CYW20733A3KFB1GT Bluetooth Module, Wireless MCU, QFN-40 Package

  • Enables Bluetooth wireless connectivity, allowing seamless short-range device communication for data transfer and control.
  • Designed in a compact package, saving PCB space and supporting integration into small electronic devices.
  • Supports battery-powered applications by offering efficient power management and reduced energy consumption.
  • Suitable for use in wireless peripherals, enabling untethered operation and user convenience in everyday environments.
  • Manufactured to standard industry specifications for consistent quality and dependable long-term performance.
SKU: CYW20733A3KFB1GT Category: Brand:
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产品上方询盘

CYW20733A3KFB1GT Overview

The CYW20733A3KFB1GT is a highly integrated Bluetooth solution designed for robust performance in wireless communication applications. Featuring advanced connectivity and efficient design, this device supports reliable, low-power operation for embedded systems. Its compact footprint makes it ideal for space-constrained designs, while its technical versatility addresses a range of industrial and consumer use cases. For engineers and sourcing specialists, this component enables streamlined development of Bluetooth-enabled products, supporting both innovation and rapid time-to-market. For more details, visit IC Manufacturer.

CYW20733A3KFB1GT Technical Specifications

Parameter Value
Type Bluetooth IC
Package / Case 40-QFN
Mounting Type Surface Mount
Operating Temperature Range -30??C to +85??C
Core Architecture ARM Cortex-M3
Bluetooth Specification Bluetooth 4.1
Supply Voltage 1.8V
RoHS Compliance Yes

CYW20733A3KFB1GT Key Features

  • Integrated ARM Cortex-M3 core delivers efficient processing for wireless applications, supporting advanced Bluetooth communication with low power consumption.
  • Bluetooth 4.1 compliance ensures interoperability and compatibility with a wide ecosystem of wireless devices, which simplifies integration into existing systems.
  • Small 40-QFN package allows for high-density PCB layouts, enabling compact device designs without sacrificing functionality or reliability.
  • Wide operating temperature range from -30??C to +85??C supports deployment in demanding industrial and commercial environments.

CYW20733A3KFB1GT Advantages vs Typical Alternatives

This device stands out due to its highly integrated ARM Cortex-M3 core and Bluetooth 4.1 support, combining processing efficiency with robust connectivity. The compact 40-QFN package and broad temperature range offer superior flexibility and reliability compared to many standard Bluetooth ICs, making it an optimal choice for modern wireless solutions across industrial and consumer applications.

Typical Applications

  • Wireless sensor networks: The device enables reliable Bluetooth communication for distributed sensor nodes, supporting real-time data acquisition and wireless monitoring in industrial automation or building management systems.
  • Consumer electronics: Suitable for integration into Bluetooth-enabled gadgets such as fitness trackers, wireless keyboards, or smart home controllers, where compact design and energy efficiency are essential.
  • Medical devices: Its robust operating range and compliance make it a fit for medical monitoring equipment that requires dependable, low-power wireless connectivity for patient data transmission.
  • Asset tracking and logistics: The solution can be used in tags or beacons for tracking goods and assets throughout supply chains, delivering secure and efficient wireless identification and status updates.

CYW20733A3KFB1GT Brand Info

This product is part of a reputable line of Bluetooth integrated circuits renowned for their reliability, performance, and versatility in wireless communication. The CYW20733A3KFB1GT is engineered for developers seeking scalable and robust Bluetooth solutions in industrial, commercial, and consumer applications. Its design embodies a commitment to quality and compliance, ensuring it meets the requirements of modern wireless systems with ease of integration and long-term availability.

FAQ

What package type does the CYW20733A3KFB1GT use, and why is it beneficial?

The device is housed in a 40-QFN (Quad Flat No-lead) package, which is beneficial for reducing board space and supporting high-density layouts. This makes it suitable for compact system designs where space efficiency is essential.

What core architecture powers this Bluetooth device?

The CYW20733A3KFB1GT utilizes an ARM Cortex-M3 core, providing a balance of processing performance and energy efficiency. This enables it to handle complex wireless communication tasks while maintaining low power operation.

Is this device compliant with current environmental standards?

Yes, it is RoHS compliant, ensuring that it meets international environmental and safety standards. This is important for manufacturers who prioritize sustainability and regulatory compliance in their products.

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产品中间询盘

What Bluetooth version does this part support and what does that mean for compatibility?

It supports Bluetooth 4.1, which offers improved coexistence with other wireless protocols and enhanced device connectivity. This ensures compatibility with a broad range of Bluetooth-enabled products and ecosystems.

In what temperature environments can this device reliably operate?

The CYW20733A3KFB1GT operates in a wide temperature range from -30??C to +85??C. This allows for reliable performance in both harsh industrial environments and standard commercial or consumer settings.

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