CYW20829B0010XQLA1 Bluetooth 5.3 Module, QFN Package, Wireless MCU

  • Provides wireless connectivity, enabling devices to communicate seamlessly in embedded systems and IoT applications.
  • Supports Bluetooth Low Energy, which allows efficient short-range data exchange with reduced power consumption.
  • CBZ package offers a compact footprint, simplifying PCB layout and saving valuable board space in constrained designs.
  • Ideal for smart home products, where reliable wireless performance enhances user experience and automation capabilities.
  • CYW20829B0010XQLA1 includes features that support consistent operation and stable performance over extended use.
SKU: CYW20829B0010XQLA1 Category: Brand:
Infineon logo
产品上方询盘

CYW20829B0010XQLA1 Overview

The CYW20829B0010XQLA1 is a highly integrated Bluetooth wireless microcontroller, designed for advanced industrial and commercial applications requiring reliable wireless connectivity and efficient power management. Featuring robust processing capabilities, this device delivers a compact footprint and supports demanding operational needs in modern embedded systems. Its optimized architecture ensures stable performance, making it a strong fit for environments prioritizing low power consumption and high integration. To source or learn more about this component, visit IC Manufacturer.

CYW20829B0010XQLA1 Technical Specifications

Parameter Value
Package QFN-40
Mounting Type Surface Mount
Core 32-bit ARM Cortex-M33
Bluetooth Version Bluetooth 5.2
Operating Temperature -40??C to +105??C
Memory RAM and Flash integrated
Pin Count 40
RoHS Status Compliant

CYW20829B0010XQLA1 Key Features

  • Integrated Bluetooth 5.2 support provides efficient wireless communication, enabling robust connectivity for industrial and IoT devices.
  • Based on a 32-bit ARM Cortex-M33 core, offering enhanced processing power and energy efficiency for complex embedded workloads.
  • QFN-40 package allows for compact PCB layouts and facilitates automated high-volume manufacturing.
  • Wide operating temperature range from -40??C to +105??C ensures reliable operation even in harsh industrial environments.

CYW20829B0010XQLA1 Advantages vs Typical Alternatives

Compared to typical Bluetooth microcontrollers, this device offers improved integration with its ARM Cortex-M33 core and extensive wireless protocol support. Its robust thermal tolerance and compact QFN-40 format enhance installation flexibility, while integrated memory and regulatory compliance ensure dependable performance for a range of industrial and commercial applications.

Typical Applications

  • Industrial wireless sensor nodes: The device is ideal for remote monitoring and automation, providing reliable Bluetooth connectivity and low power consumption, which extends battery life and reduces maintenance.
  • Smart home controllers: Its integration capabilities and wireless protocol support make it suitable for seamless communication between smart devices and centralized hubs.
  • Asset tracking and logistics: The microcontroller??s robust wireless features and thermal reliability are beneficial in real-time tracking applications across varying environments.
  • Health and fitness wearables: The compact size and efficient processing make it well-suited for integration into compact, battery-powered wearable electronics.

CYW20829B0010XQLA1 Brand Info

The CYW20829B0010XQLA1 represents a commitment to advanced wireless communication solutions, combining Bluetooth 5.2 technology with a powerful ARM Cortex-M33 core. Its design is tailored for industrial, commercial, and consumer markets requiring secure, efficient, and scalable connectivity. With a strong emphasis on integration and reliability, this product supports a broad spectrum of next-generation embedded applications.

FAQ

What wireless standards does the CYW20829B0010XQLA1 support?

This microcontroller features Bluetooth 5.2 support, allowing for enhanced data rates and improved energy efficiency. This makes it suitable for applications demanding reliable and robust wireless connectivity.

What type of package does the CYW20829B0010XQLA1 use?

It is supplied in a QFN-40 surface-mount package, which is well-suited for high-density PCB designs and automated assembly processes. The compact outline also helps save board space in space-constrained applications.

Is the CYW20829B0010XQLA1 suitable for harsh environments?

Yes, with an operational temperature range from -40??C to +105??C, it is engineered to function reliably in both industrial and commercial settings where extreme temperatures may be encountered.

📩 Contact Us

产品中间询盘

Does this device integrate both RAM and flash memory?

Yes, the device features on-chip RAM and flash memory, which supports efficient program execution and data storage without the need for external memory components, improving reliability and reducing BOM complexity.

Is the CYW20829B0010XQLA1 RoHS compliant?

The device is RoHS compliant, ensuring it meets global environmental and safety standards for hazardous substances, which is essential for worldwide deployment and regulatory approval.

Application

, ,

Save cost and time

Fast global delivery

Original parts guaranteed

Expert after-sale support

Looking for a Better Price?