CYW55542IUBGTXTMA1 Wi-Fi/Bluetooth Combo IC, BGA Package

  • Provides wireless connectivity, enabling efficient device communication for a wide range of embedded systems.
  • Supports Bluetooth and Wi-Fi protocols, offering flexible integration options for multiple wireless standards.
  • Compact package design helps minimize board space, allowing for streamlined layouts in space-constrained products.
  • Well-suited for smart home devices, where reliable wireless performance enhances user experience and device interoperability.
  • Manufactured to rigorous standards to ensure consistent operation and dependable performance in diverse environments.
SKU: CYW55542IUBGTXTMA1 Category: Brand:
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产品上方询盘

CYW55542IUBGTXTMA1 Overview

The CYW55542IUBGTXTMA1 is a highly integrated wireless communication IC designed for industrial and commercial applications requiring robust connectivity and advanced performance. This device combines sophisticated wireless protocol support in a compact, surface-mountable LGA package, making it suitable for space-constrained designs. With a proven industrial temperature range, it delivers consistent operation in demanding environments. For engineers and sourcing specialists seeking reliable, high-quality wireless solutions, this component offers a balanced blend of integration, flexibility, and durability. For more product details and sourcing support, visit IC Manufacturer.

CYW55542IUBGTXTMA1 Technical Specifications

Parameter Specification
Device Type Wireless Communication IC
Package / Case LGA-96
Mounting Type Surface Mount
Operating Temperature Range -40??C to 85??C
RoHS Status RoHS Compliant
ECCN 5A992C
REACH Status REACH Unaffected
Supplier Device Package LGA

CYW55542IUBGTXTMA1 Key Features

  • Compact LGA-96 package enables high-density board designs, maximizing PCB real estate for multi-function industrial and commercial systems.
  • Wide operating temperature range from -40??C to 85??C ensures reliable performance in harsh industrial and outdoor environments.
  • RoHS compliant and REACH unaffected status supports regulatory compliance for global market deployment and long-term sourcing assurance.
  • Surface-mount design streamlines assembly processes and improves manufacturability in automated production lines.

CYW55542IUBGTXTMA1 Advantages vs Typical Alternatives

This wireless communication IC stands out due to its robust industrial temperature range, compact LGA-96 footprint, and regulatory compliance, offering both flexibility and reliability. Its surface-mount compatibility and environmental certifications make it an ideal choice for streamlined manufacturing and long-term product lifecycle support, compared to typical alternatives that may lack such integration or compliance benefits.

Typical Applications

  • Industrial wireless gateways: Integrates into automation systems for secure and reliable wireless data transfer across factory networks, supporting process control and monitoring in challenging temperature environments.
  • Commercial IoT devices: Suitable for smart lighting, building automation, and asset tracking where compact form factor and extended temperature operation are essential.
  • Consumer electronics: Can be used in advanced home networking products, allowing seamless wireless connectivity in space-constrained designs.
  • Embedded systems: Supports wireless communication in embedded modules, sensors, and controllers for applications that demand high reliability and regulatory compliance.

CYW55542IUBGTXTMA1 Brand Info

The CYW55542IUBGTXTMA1 is offered by a trusted supplier renowned for delivering advanced connectivity solutions to industrial, commercial, and embedded markets. This specific model emphasizes quality, regulatory compliance, and versatility, ensuring it meets the needs of demanding applications. Its consistent availability and robust documentation support make it a preferred choice among engineers and procurement professionals looking for longevity and dependable sourcing channels.

FAQ

What is the primary advantage of the LGA-96 package for this device?

The LGA-96 package provides a compact, low-profile form factor that conserves PCB space and enables high-density mounting. This is especially useful in applications with tight mechanical constraints or multi-functional board layouts, improving overall system integration.

Is the CYW55542IUBGTXTMA1 suitable for use in extreme temperature environments?

Yes, it is designed to operate reliably across an industrial temperature range of -40??C to 85??C, making it suitable for both indoor and outdoor use in harsh or fluctuating environmental conditions.

Does this IC comply with major environmental and regulatory standards?

Absolutely. The device is RoHS compliant and REACH unaffected, ensuring it meets essential environmental safety and regulatory requirements for global markets and sustainable product design.

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产品中间询盘

What type of mounting is supported by the CYW55542IUBGTXTMA1?

The component is intended for surface mount technology (SMT), which enables automated assembly processes, reduces production costs, and enhances manufacturing throughput for high-volume applications.

Can this device be sourced for applications with strict export control requirements?

Yes, with an ECCN classification of 5A992C, it is well-defined for export control, simplifying compliance for international projects and ensuring clarity for procurement teams.

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