CYW20738A2KML3GT Overview
The CYW20738A2KML3GT is a versatile integrated circuit designed for demanding wireless connectivity applications. This device combines robust performance with a compact footprint, making it suitable for space-constrained designs requiring reliable Bluetooth communications. Its advanced packaging and optimized power characteristics enable seamless integration into industrial, medical, and consumer products. By leveraging proven silicon technology, the product delivers consistent, high-quality operation and supports developers in reducing time-to-market for wireless-enabled devices. For additional details or sourcing requirements, visit IC Manufacturer.
CYW20738A2KML3GT Technical Specifications
| Parameter | Value |
|---|---|
| Manufacturer Part Number | CYW20738A2KML3GT |
| Package / Case | 32-VFQFN Exposed Pad |
| Operating Temperature Range | -40??C to +85??C |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Core Architecture | Bluetooth |
| Lead Free | Yes |
CYW20738A2KML3GT Key Features
- Integrated Bluetooth functionality, enabling reliable wireless communication for embedded systems and IoT devices seeking robust connectivity.
- Compact 32-VFQFN Exposed Pad package reduces overall board space, allowing for high-density designs in space-limited environments.
- Wide operating temperature range from -40??C to +85??C supports deployment in both consumer and industrial settings, ensuring operational stability.
- RoHS compliant and lead-free construction simplifies compliance with global environmental regulations and supports sustainable manufacturing.
CYW20738A2KML3GT Advantages vs Typical Alternatives
This device stands out due to its combination of a compact QFN package, broad temperature tolerance, and integrated Bluetooth core, providing a balance of reliability and flexibility. Its RoHS-compliant, lead-free build ensures environmentally responsible sourcing, while the surface-mount design streamlines automated assembly compared to alternatives requiring more complex handling or larger footprints.
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Typical Applications
- Wireless sensor nodes: Ideal for space-constrained sensing applications where reliable Bluetooth connectivity and low power operation are essential, such as in industrial automation or building management systems.
- Medical devices: Suitable for portable and wearable devices requiring robust wireless links and compliance with strict environmental standards.
- Consumer electronics: Enables Bluetooth communication in smart home, entertainment, and personal electronics, supporting seamless device pairing and data transfer.
- Asset tracking solutions: Used in logistics and supply chain monitoring equipment for real-time wireless tracking and reporting.
CYW20738A2KML3GT Brand Info
The CYW20738A2KML3GT is part of a trusted portfolio of wireless connectivity solutions, engineered for high performance and reliability. This product leverages mature semiconductor processes and advanced packaging to address the evolving needs of embedded designers. It is recognized for its compliance with industry standards, helping OEMs and ODMs accelerate development cycles and ensure consistent end-product quality.
FAQ
What package type does the CYW20738A2KML3GT use, and why is it beneficial?
This device is provided in a 32-VFQFN Exposed Pad package, which offers a compact footprint and excellent thermal performance. The format is advantageous for applications where board space is limited and efficient heat dissipation is critical.
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Is the CYW20738A2KML3GT suitable for industrial temperature environments?
Yes, it supports an operating temperature range from -40??C to +85??C, making it well-suited for both industrial and extended consumer applications that require reliability under varying environmental conditions.
How does RoHS compliance benefit users of this device?
RoHS compliance ensures that the device meets strict global environmental standards, which is essential for manufacturers selling products in regulated markets and for companies focused on sustainability and hazardous substance reduction.
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What mounting method is recommended for the CYW20738A2KML3GT?
This component is designed for surface mount technology (SMT), enabling high-speed automated PCB assembly and reliable soldering, which are key for efficient production in modern electronics manufacturing.
What are typical use cases for this wireless IC?
Common use cases include integration into wireless sensor networks, medical devices, consumer electronics, and asset tracking products??anywhere robust Bluetooth connectivity and a compact, reliable solution are required.
