CYW20829B0000XQLA1 Overview
The CYW20829B0000XQLA1 is a high-performance Bluetooth System-on-Chip (SoC) designed for industrial and commercial wireless applications. With its compact QFN-40 package and advanced connectivity features, this device enables robust, low-power wireless communication in demanding environments. Its integrated capabilities and flexible architecture make it ideal for developers looking to implement secure, efficient Bluetooth connectivity in embedded systems. Discover more about this solution at IC Manufacturer.
CYW20829B0000XQLA1 Technical Specifications
| Parameter | Value |
|---|---|
| Type | Bluetootch SoC |
| Package | QFN-40 |
| Mounting Style | Surface Mount |
| RoHS Status | RoHS Compliant |
| Operating Temperature Range | -40??C to +85??C |
| Core Architecture | 32-bit |
| Connectivity | Bluetooth |
| Manufacturer Standard Lead Time | 12 Weeks |
CYW20829B0000XQLA1 Key Features
- Integrated Bluetooth connectivity, simplifying wireless communication for embedded designs and reducing the need for external modules.
- Industrial temperature range support, ensuring dependable operation in environments from -40??C to +85??C for robust field performance.
- QFN-40 surface-mount package, facilitating compact PCB layouts and efficient automated assembly in high-volume production.
- RoHS compliant construction, supporting eco-friendly design requirements and international regulatory standards.
CYW20829B0000XQLA1 Advantages vs Typical Alternatives
Compared to many standard Bluetooth SoCs, this device offers an optimal balance of integration, industrial temperature support, and compact packaging. Its RoHS compliance and reliable performance across a wide temperature range make it particularly suitable for industrial and commercial applications, where consistent wireless connectivity and regulatory compliance are critical.
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Typical Applications
- Industrial wireless sensor networks, where robust Bluetooth connectivity and wide temperature tolerance enhance system reliability and simplify deployment.
- Commercial automation controllers requiring energy-efficient and compact wireless communication solutions for seamless equipment integration.
- Consumer electronics devices such as smart home sensors and voice assistants, benefitting from the device??s small footprint and streamlined assembly.
- Healthcare or medical monitoring instruments that demand secure, dependable, and standards-compliant Bluetooth communication interfaces.
CYW20829B0000XQLA1 Brand Info
This product is part of a well-established portfolio of Bluetooth connectivity SoCs, designed for demanding industrial and commercial environments. The CYW20829B0000XQLA1 offers a combination of advanced wireless features, robust temperature support, and a compact, surface-mountable QFN-40 package. Its integration and compliance characteristics are tailored to meet the needs of forward-thinking OEMs and system designers who value reliability and efficiency.
FAQ
What is the main advantage of the QFN-40 package for this device?
The QFN-40 package provides a compact form factor, which optimizes board space and supports high-density PCB layouts. Its surface-mount nature also allows for efficient, automated production processes in modern electronics manufacturing.
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Is the CYW20829B0000XQLA1 suitable for harsh industrial environments?
Yes, it operates reliably across a wide industrial temperature range of -40??C to +85??C, making it well-suited for deployment in challenging field conditions or demanding commercial applications.
Does this SoC meet environmental compliance requirements?
Absolutely. The device is RoHS compliant, meaning it adheres to strict international standards for hazardous substance reduction, making it appropriate for environmentally conscious designs and global markets.
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What types of wireless protocols are supported?
This device is tailored for Bluetooth wireless communication, enabling robust connectivity for embedded systems that require reliable, low-power radio interfaces.
How long is the manufacturer standard lead time for this product?
The standard lead time is 12 weeks, allowing OEMs and sourcing specialists to plan production schedules and supply chain logistics with confidence when integrating this Bluetooth SoC.
