CYW43455LXKUBGT Wi-Fi/Bluetooth Combo IC, LGA Package, Wireless Module

  • Provides wireless connectivity for devices, enabling seamless data transmission between systems and user interfaces.
  • Supports Wi-Fi and Bluetooth protocols, allowing integration into applications that require versatile communication standards.
  • Offered in a compact package, saving valuable PCB space in densely populated electronic designs.
  • Ideal for smart home devices, wearable technology, or IoT modules where reliable wireless performance is essential.
  • The CYW43455LXKUBGT is manufactured to meet quality standards, supporting robust operation in embedded environments.
SKU: CYW43455LXKUBGT Category: Brand:
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产品上方询盘

CYW43455LXKUBGT Overview

The CYW43455LXKUBGT is a highly integrated wireless connectivity IC designed for demanding embedded and industrial applications. This device combines multiple wireless protocols within a compact package, enabling robust connectivity for mobile, IoT, and consumer electronics. Its advanced feature set supports high throughput, low power operation, and reliable wireless communication. The CYW43455LXKUBGT is particularly well-suited for applications requiring Wi-Fi, Bluetooth, and Bluetooth Low Energy (BLE) connectivity in a single chip, streamlining board design and reducing BOM complexity. For more information, visit IC Manufacturer.

CYW43455LXKUBGT Technical Specifications

Parameter Value
Wireless Protocols Supported Wi-Fi (IEEE 802.11 a/b/g/n/ac), Bluetooth, Bluetooth Low Energy (BLE)
Operating Voltage 3.3 V
Operating Temperature Range -30??C to +85??C
Package Type FBGA-124
Wi-Fi Frequency Bands 2.4 GHz / 5 GHz Dual Band
Interface SDIO, UART, PCM, I2S
Bluetooth Version Bluetooth 5.0
RoHS Compliance Yes

CYW43455LXKUBGT Key Features

  • Integrated support for Wi-Fi 802.11ac and dual-band operation, delivering high-speed wireless data rates and enhanced data integrity.
  • Incorporates Bluetooth 5.0 and BLE functionality, enabling seamless integration with a wide range of IoT and mobile devices.
  • Low power consumption architecture allows for longer battery life in portable and embedded systems.
  • Compact FBGA-124 package optimizes board space, supporting dense PCB layouts and miniaturized system designs.
  • Industrial temperature range from -30??C to +85??C ensures stable operation in harsh environments.
  • Multiple host interfaces (SDIO, UART, PCM, I2S) provide flexible connectivity options for diverse system architectures.

CYW43455LXKUBGT Advantages vs Typical Alternatives

This wireless IC offers a unique blend of dual-band Wi-Fi and advanced Bluetooth connectivity in a single chip, reducing design complexity and component count. Its support for the latest standards provides superior data rates and robust wireless performance. The extended temperature range and compact package make it highly reliable and adaptable compared to typical alternatives, especially for industrial and high-density applications.

Typical Applications

  • IoT gateways and edge devices benefit from the integrated Wi-Fi and Bluetooth capabilities, supporting secure and high-speed data transfer between sensors, local controllers, and the cloud.
  • Consumer electronics such as smart TVs and set-top boxes use this device for stable wireless streaming and peripheral connectivity.
  • Industrial automation systems leverage its wide operating temperature range and robust protocol support for reliable communication in challenging environments.
  • Wearable devices and mobile handhelds employ the low power and compact form factor for extended battery life and reduced device size.

CYW43455LXKUBGT Brand Info

The CYW43455LXKUBGT is developed and distributed by a leader in wireless semiconductor technology, offering a trusted solution for high-performance wireless connectivity. This product is renowned for its integration of Wi-Fi, Bluetooth, and BLE protocols, making it a preferred choice among manufacturers seeking to streamline design and accelerate time-to-market for connected devices. Its compliance with industry standards and commitment to quality ensure dependable operation across a broad range of use cases.

FAQ

What wireless protocols are supported by the CYW43455LXKUBGT?

This device supports IEEE 802.11 a/b/g/n/ac Wi-Fi, Bluetooth, and Bluetooth Low Energy (BLE), enabling versatile connectivity for a wide variety of embedded and consumer applications. The combination of these protocols in a single chip simplifies hardware design and integration.

Which temperature ranges can the CYW43455LXKUBGT operate within?

The component is specified to operate reliably from -30??C to +85??C, making it suitable for both consumer and industrial environments where temperature fluctuations are common.

What host interfaces are available on this wireless IC?

The device provides multiple host interfaces, including SDIO, UART, PCM, and I2S, offering flexibility in connecting to different microcontrollers and processors while supporting various application requirements.

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产品中间询盘

Is the CYW43455LXKUBGT compliant with environmental regulations?

Yes, it is RoHS compliant, ensuring that it meets international standards for hazardous substances and can be used in environmentally conscious designs without additional concerns.

What makes this device suitable for dense PCB and miniaturized applications?

Its compact FBGA-124 package allows for efficient use of board space, making it ideal for space-constrained designs such as wearables, handhelds, and other tightly integrated electronic systems.

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