CYW55531IUBGTXTMA1 Wi-Fi/Bluetooth Combo IC, Wireless Transceiver, UBGA Package

  • Enables wireless connectivity, allowing seamless data transfer between devices in smart home or industrial environments.
  • Supports multiple wireless protocols, ensuring flexible integration with a wide range of networked devices.
  • Compact package type reduces board space requirements, ideal for space-constrained embedded applications.
  • Well suited for IoT gateways, providing reliable communication and supporting scalable device management.
  • Manufactured to industry standards for consistent performance and dependable operation in long-term deployments.
SKU: CYW55531IUBGTXTMA1 Category: Brand:
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CYW55531IUBGTXTMA1 Overview

The CYW55531IUBGTXTMA1 is a highly integrated wireless communication IC designed for demanding industrial and commercial environments. Featuring advanced connectivity capabilities and robust operational characteristics, this device enables efficient, reliable data transmission in embedded systems. With support for a range of wireless protocols and an extended temperature range, it is well-suited for applications where long-term performance and stability are critical. Engineers and sourcing professionals seeking a versatile connectivity solution for high-volume deployments will benefit from the flexibility and proven reliability of this device. Learn more at IC Manufacturer.

CYW55531IUBGTXTMA1 Technical Specifications

Parameter Value
Part Number CYW55531IUBGTXTMA1
Type Wireless Communication IC
Package WFBGA-143
Mounting Style Surface Mount
Operating Temperature Range -40??C to +85??C
Number of Pins 143
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) Level 3
ECCN 5A992C

CYW55531IUBGTXTMA1 Key Features

  • Advanced wireless communication capability enables robust data transfer in industrial and commercial embedded systems, supporting seamless device interconnectivity.
  • Extended operating temperature range from -40??C to +85??C ensures reliable performance in harsh and variable environmental conditions.
  • Compact WFBGA-143 package allows for high-density PCB layouts, maximizing board space utilization in complex system designs.
  • RoHS compliance and MSL Level 3 rating support environmentally responsible manufacturing and efficient storage handling in production environments.

CYW55531IUBGTXTMA1 Advantages vs Typical Alternatives

This wireless IC stands out due to its extended temperature tolerance, making it ideal for industrial applications where reliability is critical. The compact WFBGA-143 packaging supports high-density integration, while RoHS compliance ensures alignment with modern environmental standards. Its robust design and advanced connectivity features provide a dependable solution compared to typical alternatives in the market.

Typical Applications

  • Industrial automation systems??The device is suited for wireless communication in factory automation, robotics, and process control where extended temperature operation and reliable data transfer are essential.
  • Smart home and building automation??Used in wireless modules for intelligent lighting, HVAC, and security systems requiring robust connectivity.
  • Commercial IoT gateways??Enables secure, high-throughput wireless links for IoT aggregation points in retail, logistics, and monitoring environments.
  • Embedded wireless modules??Integrated into custom PCBs for advanced consumer or industrial products that demand space-efficient, reliable wireless interfaces.

CYW55531IUBGTXTMA1 Brand Info

The CYW55531IUBGTXTMA1 is part of a trusted portfolio of wireless communication ICs engineered for high-performance industrial and commercial applications. Its robust design, surface-mount package, and compliance with international standards underscore the manufacturer??s commitment to quality and reliability. This product is recognized in the market for its versatility and ability to meet the stringent requirements of modern embedded systems.

FAQ

What package type does the CYW55531IUBGTXTMA1 use, and why is it beneficial?

The device uses a WFBGA-143 package, which allows for a compact footprint and high pin density. This is advantageous for engineers designing space-constrained PCBs, as it enables the integration of multiple features without increasing board size.

Is the CYW55531IUBGTXTMA1 compliant with environmental regulations?

Yes, it is RoHS compliant, indicating that it meets international standards for hazardous material restrictions. This simplifies compliance for manufacturers targeting global markets and helps support environmental responsibility.

What is the recommended operating temperature range for this wireless IC?

The recommended operating temperature range is from -40??C to +85??C. This extended range ensures dependable operation in industrial, commercial, and other environments where temperature fluctuations are common.

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How does the moisture sensitivity level (MSL) impact storage and handling?

The device has an MSL rating of Level 3, which means that it must be handled and stored with care to prevent moisture-related damage during soldering. Proper storage practices help maintain product integrity before assembly.

Can the CYW55531IUBGTXTMA1 be used in high-volume automated assembly processes?

Yes, the surface mount design and standardized package enable compatibility with automated pick-and-place equipment, making it suitable for high-volume manufacturing environments where process efficiency and repeatability are critical.

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