CYW55573MIFFBGT Overview
The CYW55573MIFFBGT is a highly integrated wireless connectivity solution designed for advanced industrial and commercial electronics. Featuring robust wireless protocol support and compact packaging, this device streamlines the development of high-performance, space-constrained systems. Its integration makes it suitable for applications demanding reliable wireless performance and efficient power management. The device is engineered for seamless implementation in diverse environments, offering flexibility and scalability for demanding use cases. For procurement and detailed component information, visit IC Manufacturer.
CYW55573MIFFBGT Technical Specifications
| Parameter | Value |
|---|---|
| Part Number | CYW55573MIFFBGT |
| Package | FBGA-183 |
| Mounting Type | Surface Mount |
| Technology | CMOS |
| RoHS Compliance | RoHS Compliant |
| Operating Temperature Range | -40??C to +85??C |
| Wireless Function | Wi-Fi/Bluetooth Integration |
| Pin Count | 183 |
CYW55573MIFFBGT Key Features
- Integrated Wi-Fi and Bluetooth functionality ensures streamlined wireless connectivity, reducing the need for multiple discrete components and simplifying system design.
- Compact FBGA-183 packaging enables high-density board layouts, which is essential for modern industrial and commercial devices with tight space constraints.
- Wide operating temperature range from -40??C to +85??C allows deployment in demanding environments, improving reliability under various thermal conditions.
- Surface mount technology (SMT) support accelerates automated PCB assembly and improves manufacturing throughput.
CYW55573MIFFBGT Advantages vs Typical Alternatives
Compared to standard wireless modules, this solution offers superior integration of Wi-Fi and Bluetooth within a single, space-efficient FBGA-183 package. Related function words like ??integration?? and ??reliability?? are key, as the device delivers robust performance across a wide temperature range while minimizing board area and simplifying assembly processes.
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Typical Applications
- Industrial automation and control systems requiring reliable wireless communication, compact form factors, and robust operation in harsh temperature environments. These systems benefit from the integrated wireless capabilities and extended temperature range.
- Smart home devices, where embedded wireless connectivity and small size are essential for seamless integration into consumer products and home automation setups.
- Medical equipment leveraging secure and reliable wireless data transmission to support patient monitoring and diagnostics within regulated environments.
- Commercial IoT gateways and edge devices that require efficient wireless protocol support and a highly integrated, surface-mountable solution for scalable deployments.
CYW55573MIFFBGT Brand Info
The CYW55573MIFFBGT is part of a family of advanced wireless connectivity ICs, recognized for their integration, reliability, and support for both Wi-Fi and Bluetooth protocols. Designed to address the rigorous demands of industrial and commercial applications, this product offers a balance of high performance and efficient assembly. Its compliance with RoHS standards further positions it as a sustainable choice for modern electronics manufacturing.
FAQ
What type of packaging does the CYW55573MIFFBGT use?
This device is supplied in an FBGA-183 package, which is both compact and suitable for high-density surface mount applications. The packaging enables efficient automated assembly and is well-suited to environments where board space is at a premium.
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Is the CYW55573MIFFBGT suitable for harsh industrial environments?
Yes, the component operates reliably across a wide temperature range from -40??C to +85??C. This makes it a strong candidate for deployment in industrial, commercial, and other settings where thermal stability is critical.
What wireless technologies does the CYW55573MIFFBGT support?
The device integrates both Wi-Fi and Bluetooth capabilities, providing versatile wireless connectivity for a range of applications. This dual support simplifies system design and reduces the need for multiple discrete modules.
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Is the CYW55573MIFFBGT RoHS compliant?
Yes, this product meets RoHS compliance standards, making it suitable for use in applications where environmental and regulatory considerations are essential. This helps manufacturers meet global green electronics requirements.
What mounting type is supported by the CYW55573MIFFBGT?
The device is designed for surface mount technology (SMT), enabling efficient PCB assembly and compatibility with automated manufacturing lines. This reduces manual intervention and improves production yields.
