HEDB-9140-I13 High-Speed Data Encoder Module ?C Compact Plug-and-Play Package

  • Processes digital signals efficiently, enabling precise control and data handling in embedded systems.
  • Features a high-speed clock input that supports rapid data processing for time-sensitive applications.
  • Designed with a compact CBZ package to optimize board space and simplify hardware integration.
  • Ideal for industrial automation, improving system responsiveness and reducing operational delays.
  • Manufactured under strict quality standards to ensure consistent performance and long-term reliability.
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产品上方询盘

HEDB-9140-I13 Overview

The HEDB-9140-I13 is a high-performance semiconductor device designed for industrial-grade applications requiring reliable operation under demanding conditions. It offers a robust combination of precision, efficiency, and integration flexibility, making it ideal for engineers and sourcing specialists focused on optimizing system performance. With a focus on durability and accuracy, this product supports a wide range of industrial electronics solutions. For detailed product sourcing and technical support, visit IC Manufacturer.

HEDB-9140-I13 Technical Specifications

Parameter Specification
Operating Voltage 3.3 V ??5%
Output Type Open Drain
Input Current Max 20 mA
Switching Frequency Up to 40 MHz
Operating Temperature Range -40??C to +125??C
Package Type SMD ?C 8 Pin SOIC
Propagation Delay Max 8 ns
Power Dissipation Max 500 mW

HEDB-9140-I13 Key Features

  • High-speed switching capability: Enables fast signal processing, improving overall system responsiveness for industrial control applications.
  • Wide operating temperature range: Supports reliable operation in harsh environments, critical for outdoor or industrial settings.
  • Low power consumption: Enhances energy efficiency, reducing operational costs and thermal management requirements.
  • Compact SMD package: Facilitates easy PCB integration and space-saving designs without compromising performance.

HEDB-9140-I13 Advantages vs Typical Alternatives

This device offers superior switching speed and extended temperature tolerance compared to typical alternatives, ensuring enhanced accuracy and reliability. Its low power draw supports energy-efficient designs, while the open drain output offers flexible interfacing options. These advantages combine to deliver a robust semiconductor solution tailored for demanding industrial applications.

Typical Applications

  • Industrial automation systems requiring fast and reliable switching with consistent performance across temperature extremes.
  • Power management circuits benefiting from low power consumption and compact package size.
  • Signal conditioning modules where precise timing and low propagation delay are critical.
  • Embedded control units needing robust components for high-density PCB layouts.

HEDB-9140-I13 Brand Info

The HEDB-9140-I13 is part of a trusted lineup of semiconductor products from a leading IC manufacturer known for quality and innovation in industrial electronics. This product emphasizes durability and precise performance, reflecting the brand??s commitment to supporting engineers with reliable, high-efficiency solutions tailored for complex industrial environments.

FAQ

What is the typical operating voltage for this device?

The device operates optimally at 3.3 volts with a tolerance of ??5%, ensuring stable performance within standard industrial voltage levels.

Can this product handle extreme temperatures?

Yes, it supports an operating temperature range from -40??C to +125??C, making it suitable for harsh industrial and outdoor applications.

What type of output configuration does it use?

The device features an open drain output, which allows for flexible interfacing with various load types and signal levels in complex circuits.

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产品中间询盘

How does the switching frequency impact application performance?

With switching frequencies up to 40 MHz, the device enables rapid signal transitions, which is essential for high-speed data processing and control systems.

Is the package suitable for modern PCB designs?

Its compact 8-pin SOIC surface-mount package supports high-density PCB layouts, aiding in space-saving and efficient circuit design integration.

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