CYW55503IUBGTXTMA1 Overview
The CYW55503IUBGTXTMA1 is an advanced wireless connectivity solution designed for demanding industrial and commercial applications. With robust integration and a compact LGA-124 form factor, this device enables streamlined development for wireless networking tasks. It supports a broad temperature range and is suitable for high-reliability uses. The device??s RoHS compliance and active lifecycle status make it well-suited for long-term projects. For more details, visit IC Manufacturer.
CYW55503IUBGTXTMA1 Technical Specifications
| Attribute | Value |
|---|---|
| Manufacturer Part Number | CYW55503IUBGTXTMA1 |
| Package / Case | LGA-124 |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40??C to +85??C |
| Lifecycle Status | Active |
| RoHS Status | RoHS Compliant |
| ECCN Code | 5A992C |
| Moisture Sensitivity Level (MSL) | 3 |
CYW55503IUBGTXTMA1 Key Features
- Supports a wide industrial temperature range, ensuring reliable wireless connectivity in challenging environments.
- Compact LGA-124 package allows for space-saving designs and high-density PCB layouts in modern electronics.
- RoHS compliance promotes environmentally responsible manufacturing and facilitates global market access.
- Active product lifecycle status provides confidence in long-term availability for ongoing projects.
CYW55503IUBGTXTMA1 Advantages vs Typical Alternatives
This device stands out over typical alternatives by offering a balance of robust mechanical design, broad operating temperature support, and RoHS compliance. Its surface-mount LGA-124 footprint streamlines high-volume assembly, while the active lifecycle status ensures ongoing support for production and maintenance cycles. Such attributes are essential for industrial and commercial wireless networking solutions requiring both reliability and regulatory compliance.
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Typical Applications
- Industrial wireless modules where ruggedness and extended temperature operation are critical for factory automation, process control, and remote monitoring systems.
- Commercial access points and networking equipment that benefit from a compact, reliable, and easily manufacturable wireless solution.
- Consumer electronics needing robust wireless connectivity with compact form factor requirements, such as smart home devices and IoT gateways.
- Embedded systems where integration flexibility and RoHS compliance are necessary for international deployment and regulatory approvals.
CYW55503IUBGTXTMA1 Brand Info
The CYW55503IUBGTXTMA1 is produced by a reputable manufacturer known for delivering high-quality semiconductors and wireless connectivity solutions. This product is engineered to meet the demands of both industrial and commercial sectors, offering a combination of reliability, compliance, and ease of integration. Its active lifecycle status underlines the manufacturer??s commitment to long-term supply, making it a dependable choice for designers and sourcing professionals alike.
FAQ
What is the recommended operating temperature range for the CYW55503IUBGTXTMA1?
The device is rated for operation from -40??C to +85??C, making it suitable for both industrial and commercial environments where wide temperature tolerance is required for dependable wireless connectivity.
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What packaging and mounting does this model use?
This part utilizes a compact LGA-124 package and is intended for surface mount assembly, making it compatible with high-density PCB designs and automated production lines.
Is the CYW55503IUBGTXTMA1 compliant with international environmental standards?
Yes, it is RoHS compliant, ensuring that it meets global standards for hazardous substances, which simplifies international shipping and regulatory approval for electronics manufacturers.
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What is the lifecycle status of this wireless connectivity solution?
The product is listed as active, indicating ongoing manufacturer support, long-term availability, and suitability for current and future designs in volume production environments.
Can the CYW55503IUBGTXTMA1 be used in moisture-sensitive environments?
With a Moisture Sensitivity Level (MSL) of 3, the device requires standard handling precautions to prevent moisture-related damage during reflow soldering, ensuring reliable performance in demanding assembly processes.
