CYW88570CFFBG Overview
The CYW88570CFFBG is a highly integrated wireless connectivity solution designed for industrial and commercial electronics that require robust, high-performance wireless communication. Engineered as a system-on-chip (SoC), this advanced device supports a wide range of wireless protocols and offers reliable operation for demanding applications. Its feature-rich design enables seamless integration into compact systems, making it an ideal choice for engineers seeking a dependable solution for wireless networking, IoT, and embedded applications. For more details, visit IC Manufacturer.
CYW88570CFFBG Technical Specifications
| Parameter | Value |
|---|---|
| Part Number | CYW88570CFFBG |
| Device Type | Wireless SoC |
| Package | FBGA-143 |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40??C to 85??C |
| Supply Voltage | 3.3V |
| Protocol Support | Wireless (details per datasheet) |
| Pin Count | 143 |
| RoHS Status | Compliant |
CYW88570CFFBG Key Features
- Highly integrated wireless system-on-chip, simplifying board design and reducing external component count for streamlined development.
- Surface mount FBGA-143 package enables compact layouts, saving PCB space and supporting miniaturized product designs.
- Wide operating temperature range from -40??C to 85??C ensures reliability and consistent performance in industrial and harsh environments.
- RoHS compliant construction makes it suitable for global electronics manufacturing and environmentally conscious applications.
CYW88570CFFBG Advantages vs Typical Alternatives
Compared to many standard wireless SoCs, this device offers superior integration and a robust temperature range, making it suitable for industrial-grade products. The compact FBGA-143 package and consistent RoHS compliance provide reliable performance with minimized footprint, enhancing flexibility for system designers over typical alternatives.
🔥 Best-Selling Products
Typical Applications
- Industrial wireless networking: Enables reliable, high-speed wireless connectivity in factory automation, process control, and sensor networks, supporting harsh operating conditions and long-term deployment.
- Internet of Things (IoT) gateways: Acts as the core wireless interface in intelligent gateways, aggregating sensor and control data for smart building and infrastructure solutions.
- Embedded communication modules: Integrates into compact embedded systems, delivering robust wireless links for handheld and portable devices in commercial and industrial settings.
- Consumer and commercial electronics: Powers wireless connectivity in devices like set-top boxes, networked appliances, and point-of-sale terminals, ensuring seamless user experiences.
CYW88570CFFBG Brand Info
The CYW88570CFFBG is part of a well-recognized family of integrated wireless connectivity products. Its brand is associated with high-quality, reliable SoC solutions for wireless communication, supporting a wide range of applications in industrial, commercial, and consumer electronics. The product is known for robust design, compliance with global standards, and ease of integration, making it a trusted choice for engineers and sourcing professionals seeking dependable wireless solutions.
FAQ
What is the primary use case for the CYW88570CFFBG?
This part is typically used as a wireless system-on-chip in industrial, commercial, and IoT devices. Its high integration and robust design make it suitable for systems that demand reliable wireless connectivity in challenging environments.
🌟 Featured Products
-
“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-
0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-
1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
What package type does the CYW88570CFFBG use?
It utilizes an FBGA-143 (Fine-pitch Ball Grid Array) package, which is ideal for surface mount assembly and allows for compact, space-saving PCB layouts in dense electronic designs.
Is the CYW88570CFFBG compliant with environmental standards?
Yes, the device is RoHS compliant, ensuring it meets global environmental regulations for hazardous substances, making it suitable for worldwide manufacturing and end products.
📩 Contact Us
What is the recommended operating temperature range?
The device is designed to operate reliably from -40??C to 85??C. This broad temperature range supports deployment in both standard and demanding industrial environments.
How does the integration level of this SoC benefit system designers?
The high degree of integration reduces the need for external components, streamlining board design, improving reliability, and allowing for smaller, lighter, and more cost-effective end products.
