CYW20736ET Bluetooth Low Energy SoC, 32-QFN Package

  • Enables wireless connectivity for devices, simplifying data transfer and communication without physical cables.
  • Supports Bluetooth technology, allowing seamless integration with a wide range of compatible devices and accessories.
  • Compact package saves board space, making it suitable for small or portable electronic products.
  • Ideal for use in smart home controls, providing stable wireless links for remote operation and monitoring.
  • Manufactured to meet industry standards, ensuring consistent performance and reliable operation in various environments.
SKU: CYW20736ET Category: Brand:
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产品上方询盘

CYW20736ET Overview

The CYW20736ET is a highly integrated Bluetooth Low Energy (BLE) solution designed to meet the demanding requirements of modern wireless applications. Featuring a compact QFN-32 package and robust performance across a wide industrial temperature range, this device enables efficient wireless connectivity for a host of embedded systems and IoT products. With its low power consumption and reliable radio performance, it is ideal for battery-powered designs where longevity and consistent operation are critical. For more technical details and sourcing information, visit IC Manufacturer.

CYW20736ET Technical Specifications

Attribute Value
Type Bluetooth Low Energy (BLE) IC
Package / Case QFN-32
Operating Temperature Range -40??C to +85??C
Mounting Type Surface Mount
Core Architecture Single-core
Wireless Standard Bluetooth 4.1 Low Energy
Supply Voltage 2.3V to 3.6V
Interface UART, SPI, I2C, PWM
Input/Output Pins Up to 25 configurable I/Os

CYW20736ET Key Features

  • Integrated Bluetooth Low Energy radio enables reliable wireless communication, reducing the need for external RF components and simplifying design.
  • Wide industrial temperature range ensures stable operation in harsh environments, making it suitable for demanding industrial and commercial applications.
  • Low power consumption supports extended battery life in portable and IoT devices, minimizing maintenance and replacement intervals.
  • Flexible I/O options, including UART, SPI, I2C, and PWM, facilitate seamless integration with a broad range of sensors and peripherals.
  • Compact QFN-32 packaging allows for space-efficient PCB layouts in size-constrained applications.

CYW20736ET Advantages vs Typical Alternatives

This BLE IC stands out due to its combination of industrial temperature support, compact QFN-32 footprint, and versatile interface options. Compared to typical alternatives, it offers greater integration and flexibility for developers, along with reliable performance in environments where temperature extremes or space limitations would pose challenges for less robust solutions. Its low power consumption further enhances suitability for battery-operated products.

Typical Applications

  • Wireless sensor nodes: Enables low-power, reliable BLE connectivity for distributed sensor networks in industrial automation, building management, or environmental monitoring systems.
  • Wearable electronics: Provides efficient Bluetooth communication for fitness trackers, health monitors, or smart clothing, where compact size and battery life are priorities.
  • Asset tracking devices: Supports integration in tags or beacons for inventory management and logistics, offering dependable performance in varying environmental conditions.
  • Remote controls and smart home devices: Delivers robust BLE functionality for remote user interfaces and home automation endpoints, streamlining wireless control and connectivity.

CYW20736ET Brand Info

The CYW20736ET is part of a trusted family of Bluetooth Low Energy products engineered for reliable wireless performance and versatile integration. Designed to address the needs of industrial, commercial, and consumer markets, this device leverages proven BLE technology in a compact and durable package. Its flexible architecture and broad temperature tolerance reflect a commitment to quality, enabling designers to build next-generation wireless solutions with confidence.

FAQ

What package type does the CYW20736ET use, and why is it suitable for space-constrained designs?

This device is offered in a QFN-32 package, which is known for its compact footprint and ease of surface mount assembly. This makes it an excellent choice for applications where PCB space is limited but robust BLE connectivity is required.

Can the CYW20736ET operate reliably in industrial environments?

Yes, it is rated for operation across a wide temperature range from -40??C to +85??C. This ensures reliable performance in industrial settings where environmental conditions may fluctuate significantly.

What types of interfaces are supported by this BLE IC?

The solution provides a variety of standard interfaces, including UART, SPI, I2C, and PWM. These enable easy connection with different sensors, actuators, and other system components, supporting flexible design approaches.

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产品中间询盘

Is the CYW20736ET suitable for battery-powered applications?

Absolutely. Its low power consumption profile is specifically designed to extend battery life in portable and IoT devices. This reduces the frequency of battery replacements and overall maintenance costs.

What makes this device a standout option for developers compared to other BLE solutions?

The combination of industrial temperature tolerance, compact QFN-32 packaging, and a comprehensive set of I/O interfaces makes it especially versatile. These features allow engineers to address challenging design constraints without sacrificing wireless performance or integration flexibility.

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