CYW55572MIFFBGT Overview
The CYW55572MIFFBGT is a highly integrated wireless communication IC designed specifically for robust industrial and commercial applications. Engineered for demanding use cases, it combines multiple connectivity standards in a compact BGA-196 package, supporting efficient design for space-constrained environments. Its advanced features enable reliable data transfer, making it suitable for a wide range of embedded systems and connected devices. Leveraging its versatile interface options and optimized power characteristics, this component empowers engineers to achieve dependable performance in challenging conditions. IC Manufacturer
CYW55572MIFFBGT Technical Specifications
| Attribute | Value |
|---|---|
| Part Number | CYW55572MIFFBGT |
| Package / Case | BGA-196 |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Type | Integrated Circuit (IC) |
| Application | Wireless Communication |
| Packaging | Tape & Reel (TR) |
| Lead Free Status | Lead Free |
CYW55572MIFFBGT Key Features
- Highly Integrated Design: Combines multiple wireless connectivity features in a single BGA-196 package, reducing BOM complexity and enabling compact PCB layouts.
- Surface Mount Technology: Simplifies high-volume manufacturing and ensures secure placement on densely populated boards, resulting in streamlined production processes.
- RoHS Compliance: Aligns with global environmental standards, ensuring suitability for eco-conscious and regulatory-sensitive markets.
- Industrial-Grade Reliability: Tailored for demanding wireless communication environments, offering dependable performance for embedded and IoT systems.
CYW55572MIFFBGT Advantages vs Typical Alternatives
With its advanced BGA-196 package and robust surface mount capability, this device offers a significant advantage in minimizing board space and simplifying integration compared to typical discrete wireless solutions. Its RoHS compliance and lead-free design ensure global regulatory acceptance and long-term reliability, making it a preferred choice for modern wireless communications applications.
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Typical Applications
- Industrial Wireless Communication Systems: Suitable for robust industrial automation and control networks requiring reliable data transfer and minimal downtime in electrically noisy environments.
- Connected Embedded Devices: Ideal for smart devices and IoT modules that demand seamless wireless integration and efficient use of PCB real estate.
- Commercial Networking Equipment: Supports routers, gateways, and access points requiring high-density circuit integration and regulatory compliance.
- Consumer Electronics: Fits in wireless peripherals and smart home devices where compact size and integrated wireless capabilities are essential.
CYW55572MIFFBGT Brand Info
The CYW55572MIFFBGT represents a commitment to quality and innovation in wireless integrated circuits. Designed for surface mount applications, it upholds strict RoHS and lead-free standards, reflecting strong environmental stewardship. Its packaging and integration make it a solid choice for manufacturers seeking dependable connectivity solutions for industrial and commercial markets.
FAQ
What mounting method is used for the CYW55572MIFFBGT, and why is it beneficial?
This device uses surface mount technology (SMT), which provides secure attachment to the PCB and enables high-density layouts. SMT also supports automated assembly, reducing manufacturing time and cost.
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Is the CYW55572MIFFBGT compliant with environmental regulations?
Yes, the product is RoHS compliant and lead-free, making it suitable for use in regions with strict environmental standards and for customers prioritizing eco-friendly product development.
What packaging format does this device use, and how does it aid manufacturing?
The device is available in Tape & Reel (TR) packaging, which is ideal for automated pick-and-place assembly lines. This ensures consistency and efficiency during high-volume production runs.
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Which applications are best suited for this integrated circuit?
It is well-suited for wireless communication within industrial automation, embedded IoT devices, commercial networking equipment, and compact consumer electronics that require reliable wireless connectivity.
What are the integration benefits of the BGA-196 package?
The BGA-196 package offers a compact footprint, enabling space savings on the PCB. This makes it easier to design miniaturized or high-density electronic products without sacrificing performance.
