CYW55512IUBGTXTMA1 Overview
The CYW55512IUBGTXTMA1 is a highly integrated wireless communication IC designed for robust, high-performance connectivity in industrial and commercial electronics. This device offers advanced wireless capabilities optimized for demanding environments, ensuring reliable operation and efficient data transmission. Its compact footprint and integration features enable streamlined PCB layouts, while support for multiple radio protocols enhances design flexibility. The CYW55512IUBGTXTMA1 is well-suited for applications requiring secure, low-latency, and energy-efficient wireless solutions. For more information and sourcing options, visit IC Manufacturer.
CYW55512IUBGTXTMA1 Technical Specifications
| Parameter | Value |
|---|---|
| Part Number | CYW55512IUBGTXTMA1 |
| Device Type | Wireless Communication IC |
| Mounting Type | Surface Mount |
| Package / Case | UBGA |
| Operating Temperature | -40??C to 85??C |
| RoHS Status | ROHS Compliant |
| ECCN | 5A992C |
| REACH Status | REACH Unaffected |
| Supplier Device Package | UBGA |
CYW55512IUBGTXTMA1 Key Features
- Highly integrated wireless communication enables streamlined designs and reduces the need for multiple discrete components, simplifying system architecture and saving board space.
- Surface mount UBGA package provides reliable high-density interconnection and efficient thermal performance, ideal for compact and densely populated PCBs.
- Wide operating temperature range from -40??C to 85??C supports deployment in harsh industrial and commercial environments where thermal stability is critical.
- ROHS compliant and REACH unaffected status ensures environmental compliance and supports global market requirements.
CYW55512IUBGTXTMA1 Advantages vs Typical Alternatives
This device stands out due to its advanced integration, robust environmental tolerance, and compact UBGA package. These features enable engineers to achieve greater reliability and design efficiency compared to typical alternatives. Its compliance with global standards and broad temperature range further enhances its suitability for mission-critical applications, offering superior performance and versatility with related function words such as flexibility, durability, and connectivity.
🔥 Best-Selling Products
Typical Applications
- Industrial automation systems benefit from the device??s robust wireless communication and wide temperature tolerance, enabling reliable machine-to-machine connectivity in factories and process control environments.
- Smart building infrastructure leverages its integration and compliance for secure, energy-efficient sensor and gateway solutions.
- Commercial electronics utilize the compact UBGA package for portable or space-constrained devices requiring dependable wireless connectivity.
- Networking equipment relies on its capability for stable, high-throughput wireless links in enterprise and service provider deployments.
CYW55512IUBGTXTMA1 Brand Info
The CYW55512IUBGTXTMA1 is manufactured to meet the stringent demands of industrial, commercial, and networking markets. It reflects the brand??s commitment to quality, environmental responsibility, and reliable wireless innovation. This product is positioned as a high-integration solution, offering designers assurance of compliance with ROHS and REACH directives, while delivering outstanding performance and flexibility across a range of wireless communication applications.
FAQ
What mounting method is supported by this device?
The component is designed for surface mount technology, allowing for automated assembly and compatibility with high-density PCB designs, which is crucial for advanced electronics manufacturing processes.
🌟 Featured Products
-

“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-

QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-

0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-

1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
What is the operating temperature range?
The CYW55512IUBGTXTMA1 operates reliably from -40??C to 85??C, making it suitable for use in both standard and harsh industrial environments where temperature extremes are common.
Which package type is used for this component?
This device comes in a UBGA (Ultra Fine Ball Grid Array) package, which offers high pin density, efficient thermal management, and compact size for space-constrained applications.
📩 Contact Us
Is this product compliant with environmental regulations?
Yes, it is ROHS compliant and REACH unaffected, ensuring that it meets global environmental and safety standards necessary for worldwide distribution and use in regulated industries.
What are typical use cases for this wireless communication IC?
Applications include industrial automation, smart building solutions, advanced commercial electronics, and networking equipment, all of which require robust, reliable, and efficient wireless connectivity in challenging conditions.






