CYW20835PB1KML1GGF Bluetooth 5.2 Module, MCU, LGA Package

  • Enables wireless connectivity, allowing devices to communicate and transfer data without physical cables.
  • Supports Bluetooth Low Energy, which reduces power consumption for longer battery life in portable electronics.
  • Compact package design helps minimize board space, ideal for space-constrained applications and integrated solutions.
  • Well-suited for use in smart home products, enabling seamless control and monitoring from mobile devices.
  • Manufactured for consistent performance, reducing risk of system failures in demanding environments.
SKU: CYW20835PB1KML1GGF Category: Brand:
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产品上方询盘

CYW20835PB1KML1GGF Overview

The CYW20835PB1KML1GGF is a robust wireless connectivity solution designed for industrial and commercial environments where reliable Bluetooth Low Energy (BLE) performance is required. This highly integrated IC combines power-efficient operation with versatile communication capabilities, making it suitable for demanding embedded designs. Its advanced features support seamless connectivity, low standby current, and extended product lifetimes. With a compact form factor and precise engineering, this device streamlines development for a wide range of wireless applications. For detailed component sourcing, visit IC Manufacturer.

CYW20835PB1KML1GGF Technical Specifications

Parameter Details
Manufacturer Part Number CYW20835PB1KML1GGF
Package / Case 63-VFBGA, CSPBGA
Type Bluetooth IC
Protocol Bluetooth v5.0
Operating Temperature Range -40??C ~ 85??C
Mounting Type Surface Mount
Core 32-bit MCU
Frequency 2.4GHz ISM Band
Supply Voltage 1.8V

CYW20835PB1KML1GGF Key Features

  • Integrated Bluetooth 5.0 transceiver delivers robust, low-power wireless connectivity, enabling efficient communication in dense radio environments.
  • Wide operating temperature range of -40??C to 85??C supports industrial-grade applications where reliability under harsh conditions is essential.
  • Compact 63-VFBGA package streamlines PCB layout and allows high-density system integration for space-constrained designs.
  • Surface-mount design simplifies automated assembly and reduces manufacturing complexity for OEMs and contract manufacturers.
  • 1.8V supply voltage operation reduces overall system power consumption, extending battery life in portable and IoT devices.
  • 32-bit MCU core enables advanced local processing and protocol stack execution, minimizing host processor load.
  • Support for the 2.4GHz ISM band ensures global compatibility and interoperability with a wide range of Bluetooth-enabled devices.

CYW20835PB1KML1GGF Advantages vs Typical Alternatives

This device stands out from typical Bluetooth IC alternatives by offering a tightly integrated solution with low-power consumption and a broad operating temperature range. Its advanced packaging and on-chip processing capabilities enhance both board-level integration and system reliability, making it a preferred option for designs demanding robust wireless performance and efficient power management.

Typical Applications

  • Industrial sensor nodes: The device enables battery-powered wireless sensors for factory automation, supporting reliable BLE connectivity even in electrically noisy environments.
  • Medical wearable devices: Its low-power design and compact footprint make it ideal for portable health monitoring systems requiring consistent Bluetooth communication.
  • Smart home controllers: The IC is well-suited for integration into intelligent lighting, access control, and HVAC systems, where secure and stable wireless links are critical.
  • Asset tracking: Utilized in logistics and inventory management, the device supports real-time Bluetooth-based tracking and monitoring across large facilities.

CYW20835PB1KML1GGF Brand Info

The CYW20835PB1KML1GGF is part of a well-established Bluetooth IC portfolio, engineered for high reliability and performance in wireless communication applications. This device reflects the brand??s commitment to providing advanced semiconductor solutions that address the needs of industrial, medical, and commercial markets. Its design philosophy emphasizes integration, energy efficiency, and system scalability, ensuring seamless adoption in both legacy and next-generation electronics platforms.

FAQ

What is the main benefit of using the CYW20835PB1KML1GGF in industrial wireless designs?

The main benefit is its robust Bluetooth 5.0 connectivity combined with a wide operating temperature range, allowing for reliable operation in demanding industrial environments where dependable wireless links are essential for automation and monitoring.

Can this Bluetooth IC support applications requiring low power consumption?

Yes, the device operates at 1.8V and features low-power design principles, making it suitable for battery-powered applications such as wearables, portable sensors, and IoT devices that require extended operational lifetimes.

What mounting options are available for the CYW20835PB1KML1GGF?

This IC is provided in a 63-VFBGA CSPBGA package designed for surface mount assembly, which simplifies manufacturing and enables high-density system layouts, especially in compact devices.

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产品中间询盘

Is the CYW20835PB1KML1GGF compatible with global Bluetooth standards?

Yes, it supports Bluetooth version 5.0 and operates in the 2.4GHz ISM band, ensuring broad interoperability and regulatory compliance for worldwide deployment in Bluetooth-enabled systems.

What types of end products are best suited for this Bluetooth IC?

The device is well-suited for industrial sensors, medical wearables, smart home infrastructure, and asset tracking solutions??any application where reliable, low-power Bluetooth communication and robust environmental tolerance are required.

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