CYW20829B0000XUMA1 Bluetooth 5.2 Module, Wireless MCU, QFN Package

  • Enables wireless connectivity for embedded systems, allowing devices to communicate without physical connections.
  • Bluetooth functionality supports easy pairing with a wide range of compatible peripherals and sensors.
  • Compact package size helps designers minimize board space requirements in space-constrained applications.
  • Ideal for smart home devices where efficient wireless communication improves user convenience and control.
  • Manufactured to support consistent performance and dependable operation in typical embedded environments.
SKU: CYW20829B0000XUMA1 Category: Brand:
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产品上方询盘

CYW20829B0000XUMA1 Overview

The CYW20829B0000XUMA1 is a high-performance Bluetooth module designed for demanding industrial and commercial wireless applications. Integrating advanced Bluetooth capabilities, this device offers reliable connectivity and robust operation across diverse environments. Its compact footprint, efficient power management, and ease of integration make it ideal for projects requiring low-latency communication and streamlined design workflows. Supporting a wide range of wireless use cases, the CYW20829B0000XUMA1 delivers both flexibility and performance for developers and engineers seeking a dependable embedded Bluetooth solution. For more details, visit IC Manufacturer.

CYW20829B0000XUMA1 Technical Specifications

Parameter Value
Part Number CYW20829B0000XUMA1
Device Type Bluetooth Module
Wireless Standard Bluetooth
Package QFN-40
Mounting Style Surface Mount
Operating Temperature Range -40??C to +85??C
Supply Voltage 1.8V, 3.3V
Core Architecture ARM
Pin Count 40
RoHS Status Compliant

CYW20829B0000XUMA1 Key Features

  • Integrated Bluetooth functionality enables seamless wireless communication, simplifying device networking and reducing design complexity.
  • Surface mount QFN-40 package allows for compact system designs, optimizing PCB space in high-density applications.
  • Wide operating temperature range from -40??C to +85??C ensures reliable performance in both industrial and commercial environments.
  • ARM core architecture supports efficient processing and flexible application development for embedded systems.
  • Multi-voltage supply operation (1.8V and 3.3V) broadens compatibility with various power systems, enhancing design flexibility.
  • RoHS compliance supports environmentally responsible manufacturing and global supply chain requirements.

CYW20829B0000XUMA1 Advantages vs Typical Alternatives

This Bluetooth module stands out due to its wide temperature tolerance, compact QFN-40 package, and robust ARM-based processing. Compared to typical alternatives, it offers superior integration for space-constrained designs and enhanced reliability in harsh operating conditions. Its multi-voltage support and RoHS compliance further streamline integration into diverse application environments.

Typical Applications

  • Industrial wireless sensor networks: Enables real-time data collection and monitoring across factory automation, reducing wiring complexity and improving maintenance efficiency.
  • Medical device connectivity: Supports secure wireless links between diagnostic equipment or patient monitoring systems, ensuring reliable data transmission in clinical settings.
  • Consumer electronics: Used in smart home hubs, remote controls, or wearable devices requiring robust and efficient Bluetooth connectivity.
  • Asset tracking and logistics: Facilitates wireless tracking of inventory and goods throughout supply chains, enhancing visibility and operational control.

CYW20829B0000XUMA1 Brand Info

The CYW20829B0000XUMA1 is developed by a leading manufacturer known for innovation in wireless connectivity and embedded solutions. This Bluetooth module exemplifies a commitment to quality, ease of integration, and long-term reliability. Its design supports a broad range of industrial and commercial applications, allowing engineers to accelerate development cycles while maintaining rigorous standards for performance and compliance.

FAQ

What package type does the CYW20829B0000XUMA1 use, and how does it benefit PCB layout?

This module uses a QFN-40 surface-mount package, which is ideal for compact PCB layouts and high-density assemblies. The QFN format also helps with heat dissipation and supports automated manufacturing processes.

Is the CYW20829B0000XUMA1 suitable for harsh environments?

Yes, with an operating temperature range from -40??C to +85??C, this device is well-suited for industrial and commercial environments where temperature extremes are common, ensuring dependable performance over time.

Does the CYW20829B0000XUMA1 support multiple supply voltages?

It is compatible with both 1.8V and 3.3V supply voltages. This flexibility allows integration into a wide variety of embedded systems and power architectures, simplifying design and system compatibility.

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产品中间询盘

Is the CYW20829B0000XUMA1 RoHS compliant?

Yes, this Bluetooth module is RoHS compliant, making it suitable for products that must meet environmental and global regulatory requirements regarding hazardous substances.

What are some typical use cases for this Bluetooth module?

Common applications include industrial sensor networks, medical device connectivity, consumer electronics, and asset tracking solutions. Its robust wireless capabilities and reliable operation make it a versatile choice for these and similar projects.

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