CYW89550BUBGTXTMA1 Overview
The CYW89550BUBGTXTMA1 is a highly integrated wireless communication IC designed for advanced connectivity applications. Engineered for robust, high-performance wireless transmission, this component offers a compact solution for demanding industrial and commercial environments. Its advanced feature set supports reliable operation and ease of integration into complex systems. By combining multiple wireless functions within a single package, it simplifies board design and helps reduce bill-of-materials costs. For more technical details or sourcing needs, visit IC Manufacturer.
CYW89550BUBGTXTMA1 Technical Specifications
| Parameter | Value |
|---|---|
| Manufacturer Part Number | CYW89550BUBGTXTMA1 |
| Product Category | RF Integrated Circuits |
| Package / Case | UBGA-156 |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40??C to +85??C |
| RoHS Status | RoHS Compliant |
| Number of Pins | 156 |
| Function | Wireless Communication IC |
CYW89550BUBGTXTMA1 Key Features
- Highly integrated wireless communication capabilities, enabling efficient space utilization and streamlined circuit board layouts.
- Industrial temperature range supports reliable operation in harsh environmental conditions, ensuring system stability and longevity.
- Surface mount technology in a UBGA-156 package, simplifying automated assembly and reducing manufacturing complexity for large-scale production.
- RoHS compliance ensures environmentally responsible component selection and supports global regulatory requirements.
CYW89550BUBGTXTMA1 Advantages vs Typical Alternatives
This wireless communication IC stands out due to its compact UBGA-156 package and surface mount design, which facilitate streamlined assembly and board space savings. The industrial-grade temperature range delivers consistent reliability in demanding environments. RoHS compliance also aligns with sustainability targets, making it a future-ready choice compared to less integrated or limited-temperature alternatives.
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Typical Applications
- Industrial wireless communication modules: Ideal for integration within factory automation, process control, and industrial networking equipment, thanks to its robust operating temperature range and compact form factor.
- Commercial IoT gateways: Enables high-performance wireless connectivity in gateway devices used for building automation, smart retail, and logistics systems.
- Embedded systems requiring secure wireless links: Supports embedded designs where reliable data transmission and compact component selection are critical.
- Consumer electronics with advanced connectivity: Suitable for use in products demanding reliable, integrated wireless solutions within space-constrained designs.
CYW89550BUBGTXTMA1 Brand Info
The CYW89550BUBGTXTMA1 represents an advanced offering from a trusted semiconductor manufacturer, focusing on wireless communication solutions for industrial and commercial markets. This product is engineered to meet the demands of modern connectivity, offering a high degree of integration and reliability. Its UBGA-156 package and surface mount compatibility make it suitable for high-density applications, while its compliance with global standards demonstrates a commitment to quality and environmental stewardship.
FAQ
What type of applications is the CYW89550BUBGTXTMA1 best suited for?
This IC is best suited for industrial, commercial, and embedded systems that require robust wireless communication. Its wide operating temperature range and compact package make it particularly effective in applications where reliability and space efficiency are key considerations.
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Is the CYW89550BUBGTXTMA1 compliant with environmental regulations?
Yes, this wireless communication IC is RoHS compliant, ensuring that it meets current global environmental and material safety regulations. This makes it suitable for use in products destined for international markets with stringent compliance requirements.
What are the primary benefits of the UBGA-156 package?
The UBGA-156 package offers a highly compact footprint, enabling manufacturers to maximize board space and achieve denser PCB layouts. This supports the development of smaller, more efficient end products and simplifies automated assembly processes.
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Does the CYW89550BUBGTXTMA1 support operation in harsh environments?
Yes, with its specified operating temperature range of -40??C to +85??C, this IC is built to perform reliably in both standard and demanding industrial environments, supporting applications that face wide temperature fluctuations.
What mounting method is recommended for this device?
The recommended mounting method is surface mount technology, which is compatible with automated pick-and-place equipment. This ensures efficient, repeatable, and cost-effective assembly for high-volume manufacturing processes.
