CYW30739B2P5TAI051XUMA1 Bluetooth 5.2 SoC Module, QFN Package

  • Enables reliable wireless connectivity, supporting seamless communication between devices in IoT and embedded systems.
  • Bluetooth protocol support allows for efficient data transfer, essential for low-latency applications and device interoperability.
  • Compact package type optimizes PCB space, making it suitable for space-constrained designs and portable products.
  • Ideal for smart home devices, this module simplifies integration and enhances end-user convenience in automation solutions.
  • Manufactured with quality assurance processes to ensure consistent performance and long-term operational stability.
SKU: CYW30739B2P5TAI051XUMA1 Category: Brand:
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产品上方询盘

CYW30739B2P5TAI051XUMA1 Overview

The CYW30739B2P5TAI051XUMA1 is a highly integrated Bluetooth module designed to deliver robust wireless connectivity in demanding industrial and commercial environments. Utilizing advanced Bluetooth Low Energy (BLE) protocols, this device enables reliable data transmission while maintaining low power consumption. Its compact design and industry-standard surface mount packaging make it ideal for space-constrained applications. Targeting engineers and product designers seeking to streamline wireless integration, this module offers a proven solution for next-generation IoT, automation, and smart device projects. For more details, visit IC Manufacturer.

CYW30739B2P5TAI051XUMA1 Technical Specifications

Parameter Value
Part Number CYW30739B2P5TAI051XUMA1
Device Type Bluetooth Module
Protocol Bluetooth Low Energy (BLE)
Mounting Type Surface Mount
Package / Case Standard Module Package
Operating Temperature Range -40??C to +85??C
Power Supply Voltage Supported (see datasheet for details)
Application Segment Industrial, IoT, Smart Devices
Compliance Bluetooth SIG Qualified

CYW30739B2P5TAI051XUMA1 Key Features

  • Integrated Bluetooth Low Energy support enables seamless wireless connectivity for embedded and IoT solutions, reducing external component needs and simplifying design.
  • Surface mount package offers efficient manufacturing and reliable PCB assembly, crucial for automated production lines and high-volume deployments.
  • Wide operating temperature range ensures stable performance in industrial, outdoor, or harsh environmental conditions, expanding application flexibility.
  • Bluetooth SIG qualification assures compliance and interoperability, streamlining certification and product launch cycles.

CYW30739B2P5TAI051XUMA1 Advantages vs Typical Alternatives

This module stands out due to its advanced BLE protocol integration and industrial temperature range, providing engineers with greater flexibility and reliability in deployment. Its robust surface mount design promotes easier assembly and long-term durability compared to many competing solutions. The Bluetooth SIG qualification further ensures trusted interoperability and smooth product certifications, helping reduce time to market for wireless-enabled applications.

Typical Applications

  • Industrial wireless sensor networks, where robust Bluetooth Low Energy connectivity and wide temperature tolerance are critical for monitoring and automation systems in factories or warehouses.
  • IoT gateways and smart home devices, leveraging BLE for secure, low-power communication between connected appliances and control hubs.
  • Asset tracking and logistics solutions, utilizing reliable Bluetooth communication to monitor the location and status of goods in real-time.
  • Healthcare and medical devices that require consistent wireless data transmission and compliance with industry standards for interoperability and safety.

CYW30739B2P5TAI051XUMA1 Brand Info

The CYW30739B2P5TAI051XUMA1 is part of a trusted portfolio of Bluetooth modules known for their advanced integration and industrial-grade reliability. Designed to meet the needs of professional engineers and manufacturers, this product supports robust wireless communication in a range of challenging environments. Its Bluetooth SIG qualification and adherence to industry best practices make it a dependable choice for next-generation IoT, automation, and smart device applications.

FAQ

What is the primary wireless protocol supported by this module?

This device is designed with full support for Bluetooth Low Energy (BLE), which is optimized for low power consumption and reliable short-range wireless communication, making it ideal for modern IoT and industrial connectivity needs.

Can the module operate in industrial environments with wide temperature variations?

Yes, it is specified to function reliably across a wide operating temperature range from -40??C to +85??C, making it suitable for harsh industrial, outdoor, and commercial installations requiring consistent performance.

Is the CYW30739B2P5TAI051XUMA1 compliant with industry Bluetooth standards?

Absolutely. The module is Bluetooth SIG qualified, ensuring it meets industry interoperability and compliance standards, which simplifies certification processes and enables integration into a broad ecosystem of Bluetooth devices.

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产品中间询盘

What are the benefits of the surface mount package for this module?

The surface mount design enhances automated PCB assembly, reduces manual handling, and improves the reliability of connections, which is essential for high-volume manufacturing and long-term product dependability in the field.

Which application segments are best suited for this device?

This module is well-suited for industrial, IoT, smart device, asset tracking, and healthcare applications that demand robust wireless connectivity, low power operation, and reliable performance in diverse environments.

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