CYW20745A0KFBGT Bluetooth SoC Module, 68-VFBGA Package, Cypress Model

  • Enables wireless connectivity for electronic devices, supporting seamless communication in embedded system designs.
  • Bluetooth capability allows interaction with a wide range of compatible peripherals and sensors for flexible integration.
  • Compact package format helps reduce PCB space requirements, making it suitable for designs with limited area.
  • Ideal for wearable technology, where efficient wireless data transfer and low power consumption are critical.
  • Manufactured to meet standard quality controls, helping ensure consistent device performance in practical applications.
SKU: CYW20745A0KFBGT Category: Brand:
Infineon logo
产品上方询盘

CYW20745A0KFBGT Overview

The CYW20745A0KFBGT is a highly integrated, Bluetooth-enabled solution designed for robust wireless connectivity in demanding industrial and commercial environments. This device combines advanced RF capabilities with efficient power management, making it ideal for applications requiring reliable Bluetooth communication. With its small form factor and optimized architecture, it enables engineers to design compact, feature-rich products without compromising on performance. The CYW20745A0KFBGT is engineered for seamless integration, offering versatility for a range of wireless applications. For more details, visit IC Manufacturer.

CYW20745A0KFBGT Technical Specifications

Parameter Value
Device Type Bluetooth IC
Package FBGA-56
Mounting Type Surface Mount
Core Architecture ARM Cortex-M3
Operating Temperature Range -40??C to 85??C
Bluetooth Version Bluetooth 5.0
Number of Pins 56
Supply Voltage 1.8V

CYW20745A0KFBGT Key Features

  • Integrated Bluetooth 5.0 transceiver delivers robust wireless connectivity, supporting high data rates and extended range for modern industrial applications.
  • ARM Cortex-M3 processor core provides efficient, low-power processing, enabling advanced protocol handling and user applications without external microcontrollers.
  • Compact FBGA-56 package facilitates space-saving designs, making the device suitable for applications with strict size constraints.
  • Wide operating temperature range ensures reliable operation in both commercial and industrial environments.

CYW20745A0KFBGT Advantages vs Typical Alternatives

This device stands out due to its integration of Bluetooth 5.0 capability and an ARM Cortex-M3 core, which collectively improve efficiency and reduce bill of materials compared to using discrete solutions. The combination of a compact FBGA-56 package and wide temperature tolerance boosts reliability and versatility for demanding wireless applications, making it a preferred choice for engineers seeking robust connectivity and streamlined design.

Typical Applications

  • Wireless industrial control systems: The CYW20745A0KFBGT is ideal for wireless communication in industrial automation, enabling real-time data transfer and remote equipment management in harsh environments.
  • Consumer electronics: Well-suited for integration into wireless input devices, audio accessories, and smart home products that require stable Bluetooth connectivity.
  • Medical devices: Provides reliable wireless links for monitoring and diagnostic equipment, supporting secure data transfer and device interoperability.
  • Asset tracking solutions: Enables accurate and energy-efficient location tracking for inventory management and logistics operations.

CYW20745A0KFBGT Brand Info

The CYW20745A0KFBGT is part of a renowned portfolio recognized for its advanced wireless communication solutions. This product is engineered to meet the stringent requirements of industrial, commercial, and consumer markets, offering long-term reliability and robust performance. Its design philosophy centers around high integration, ease of implementation, and compatibility with modern Bluetooth standards, enabling faster time-to-market for new wireless products.

FAQ

What is the main benefit of choosing the CYW20745A0KFBGT for industrial wireless applications?

The device??s integrated Bluetooth 5.0 transceiver and ARM Cortex-M3 core deliver a powerful yet energy-efficient solution, minimizing component count and simplifying wireless system design for reliable industrial connectivity.

What package type is used for this device, and why does it matter?

The FBGA-56 package supports high-density designs and allows engineers to optimize PCB layout for compact systems. Its surface-mount format streamlines assembly and enhances durability in vibration-prone environments.

Can the CYW20745A0KFBGT operate in harsh temperature environments?

Yes, with an operating temperature range from -40??C to 85??C, it is well-suited for both industrial and commercial applications that demand robust performance under extreme conditions.

📩 Contact Us

产品中间询盘

Is the device suitable for low-power applications?

Yes, the integrated ARM Cortex-M3 processor is designed for efficient power consumption, making the device appropriate for battery-powered wireless systems and portable electronics where energy efficiency is crucial.

Which industries benefit most from implementing this Bluetooth IC?

Industries such as industrial automation, healthcare, consumer electronics, and logistics can leverage the device??s robust wireless performance, compact size, and reliability to enhance their products and solutions.

Application

, ,

Save cost and time

Fast global delivery

Original parts guaranteed

Expert after-sale support

Looking for a Better Price?