CYW20829B0P4EPI200XUMA1 Overview
The CYW20829B0P4EPI200XUMA1 is a versatile Bluetooth module designed for demanding industrial and commercial wireless connectivity applications. This component integrates advanced Bluetooth technology, enabling reliable and robust short-range communication. Its form factor and surface-mount design support streamlined integration into a variety of embedded systems. Engineered for efficiency, the device delivers excellent wireless performance and low power consumption, making it ideal for both battery-powered and always-on systems. For further details and sourcing, visit IC Manufacturer.
CYW20829B0P4EPI200XUMA1 Technical Specifications
| Parameter | Detail |
|---|---|
| Product Category | Bluetooth Modules & Solutions |
| Package / Case | QFN-40 |
| Mounting Style | Surface Mount |
| Operating Temperature | -40??C to +105??C |
| Supply Voltage | 1.8V |
| Core Architecture | ARM Cortex-M33 |
| Core Sub-Architecture | ARMv8-M |
| Wireless Standard | Bluetooth Low Energy (BLE) 5.2 |
| RoHS Status | Compliant |
CYW20829B0P4EPI200XUMA1 Key Features
- Integrated Bluetooth Low Energy 5.2 support delivers high-speed, energy-efficient wireless connectivity for modern IoT and industrial applications.
- Based on the ARM Cortex-M33 core, providing a robust processing platform that ensures secure and responsive performance in embedded environments.
- Operates within a wide temperature range (-40??C to +105??C), supporting use in harsh industrial or outdoor settings without sacrificing reliability.
- Surface-mount QFN-40 package enables compact PCB layouts and streamlined automated assembly processes.
CYW20829B0P4EPI200XUMA1 Advantages vs Typical Alternatives
This Bluetooth module stands out due to its modern BLE 5.2 technology, wide operating temperature range, and RoHS compliance, making it ideal for demanding environments. The ARM Cortex-M33 core architecture offers enhanced processing security and efficiency compared to older cores, while the compact QFN-40 surface-mount package minimizes board space and simplifies manufacturing.
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Typical Applications
- Industrial automation systems requiring reliable wireless communication in electrically noisy or temperature-variable environments benefit from the robust BLE connectivity and wide operating range.
- Consumer IoT devices, such as smart home controllers or wearables, where low power consumption and compact size are essential for extended battery life and user comfort.
- Healthcare monitoring equipment that leverages secure and energy-efficient wireless data transmission for patient monitoring and data logging.
- Asset tracking and logistics solutions, enabling real-time location and status updates in challenging or mobile deployment scenarios.
CYW20829B0P4EPI200XUMA1 Brand Info
The CYW20829B0P4EPI200XUMA1 is part of a proven line of Bluetooth modules recognized for their robust performance and reliability in industrial and commercial applications. This product is engineered to meet stringent regulatory and operational standards, ensuring dependable integration within a wide variety of embedded systems. Its design reflects leading-edge wireless connectivity technology, making it a trusted choice for OEMs and system designers seeking quality, longevity, and compliance.
FAQ
What type of applications is the CYW20829B0P4EPI200XUMA1 best suited for?
This module excels in industrial, commercial, and IoT applications where reliable Bluetooth Low Energy connectivity, compact form factor, and extended operating temperature range are critical. It??s also suitable for battery-powered and space-constrained devices.
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What are the main advantages of the ARM Cortex-M33 core in this module?
The ARM Cortex-M33 core provides advanced security features, efficient processing, and low power operation, making it ideal for secure embedded applications and real-time wireless communications in demanding environments.
Is the CYW20829B0P4EPI200XUMA1 compliant with environmental standards?
Yes, this device is RoHS compliant, ensuring it meets international standards for hazardous substance restrictions and is suitable for use in environmentally conscious applications and markets.
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What are the packaging and mounting options for this device?
The device is offered in a QFN-40 package designed for surface-mount technology (SMT), making it easy to integrate into automated assembly processes and enabling compact PCB layouts in high-density designs.
What wireless standard does the CYW20829B0P4EPI200XUMA1 support?
This module supports Bluetooth Low Energy 5.2, allowing higher data throughput, improved range, and lower power operation compared to previous Bluetooth generations, making it ideal for modern connected products.
