CYW20734UA2KFFB3G Bluetooth Module SoC, UART, QFN Package

  • Enables wireless connectivity for smart devices, allowing convenient and flexible device communication.
  • Compatible with Bluetooth technology, which ensures seamless connections with a wide range of peripherals.
  • Compact package design helps minimize board space, supporting sleek and portable product layouts.
  • Ideal for use in home automation systems, making it easier to control devices remotely.
  • Manufactured for consistent performance, ensuring dependable operation across various environments.
SKU: CYW20734UA2KFFB3G Category: Brand:
Infineon logo
产品上方询盘

CYW20734UA2KFFB3G Overview

The CYW20734UA2KFFB3G is a Bluetooth integrated circuit designed for robust short-range wireless connectivity in industrial and commercial applications. With a high level of integration, it supports efficient power management and flexible interface options, enabling reliable, low-power wireless communication. Targeted for demanding environments, this device offers stable performance, making it suitable for embedded systems, IoT nodes, and connected industrial devices. Its compact module form factor further simplifies system integration and accelerates time-to-market for OEMs and design engineers. For more technical details, visit IC Manufacturer.

CYW20734UA2KFFB3G Technical Specifications

Parameter Value
Part Number CYW20734UA2KFFB3G
Module/IC Type Bluetooth Transceiver Module
Wireless Standard Bluetooth
Core Architecture 32-bit
Package Module
Mounting Type Surface Mount
Operating Temperature Range -40??C to +85??C
Interface UART, SPI, I2C
RoHS Status Compliant

CYW20734UA2KFFB3G Key Features

  • Integrated Bluetooth transceiver enables wireless connectivity, reducing the need for external RF components and lowering BOM complexity.
  • Wide operating temperature range from -40??C to +85??C supports reliable operation in industrial and harsh outdoor environments.
  • Multiple I/O interfaces, including UART, SPI, and I2C, allow seamless integration with a broad range of microcontrollers and peripherals.
  • Surface mount module design streamlines assembly in high-density PCB layouts and supports automated manufacturing.

CYW20734UA2KFFB3G Advantages vs Typical Alternatives

This device stands out due to its high integration, which minimizes external component requirements and simplifies system design. Its wide temperature tolerance and robust Bluetooth connectivity offer greater reliability and flexibility compared to basic wireless ICs. The versatile interface support and compact module package further reduce development time and enhance product durability, making it a preferred choice for industrial-grade wireless applications.

Typical Applications

  • Industrial wireless sensor networks: This device can be used to wirelessly connect distributed sensors and controllers in manufacturing plants, enabling real-time data acquisition and process optimization.
  • IoT gateways and nodes: With its integrated Bluetooth transceiver, the module facilitates secure and efficient data transfer in smart home, building automation, and remote monitoring solutions.
  • Asset tracking systems: The module??s reliable radio performance makes it suitable for asset management, inventory tracking, and logistics monitoring in warehouses and distribution centers.
  • Medical and fitness devices: Its surface mount form factor and low power consumption are ideal for integration into health monitoring wearables and remote patient care equipment.

CYW20734UA2KFFB3G Brand Info

This module is produced by a leading manufacturer specializing in wireless communication solutions for embedded and industrial markets. The product is engineered to deliver reliable Bluetooth connectivity within a compact and highly integrated form factor. Its robust design and compliance with environmental standards ensure suitability for a wide range of professional applications, supporting engineers and OEMs in developing next-generation wireless systems.

FAQ

What kind of wireless communication does the CYW20734UA2KFFB3G support?

This module is specifically designed for Bluetooth wireless communication, providing stable and efficient connectivity for short-range device-to-device data exchange in a wide array of applications.

Is the CYW20734UA2KFFB3G suitable for harsh environments?

Yes, with an operating temperature range from -40??C to +85??C, this device is well-suited for use in industrial and outdoor settings where wide temperature variations are common.

What types of interfaces are available for connecting to host controllers?

The module offers UART, SPI, and I2C interfaces, allowing flexible integration with various microcontrollers and host processors for different system requirements.

📩 Contact Us

产品中间询盘

Can this module be used in automated manufacturing processes?

Absolutely. Its surface mount module package is optimized for automated assembly, making it ideal for high-volume PCB production lines and reducing manual handling requirements.

Is the CYW20734UA2KFFB3G compliant with environmental regulations?

Yes, the module is RoHS compliant, ensuring it meets current environmental standards for hazardous substance reduction in electronic components.

Application

, ,

Save cost and time

Fast global delivery

Original parts guaranteed

Expert after-sale support

Looking for a Better Price?