CYW55571MIUBGT WiFi 6/Bluetooth 5.3 Combo Chip, LGA Package

  • Enables wireless connectivity, allowing devices to communicate seamlessly in smart home or industrial environments.
  • Supports advanced wireless protocols for improved data transfer and stable connections in demanding applications.
  • Compact package type helps save board space, making it suitable for dense or portable electronic designs.
  • Ideal for integration in IoT modules, where it streamlines device communication and remote management.
  • Manufactured with quality controls to help ensure consistent performance and long-term reliability in end products.
SKU: CYW55571MIUBGT Category: Brand:
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产品上方询盘

CYW55571MIUBGT Overview

The CYW55571MIUBGT is a highly integrated wireless connectivity solution designed for demanding industrial and embedded applications. Featuring advanced multi-protocol support, this device enables robust wireless communication in a compact package, making it ideal for IoT, industrial automation, and consumer electronics. Its optimized architecture ensures reliable performance and low power consumption, addressing the needs of modern connected systems. With a strong focus on integration and efficiency, the CYW55571MIUBGT helps engineers streamline product development and accelerate time to market. For more details, visit IC Manufacturer.

CYW55571MIUBGT Technical Specifications

Parameter Value
Part Number CYW55571MIUBGT
Package / Case UBGA-109
Mounting Type Surface Mount
Operating Temperature Range -40??C to +85??C
Connectivity Wi-Fi, Bluetooth
Wi-Fi Standard 802.11a/b/g/n/ac/ax
Bluetooth Version Bluetooth 5.x
RoHS Compliance Yes
Supply Voltage 3.3V (typical)
Number of Pins 109

CYW55571MIUBGT Key Features

  • Integrated Wi-Fi 6 (802.11ax) and Bluetooth 5.x support for seamless wireless connectivity, enhancing throughput and reducing latency.
  • Industrial-grade operating temperature range (-40??C to +85??C) ensures reliable operation in harsh environments, supporting mission-critical deployments.
  • Compact UBGA-109 package optimizes board space, enabling high-density designs and simplified PCB layouts.
  • RoHS compliance aligns with global environmental standards, facilitating worldwide product deployment and regulatory approval.

CYW55571MIUBGT Advantages vs Typical Alternatives

This device stands out by combining Wi-Fi 6 and Bluetooth 5.x in a single, compact package, reducing component count and simplifying integration. Its robust industrial temperature range and RoHS compliance enable reliable operation and environmental conformity across diverse applications. The advanced connectivity features deliver improved data rates, efficiency, and coverage compared to standard wireless solutions, making it a preferred choice for modern IoT and embedded platforms.

Typical Applications

  • Industrial automation systems requiring secure and reliable wireless communication between controllers, sensors, and human-machine interfaces in challenging environments.
  • IoT gateways and edge devices leveraging Wi-Fi and Bluetooth connectivity for seamless data aggregation and device management.
  • Smart home appliances integrating advanced wireless features for enhanced user experiences and interoperability.
  • Consumer electronics such as wearable devices, tablets, and multimedia systems where high-speed wireless data exchange is essential.

CYW55571MIUBGT Brand Info

The CYW55571MIUBGT is part of a trusted line of wireless connectivity solutions, recognized for integrating cutting-edge Wi-Fi and Bluetooth capabilities into a single chip. Engineered for performance and reliability, it addresses the requirements of industrial, IoT, and consumer product developers who demand robust wireless communication with minimal design complexity. Its compliance with international standards and versatile package makes it adaptable for a broad spectrum of embedded systems and next-generation connected devices.

FAQ

What wireless protocols are supported by the CYW55571MIUBGT?

This device supports both Wi-Fi 6 (802.11ax) and Bluetooth 5.x protocols, allowing products to maintain fast, reliable wireless connections and interoperability across a wide range of modern applications. This dual-protocol support simplifies system design and enhances communication flexibility.

Is the CYW55571MIUBGT suitable for industrial environments?

Yes, with an operating temperature range from -40??C to +85??C, the device is well-suited for industrial and automotive environments where exposure to extreme temperatures is common. Its robust design ensures consistent performance under harsh conditions.

What are the packaging and mounting options for this device?

The CYW55571MIUBGT comes in a UBGA-109 package and is intended for surface mount assembly. This allows for compact, high-density PCB layouts, making it ideal for space-constrained applications in modern electronic devices.

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产品中间询盘

Does the device comply with environmental standards?

Yes, the CYW55571MIUBGT is RoHS compliant, ensuring adherence to global environmental regulations. This compliance supports easier international certification and market access for end products.

What typical applications are ideal for integrating this device?

It is ideally suited for industrial automation, IoT gateways, smart home appliances, and consumer electronics requiring advanced Wi-Fi and Bluetooth connectivity. Its feature set supports rapid development of reliable, connected solutions across these markets.

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