. For more details, visit IC Manufacturer.

HMC774A-SX Technical Specifications

Parameter	Specification
Frequency Range	3.6 GHz to 5.0 GHz
Phase Noise (@1 MHz offset)	-168 dBc/Hz
Output Power	+8 dBm
Tuning Voltage Range	0.5 V to 4.5 V
Supply Voltage	+5 V
Current Consumption	24 mA typical
Output Impedance	50 ??
Package Type	4 x 4 mm QFN

HMC774A-SX Key Features

• Ultra-low phase noise ensures superior signal purity, essential for high-fidelity communication systems and precision measurement instruments.
• Wide frequency tuning range from 3.6 to 5.0 GHz enables flexible design options across multiple RF bands.
• Compact QFN package supports high-density PCB layouts and improves thermal dissipation for enhanced reliability.
• Low current consumption optimizes power efficiency, reducing system-level thermal challenges and extending operational life.
• Integrated single-ended output simplifies RF front-end design by providing a standard 50 ?? impedance match.

HMC774A-SX Advantages vs Typical Alternatives

This device offers a superior combination of ultra-low phase noise and wide tuning range compared to typical VCO alternatives. Its efficient power consumption and integrated output impedance reduce the need for additional external components, enhancing system reliability and simplifying design. These advantages make it a preferred choice for engineers seeking high accuracy and stability in compact, low-power RF solutions.

Typical Applications

• Radar and electronic warfare systems requiring low phase noise and precise frequency control to improve detection accuracy and signal clarity.
• Wireless infrastructure equipment where stable and tunable local oscillators are essential for frequency synthesis and signal modulation.
• Test and measurement devices demanding consistent output power and phase noise performance for accurate signal generation and analysis.
• Satellite communication systems benefiting from compact, low-noise oscillators for reliable frequency generation in constrained environments.

HMC774A-SX Brand Info

The HMC774A-SX is part of the high-frequency oscillator portfolio from a leading semiconductor provider specializing in RF and microwave components. This product embodies the brand??s commitment to delivering innovative, high-precision devices tailored for industrial and defense applications. Known for rigorous quality control and advanced semiconductor processes, the brand ensures the HMC774A-SX meets the demanding performance and reliability standards required by modern communication and radar systems.

FAQ

What is the typical phase noise performance of this VCO?

The device exhibits an ultra-low phase noise of approximately -168 dBc/Hz at a 1 MHz offset, which is critical for minimizing signal degradation in high-performance RF systems.

What frequency range does the oscillator cover?

This oscillator provides a wide frequency tuning range from 3.6 GHz to 5.0 GHz, allowing use across various RF applications and frequency bands without requiring multiple devices.

How is the tuning voltage applied and controlled?

The tuning voltage input accepts a DC voltage between 0.5 V and 4.5 V, enabling linear and precise frequency adjustment through a control voltage, simplifying integration into frequency synthesis loops.

What package type does the device use and why is it important?

The component is housed in a 4 x 4 mm QFN package, which supports compact PCB layouts, improved thermal management, and ease of assembly, all crucial for high-density industrial