CYW43569PKFFBG WiFi/Bluetooth Combo Chip, Communication IC, FCBGA Package

  • Provides wireless connectivity, enabling devices to communicate efficiently in various networked environments.
  • Features a compact package type, allowing for board-space savings in designs with limited room.
  • Helps reduce overall device power consumption, supporting longer battery life in portable applications.
  • Suited for integration into smart home devices, enhancing remote control and automation capabilities.
  • Manufactured to meet standard quality requirements, supporting consistent performance over the product lifecycle.
SKU: CYW43569PKFFBG Category: Brand:
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产品上方询盘

CYW43569PKFFBG Overview

The CYW43569PKFFBG is a highly integrated wireless connectivity solution developed for demanding industrial and embedded applications. This device combines advanced wireless communication protocols with a compact, robust package, supporting seamless data exchange and reliable performance in complex environments. Its design emphasizes efficiency, integration, and ease of implementation, making it suitable for engineers seeking dependable wireless connectivity within space-constrained or power-sensitive designs. The CYW43569PKFFBG supports a range of wireless standards and provides critical features for robust industrial operation. Learn more at IC Manufacturer.

CYW43569PKFFBG Technical Specifications

Parameter Value
Part Number CYW43569PKFFBG
Package Type FBGA
Mounting Style Surface Mount
RoHS Compliance Yes
Number of Pins 124
Operating Temperature Range -40??C to +85??C
Wireless Interface Wi-Fi and Bluetooth
Core Architecture ARM Cortex-based
Typical Applications IoT, Industrial, Automotive, Consumer Electronics

CYW43569PKFFBG Key Features

  • Supports both Wi-Fi and Bluetooth connectivity, enabling flexible integration in multi-protocol wireless systems for enhanced interoperability.
  • Surface mount FBGA package allows for compact PCB layouts and high-density placement, which is vital for space-constrained applications.
  • Wide operating temperature range from -40??C to +85??C ensures reliable function in harsh industrial and automotive environments.
  • RoHS compliance supports eco-friendly product development and easier regulatory adherence for global markets.

CYW43569PKFFBG Advantages vs Typical Alternatives

Compared to typical wireless connectivity solutions, the CYW43569PKFFBG offers a robust combination of multi-standard support, compact FBGA packaging, and an extended operating temperature range. This enables designers to build more reliable, space-efficient, and versatile systems with fewer components, reducing development time and overall BOM complexity. The integration of both Wi-Fi and Bluetooth provides significant flexibility for connected products, especially in demanding industrial environments.

Typical Applications

  • Industrial IoT gateways and controllers, where robust wireless connectivity and environmental tolerance are essential for continuous data acquisition and remote monitoring.
  • Automotive infotainment systems and telematics modules that require reliable, dual-standard wireless communication in thermally challenging conditions.
  • Consumer electronics, such as smart home devices and wearables, benefiting from compact integration and multi-protocol support for seamless user experiences.
  • Embedded systems in commercial automation, where dependable wireless links and compliance with environmental standards are critical for long-term product deployment.

CYW43569PKFFBG Brand Info

The CYW43569PKFFBG is offered under a reputable brand recognized for innovation in wireless connectivity solutions. This specific product embodies the brand??s commitment to high-performance, reliable, and scalable wireless ICs for industrial, automotive, and consumer electronics. Its development reflects a focus on integrating advanced wireless standards, ensuring designers can leverage proven technology for next-generation connected applications.

FAQ

What packaging type does the CYW43569PKFFBG use, and why is this important?

This device is supplied in a fine-pitch ball grid array (FBGA) package, which enables high-density PCB layouts and efficient use of board space. FBGA packaging also supports robust electrical connections and improved thermal performance, which are critical for demanding industrial and automotive environments.

Is the CYW43569PKFFBG suitable for use in harsh environments?

Yes, it is designed to operate reliably across a wide temperature range of -40??C to +85??C, making it well-suited for industrial, automotive, and other applications where environmental conditions may be extreme or variable.

Does this device support both Wi-Fi and Bluetooth connectivity?

Absolutely. The CYW43569PKFFBG integrates both Wi-Fi and Bluetooth wireless interfaces, providing significant flexibility for applications that require multi-protocol operation, such as IoT gateways, smart appliances, and automotive systems.

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产品中间询盘

What are some key benefits of the surface mount design for this component?

The surface mount design simplifies automated assembly processes, reduces manufacturing costs, and allows for more compact product designs. It also supports improved electrical performance and reliability compared to through-hole alternatives.

Is the CYW43569PKFFBG compliant with environmental regulations?

Yes, this device is RoHS compliant, providing assurance for manufacturers targeting eco-friendly products and facilitating regulatory compliance across global markets. This makes it easier to integrate into products destined for regions with strict environmental standards.

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