CYW20730A1KFBG Overview
The CYW20730A1KFBG is a Bluetooth IC solution designed for robust short-range wireless connectivity in embedded and industrial applications. This device integrates advanced radio functionality and protocol support within a compact 48-VFBGA package, facilitating streamlined designs and efficient board layout. Ideal for projects requiring reliable, low-power Bluetooth communication, it delivers essential interoperability while supporting broad deployment in IoT, consumer electronics, and industrial automation systems. For sourcing and technical details, refer to IC Manufacturer.
CYW20730A1KFBG Technical Specifications
| Parameter | Value |
|---|---|
| Device Type | Bluetooth IC |
| Package | 48-VFBGA |
| Mounting Style | Surface Mount |
| Lead-Free Status | RoHS Compliant |
| Operating Temperature Range | -40??C to +85??C |
| Core Functionality | Bluetooth Connectivity |
| Pin Count | 48 |
| Form Factor | Very Fine Ball Grid Array (VFBGA) |
CYW20730A1KFBG Key Features
- Integrated Bluetooth radio enables reliable wireless communication, reducing system complexity and board space requirements.
- Wide operating temperature range from -40??C to +85??C ensures consistent performance in both industrial and consumer environments.
- Compact 48-ball VFBGA package supports high-density designs and streamlined PCB layouts for modern electronics.
- RoHS compliance guarantees suitability for global markets and environmentally conscious manufacturing processes.
CYW20730A1KFBG Advantages vs Typical Alternatives
This Bluetooth IC stands out by offering a compact VFBGA footprint and wide temperature support, making it easier to integrate into dense or harsh-environment designs. Its RoHS-compliant construction and robust protocol capabilities support high reliability and broad interoperability, giving engineers a dependable and efficient connectivity solution compared to traditional discrete or larger form factor wireless modules.
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Typical Applications
- Industrial wireless control systems: Enables secure Bluetooth connectivity in factory automation, robotics, or remote sensor solutions, where robust performance and compact size are essential.
- Consumer electronics: Facilitates wireless communication in smart home devices, wearables, or health monitors requiring dependable Bluetooth integration.
- IoT sensor nodes: Supports low-power, short-range data transfer for distributed sensing applications in smart environments or asset tracking.
- Embedded control modules: Provides wireless interface options for custom embedded solutions in automotive, medical, or security devices.
CYW20730A1KFBG Brand Info
The CYW20730A1KFBG is part of a portfolio of advanced Bluetooth integrated circuits, designed to deliver reliable connectivity in demanding applications. This specific model combines a small-footprint package with industrial-grade temperature support, targeting engineers who require robust wireless solutions that are easy to integrate. Its compliance with leading industry standards further enhances its suitability for a broad range of projects, underscoring the brand??s commitment to quality and interoperability in wireless communications.
FAQ
What package type does the CYW20730A1KFBG use, and how does it benefit PCB design?
This device is offered in a 48-ball VFBGA (Very Fine Ball Grid Array) package. The VFBGA format allows for high pin density and efficient use of board space, enabling more compact, integrated system designs and enhancing overall signal integrity in complex layouts.
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Is the CYW20730A1KFBG suitable for industrial temperature environments?
Yes, the device is specified for an operating temperature range of -40??C to +85??C, making it well-suited for both industrial and consumer applications where temperature extremes are common and consistent performance is required.
Does this Bluetooth IC comply with environmental regulations for electronics manufacturing?
Absolutely. The CYW20730A1KFBG is RoHS compliant, which means it meets global standards for restricting hazardous substances, simplifying international product development and ensuring environmentally responsible manufacturing practices.
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What mounting method is recommended for the CYW20730A1KFBG?
The IC is designed for surface mount technology (SMT), which streamlines the assembly process, supports automated manufacturing, and helps achieve reliable solder joints necessary for high-performance wireless modules.
What types of products or systems benefit most from using this Bluetooth IC?
This device is ideal for any system requiring compact, reliable Bluetooth connectivity??such as industrial automation controls, smart consumer devices, IoT nodes, and embedded wireless modules. Its features make it particularly valuable where space, reliability, and global compliance are priorities.
