HL3P-BR60-J00DD Overview
The HL3P-BR60-J00DD is a precision semiconductor module designed for industrial applications requiring robust performance and reliable operation. Engineered with advanced technology, this device offers excellent signal integrity and efficient power management. Its compact form factor and optimized electrical characteristics enable seamless integration into complex systems. Ideal for engineers and sourcing specialists, the module supports demanding environments with stable operation and consistent output. For detailed technical support and procurement, visit IC Manufacturer.
HL3P-BR60-J00DD Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage | 3.3 V ?? 10% |
| Operating Temperature Range | -40??C to +85??C |
| Maximum Current | 60 mA |
| Package Type | Surface-mount, 8-pin SOIC |
| Signal Type | Digital Input/Output |
| Switching Frequency | Up to 1 MHz |
| Power Dissipation | 150 mW |
| ESD Protection | 2 kV Human Body Model |
| Storage Temperature | -55??C to +125??C |
HL3P-BR60-J00DD Key Features
- High switching frequency: Supports up to 1 MHz operation, enabling fast signal processing for time-sensitive applications.
- Wide operating temperature range: Reliable performance from -40??C to +85??C ensures stability in harsh industrial environments.
- Low power dissipation: Consumes only 150 mW, enhancing energy efficiency and reducing thermal management requirements.
- Compact SOIC package: Facilitates easy PCB layout and integration into space-constrained designs.
- Robust ESD protection: Withstands up to 2 kV Human Body Model, improving device reliability during handling.
HL3P-BR60-J00DD Advantages vs Typical Alternatives
This module offers superior integration and reliability compared to typical alternatives. Its low power consumption and high switching frequency provide efficient performance without compromising signal accuracy. The robust ESD protection and wide operating temperature range ensure dependable operation in industrial settings where environmental stresses are common. These advantages make it a preferred choice for engineers seeking durable and precise semiconductor solutions.
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Typical Applications
- Industrial control systems: Ideal for signal switching and processing in automated manufacturing and process control equipment, ensuring precise and stable operation.
- Embedded microcontroller interfaces: Provides reliable digital input/output support for embedded systems with limited power budgets.
- Communication equipment: Suitable for signal conditioning and high-frequency switching in telecommunication modules.
- Instrumentation and measurement devices: Enables accurate signal handling in sensor interfaces and data acquisition systems.
HL3P-BR60-J00DD Brand Info
This product is part of the HL3P series, known for its high-quality semiconductor devices tailored for industrial and commercial applications. The brand emphasizes precision engineering, rigorous quality control, and user-focused design to meet the demanding needs of modern electronics. The HL3P-BR60-J00DD module reflects this commitment through its reliable performance and adherence to industry standards, making it a trusted component for engineers and sourcing specialists worldwide.
FAQ
What is the maximum operating temperature for this device?
The device operates reliably within a temperature range from -40??C up to +85??C, making it suitable for most industrial environments that experience wide temperature variations.
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What type of package does this module use?
It comes in an 8-pin Surface-mount SOIC package, which allows for efficient PCB space usage and compatibility with automated assembly processes.
How does the power dissipation of this device impact system design?
With a power dissipation of only 150 mW, this module generates minimal heat, reducing the need for complex cooling solutions and enhancing overall system energy efficiency.
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Is the device protected against electrostatic discharge (ESD)?
Yes, it features ESD protection rated at 2 kV according to the Human Body Model, which safeguards the device during handling and assembly, improving long-term reliability.
What are the typical applications where this device can be used?
This module is commonly used in industrial control systems, embedded microcontroller interfaces, communication equipment, and instrumentation devices due to its reliable digital switching capabilities and robust design.
