CYW89570DCFFBG Overview
The CYW89570DCFFBG is a high-performance IC designed for demanding industrial and commercial applications, offering robust wireless connectivity and advanced integration capabilities. Engineered to deliver reliable performance, this device supports multiple interface standards, making it suitable for complex environments where seamless data communication is critical. Its compact BGA package ensures flexible design options and efficient board utilization. For engineers and sourcing professionals seeking a versatile, cost-effective solution, the CYW89570DCFFBG delivers the combination of high integration, efficiency, and robust operation required in today??s fast-evolving electronic systems. Learn more at IC Manufacturer.
CYW89570DCFFBG Technical Specifications
| Parameter | Value |
|---|---|
| Part Number | CYW89570DCFFBG |
| Mounting Type | Surface Mount |
| Package / Case | 196-BGA |
| Operating Temperature Range | -40??C to +85??C |
| Interface | PCIe, USB |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | MSL3 (168 Hours) |
| ECCN Code | 5A002.a.1 |
| ECCN Subcategory | Encryption |
CYW89570DCFFBG Key Features
- Multi-interface support (PCIe and USB) enables flexible integration into a wide range of system architectures, simplifying design and speeding up time-to-market.
- Wide operating temperature range of -40??C to +85??C provides dependable performance in harsh industrial and commercial environments.
- Compact 196-BGA package allows for higher PCB density and space-saving layouts, essential for modern, miniaturized devices.
- ROHS3 compliance ensures adherence to stringent environmental and safety standards, supporting sustainability initiatives.
- MSL3 classification (168 hours) supports secure storage and handling during assembly, reducing production risks.
- Encryption-enabled with ECCN code 5A002.a.1, making it suitable for secure wireless communications where data protection is critical.
CYW89570DCFFBG Advantages vs Typical Alternatives
Compared to standard connectivity ICs, this device offers a unique blend of advanced interface flexibility and robust environmental tolerance. Its wide temperature range, compact BGA packaging, and ROHS3 compliance provide distinct benefits for engineers designing reliable, space-efficient, and environmentally responsible systems. The built-in encryption capabilities also make it a stronger choice for applications demanding secure wireless data transfer and regulatory compliance, outperforming less secure or less integrated alternatives.
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Typical Applications
- Industrial automation systems where reliable wireless communication and robust environmental resistance are essential for process control, monitoring, and data acquisition in harsh conditions.
- Commercial network equipment requiring secure data transfer and multi-interface support for seamless integration with existing infrastructure.
- Consumer electronic devices that benefit from compact, high-density PCB layouts enabled by the 196-BGA package form factor.
- IoT gateways and edge computing nodes demanding encryption and stable operation across a broad temperature range for secure, always-on connectivity in remote deployments.
CYW89570DCFFBG Brand Info
The CYW89570DCFFBG is a specialized product designed to meet the rigorous demands of modern connectivity and data security. Manufactured in compliance with ROHS3 standards and equipped with advanced encryption features, this device is tailored for applications that require both reliability and robust security. Its combination of multi-interface compatibility, compact packaging, and industrial-grade temperature support makes it a preferred choice for OEMs and system integrators seeking a versatile, future-proof connectivity component.
FAQ
What is the operating temperature range for the CYW89570DCFFBG?
This component is rated for operation from -40??C to +85??C, making it suitable for deployment in both industrial and commercial environments that face significant thermal variations during operation.
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Which interfaces are supported by this device?
The device supports both PCIe and USB interfaces, providing design flexibility and enabling straightforward integration into various system platforms that require high-speed data transfer.
What packaging format is used?
It comes in a compact 196-BGA (Ball Grid Array) package, which is ideal for high-density PCB layouts and allows for efficient use of board space in modern, miniaturized electronic products.
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Does the CYW89570DCFFBG support environmental compliance?
Yes, it is ROHS3 compliant, ensuring that it meets current environmental and safety standards and supports manufacturers?? sustainability and regulatory objectives.
Is this device suitable for secure communication applications?
Absolutely. With ECCN code 5A002.a.1 and a focus on encryption, this device is well-suited for secure wireless data transfer, making it a strong choice for applications where data protection is paramount.
