HB01P016PZ2 High-Performance Power Module – Compact Package

HB01P016PZ2 Overview

The HB01P016PZ2 is a high-performance semiconductor device designed for industrial and embedded system applications requiring reliable data storage and efficient memory management. This product offers a 16Mb memory capacity with fast access times, ensuring smooth operation in demanding environments. Engineered with robust architecture, it supports a wide voltage range and temperature tolerance, making it ideal for harsh operating conditions. Its compact footprint and optimized power consumption enable seamless integration into space-constrained designs without compromising performance. The HB01P016PZ2 is a trusted solution for engineers and sourcing specialists seeking durable, high-quality memory components. For more details, visit IC Manufacturer.

HB01P016PZ2 Technical Specifications

HB01P016PZ2 Key Features

• High-density 16Mb memory: Enables substantial data storage capacity for embedded applications, reducing the need for additional memory components.
• Wide voltage range support: Operates efficiently between 2.7 V and 3.6 V, ensuring compatibility with various industrial power supply standards.
• Fast 70 ns access time: Delivers rapid data retrieval, enhancing system responsiveness and throughput.
• Robust temperature tolerance: Functions reliably across -40 ??C to +85 ??C, suitable for harsh industrial and automotive environments.
• Durable endurance: Sustains up to 100,000 program/erase cycles, providing long-term reliability in frequent update applications.
• Compact 48-pin TSOP package: Facilitates high-density PCB layouts and streamlined integration in space-limited designs.
• Parallel NOR Flash interface: Ensures straightforward connectivity with standard microcontrollers and processors.

HB01P016PZ2 Advantages vs Typical Alternatives

This device offers superior data retention and endurance compared to typical memory solutions, making it ideal for industrial-grade applications. Its wide operating voltage range and temperature tolerance provide enhanced reliability in challenging environments. The fast access time and compact package improve system efficiency and integration, reducing design complexity and cost while maintaining consistent performance.

Typical Applications

• Embedded systems memory: Provides reliable non-volatile storage for firmware and data in microcontroller-based devices, ensuring stable operation in industrial controls and automation equipment.
• Automotive electronics: Suitable for use in automotive control units where temperature resilience and data integrity are critical.
• Consumer electronics: Supports firmware storage in devices requiring compact, high-speed memory modules.
• Industrial instrumentation: Enables robust data logging and system monitoring in harsh environmental conditions.

HB01P016PZ2 Brand Info

The HB01P016PZ2 is a product from a reputable IC manufacturer specializing in advanced semiconductor memory solutions. Known for quality and innovation, the brand delivers components tailored for demanding industrial and embedded applications. This product exemplifies the company??s commitment to durability, performance, and seamless integration, providing engineers and sourcing professionals with dependable building blocks for their designs.

FAQ

What is the primary memory type used in this device?

The device utilizes Parallel NOR Flash memory, known for fast read speeds and reliable non-volatile data storage, making it suitable for firmware and code execution in embedded systems.

Can the device operate in extreme temperature environments?

Yes, it supports an operating temperature range from -40 ??C to +85 ??C, ensuring stable performance in automotive and industrial applications where temperature conditions vary significantly