CYW20736A1KML2G Bluetooth Low Energy SoC, 32-QFN Package

  • Enables Bluetooth wireless connectivity, allowing easy integration into devices for short-range data communication.
  • Features an integrated ARM Cortex-M3 core, supporting efficient processing for embedded control tasks.
  • Offered in a compact LGA package, saving valuable board space in space-constrained designs.
  • Ideal for wearable electronics, helping designers add low-energy Bluetooth features to compact consumer products.
  • Manufactured to meet industry standards, supporting consistent performance in a range of operating environments.
SKU: CYW20736A1KML2G Category: Brand:
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产品上方询盘

CYW20736A1KML2G Overview

The CYW20736A1KML2G is a versatile Bluetooth low energy (BLE) wireless microcontroller designed for modern industrial and consumer connectivity needs. This module integrates a Bluetooth transceiver and a powerful processing core in a compact 40-VFBGA package, making it suitable for space-constrained applications. Its 2.4 GHz RF capability enables efficient wireless data transfer, while its robust temperature tolerance ensures stable operation in demanding environments. The device is RoHS compliant, reflecting responsible manufacturing. For engineers seeking reliable BLE connectivity with integrated processing, this component delivers a streamlined solution for innovative product designs. IC Manufacturer

CYW20736A1KML2G Technical Specifications

Parameter Value
Function Bluetooth Low Energy (BLE) Module
Core Integrated Microcontroller
RF Frequency 2.4 GHz
Package Type 40-VFBGA (Very Fine Ball Grid Array)
Mounting Style Surface Mount
Operating Temperature Range -40??C to +85??C
RoHS Status RoHS Compliant
Halogen Free Yes
ECCN 5A002.a.1

CYW20736A1KML2G Key Features

  • Integrated Bluetooth Low Energy transceiver for reliable short-range wireless communication, reducing the need for external RF circuitry and streamlining PCB layouts.
  • Wide operating temperature range from -40??C to +85??C, ensuring dependable performance in industrial, outdoor, and automotive environments.
  • Compact 40-VFBGA package supports high-density designs, making it ideal for applications where PCB space is at a premium.
  • RoHS compliance and halogen-free construction enable environmentally responsible product development and global market access.
  • Surface mount technology simplifies automated assembly and improves mechanical reliability in mass production.
  • Precise 2.4 GHz RF operation delivers consistent connectivity and data transfer for a variety of wireless devices.

CYW20736A1KML2G Advantages vs Typical Alternatives

Compared to typical alternatives, this BLE microcontroller stands out due to its integrated design, combining RF transceiver and processing in one compact package. Its broad operating temperature range and RoHS-compliant, halogen-free construction enhance reliability and sustainability. The surface-mount 40-VFBGA format optimizes board space, while the 2.4 GHz frequency ensures robust wireless performance in demanding industrial and consumer applications.

Typical Applications

  • Wireless sensor nodes in industrial automation: The integrated BLE and microcontroller core enable cost-effective, low-power wireless sensor modules that can operate reliably across wide temperature ranges for process monitoring and control.
  • Wearable health and fitness devices: Its compact footprint and efficient RF connectivity support high-density, battery-operated fitness trackers and medical monitoring products.
  • Smart home automation systems: Enables secure wireless communication between devices such as door locks, thermostats, and lighting controls, leveraging the 2.4 GHz BLE standard.
  • Asset tracking and inventory management: The module’s reliable BLE capabilities make it suitable for compact tracking tags or beacons used in logistics, warehousing, or retail environments.

CYW20736A1KML2G Brand Info

The CYW20736A1KML2G represents a reliable, high-integration Bluetooth low energy solution designed for seamless connectivity in industrial and consumer products. Manufactured to meet strict RoHS and halogen-free requirements, this device offers a blend of robust wireless technology and compact microcontroller integration. The 40-VFBGA package and broad temperature range support flexible, high-density system designs, while its surface-mount compatibility ensures efficient production. This module is ideal for engineers seeking proven BLE performance and environmental compliance in a diverse range of wireless applications.

FAQ

What packaging format is used for the CYW20736A1KML2G, and what are its benefits?

This device comes in a 40-VFBGA (Very Fine Ball Grid Array) package. The VFBGA format is advantageous for engineers because it allows for high pin count in a small footprint, enabling compact board layouts and supporting high-density designs, especially important in space-constrained applications.

Is the CYW20736A1KML2G compliant with environmental standards?

Yes, it is fully RoHS compliant and halogen-free. This ensures that the device meets global environmental safety requirements, supporting manufacturers?? efforts to design eco-friendly products that can be marketed worldwide.

What core technology does the CYW20736A1KML2G use for wireless connectivity?

The component features an integrated Bluetooth Low Energy (BLE) transceiver operating at 2.4 GHz. This enables efficient, reliable short-range wireless communication, which is essential for modern IoT, industrial, and consumer electronics applications.

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产品中间询盘

Can the CYW20736A1KML2G operate in outdoor or industrial environments?

Yes, its operating temperature range is from -40??C to +85??C. This wide range ensures the device delivers consistent performance in harsh industrial, automotive, and outdoor settings without risk of thermal failure.

What assembly method is recommended for this device?

The module is designed for surface mount technology (SMT). SMT streamlines automated production processes, improves mechanical reliability, and is well suited for high-volume manufacturing of electronic assemblies.

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