CYW55532IUBGTXTMA1 Overview
The CYW55532IUBGTXTMA1 is a highly integrated, advanced wireless communication solution designed for demanding industrial and commercial environments. This device provides robust connectivity, leveraging its state-of-the-art wireless capabilities to enable seamless data exchange and streamlined system integration. Engineered for high reliability and low power consumption, it is ideal for applications requiring consistent performance and efficient operation. The CYW55532IUBGTXTMA1 offers a compact form factor, making it suitable for space-constrained designs, and supports a wide range of industry-leading features that ensure flexibility and future-proofing in modern embedded systems. For more details, visit IC Manufacturer.
CYW55532IUBGTXTMA1 Technical Specifications
| Device Type | Integrated Wireless Communication Module |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 169-VFBGA |
| Operating Temperature Range | -40??C to 85??C |
| RoHS Status | RoHS Compliant |
| ECCN | 5A992C |
| Supplier Device Package | 169-VFBGA (8×8) |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Lifecycle Status | Active |
CYW55532IUBGTXTMA1 Key Features
- Integrated wireless communication enables streamlined connectivity in complex systems, reducing the need for additional external modules and simplifying board design.
- Surface mount packaging in a compact 169-VFBGA form factor allows for efficient use of PCB space, supporting high-density assembly and miniaturized devices.
- Wide operating temperature range from -40??C to 85??C ensures reliable performance in harsh industrial and commercial environments.
- RoHS compliance supports eco-friendly electronics manufacturing by meeting strict environmental regulations.
- Active product lifecycle status guarantees ongoing support and availability for long-term projects and production runs.
- ECCN 5A992C classification facilitates global sourcing and export compliance for international projects.
CYW55532IUBGTXTMA1 Advantages vs Typical Alternatives
This device stands out by combining a compact footprint with high reliability and robust wireless performance. Its broad operating temperature range and RoHS compliance make it a dependable choice for demanding industrial settings. The surface mount package allows for efficient assembly, while the active status ensures continuous supply and support, making it a preferred solution over many conventional alternatives.
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Typical Applications
- Industrial wireless gateways and controllers: The device enables secure, high-reliability wireless communications in factory automation, process control, and industrial IoT systems, supporting robust real-time data transfer in demanding environments.
- Commercial building automation: Integrate into smart lighting, HVAC, and security systems to provide seamless wireless connectivity and remote management capabilities.
- Consumer electronic devices: Suitable for wireless modules in home automation hubs, set-top boxes, and entertainment systems requiring efficient, low-power operation.
- Medical equipment: Embedded in portable diagnostic tools and patient monitoring systems, where reliable wireless data exchange and compact size are critical.
CYW55532IUBGTXTMA1 Brand Info
The CYW55532IUBGTXTMA1 is developed and manufactured by a leading innovator in industrial and embedded connectivity solutions. This component reflects the brand??s commitment to quality, advanced technology, and compliance with global standards. Designed for integration into diverse electronic platforms, it offers a balance of performance, efficiency, and reliability, backed by comprehensive technical support and a strong supply chain. Its presence in critical industrial, commercial, and consumer applications underscores the manufacturer??s reputation for delivering trusted, forward-looking wireless communication products.
FAQ
What is the primary use case for the CYW55532IUBGTXTMA1 in industrial environments?
This module is primarily selected for applications requiring robust and reliable wireless connectivity, such as industrial automation, process monitoring, and smart factory systems. Its integrated approach simplifies system architecture and enhances overall reliability in mission-critical deployments.
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How does the package type of the CYW55532IUBGTXTMA1 benefit PCB design?
The 169-VFBGA surface mount package offers a compact footprint, which is ideal for high-density PCB layouts and space-constrained designs. This allows engineers to optimize board real estate and streamline assembly processes for modern electronic devices.
Is the CYW55532IUBGTXTMA1 suitable for harsh environments?
Yes, its operating temperature range of -40??C to 85??C makes it suitable for use in both industrial and commercial settings, including those with challenging thermal conditions. This ensures consistent performance across a wide variety of installation scenarios.
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What compliance and regulatory benefits does this device offer?
The RoHS compliance of this device allows manufacturers to meet strict environmental standards, while the ECCN 5A992C classification supports international trade and export requirements. This facilitates easier global sourcing and regulatory approval processes.
How does the lifecycle status affect long-term project planning?
With an active lifecycle status, customers can rely on continued availability and manufacturer support for the CYW55532IUBGTXTMA1. This is especially important for long-term industrial projects where consistent component sourcing and technical assistance are essential.
