CYW20721B2KWB9GT Bluetooth Module, Wireless SoC, 40-QFN Package

  • Enables wireless communication, allowing devices to connect and exchange data without physical cables.
  • Supports Bluetooth technology, which ensures compatibility with a wide range of wireless peripherals and devices.
  • Offered in a compact BGA package, making it suitable for designs with limited board space.
  • Ideal for use in smart home products, simplifying wireless control and device integration.
  • Manufactured to meet industry quality standards, promoting stable operation and long-term reliability.
SKU: CYW20721B2KWB9GT Category: Brand:
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CYW20721B2KWB9GT Overview

The CYW20721B2KWB9GT is a specialized Bluetooth module designed for robust wireless communication in industrial and commercial environments. It offers reliable performance and streamlined connectivity for Bluetooth-enabled applications, supporting modern requirements in IoT, automation, and wireless control systems. With its optimized architecture and feature set, this device enables efficient design and integration for engineers seeking dependable Bluetooth solutions. This component is ideal for projects demanding low power consumption and consistent data transfer quality. For more details, visit IC Manufacturer.

CYW20721B2KWB9GT Technical Specifications

Parameter Value
Product Type Bluetooth Module
Package / Case 63-WFBGA, WLCSP
Mounting Type Surface Mount
Interface UART, SPI, I2C, PCM, I2S
Operating Temperature -40??C to +85??C
Core Architecture ARM Cortex-M4
Wireless Standard Bluetooth 5.0
RoHS Status RoHS Compliant

CYW20721B2KWB9GT Key Features

  • Advanced Bluetooth 5.0 support delivers high-speed, energy-efficient wireless communication, enhancing data throughput and range in demanding environments.
  • ARM Cortex-M4 core architecture provides processing efficiency, enabling complex operations and responsive performance for sophisticated applications.
  • Multiple communication interfaces (UART, SPI, I2C, PCM, I2S) facilitate flexible system integration and simplify connections to peripheral devices.
  • Wide operating temperature range (-40??C to +85??C) ensures reliable operation in both industrial and extended temperature environments.
  • Compact 63-WFBGA, WLCSP package enables high-density board layouts and fits in space-constrained designs.
  • Surface mount compatibility streamlines automated manufacturing and improves assembly consistency.
  • RoHS compliance supports environmentally responsible production and global regulatory conformity.

CYW20721B2KWB9GT Advantages vs Typical Alternatives

This Bluetooth module stands out with its combination of Bluetooth 5.0 support and ARM Cortex-M4 processing, providing a balance of performance, power efficiency, and integration flexibility. Its wide operating temperature range and multiple interface options make it a reliable and adaptable choice, especially for industrial and commercial applications where typical modules may fall short in robustness or connectivity.

Typical Applications

  • Industrial Wireless Control: Enables robust Bluetooth connectivity for factory automation, sensor networks, and machinery monitoring, supporting seamless data transfer and remote operation in harsh environments.
  • IoT Gateways and Hubs: Integrates easily into IoT edge devices, allowing secure and efficient bridging of Bluetooth devices to local networks or cloud platforms.
  • Asset Tracking Systems: Facilitates real-time location and status monitoring of equipment, inventory, or personnel using Bluetooth communication for reliable asset management.
  • Consumer and Commercial Electronics: Powers wireless features in smart home devices, handheld terminals, and point-of-sale systems where compact size and stable connectivity are critical.

CYW20721B2KWB9GT Brand Info

The CYW20721B2KWB9GT is engineered to deliver reliable Bluetooth performance in challenging environments. Its manufacturer is recognized for its expertise in wireless semiconductors and embedded solutions, providing components that serve the needs of industrial, commercial, and consumer markets. This module exemplifies their focus on innovation, integration, and quality, making it a trusted choice for projects requiring advanced Bluetooth connectivity and robust performance.

FAQ

What package type is available for the CYW20721B2KWB9GT?

This device comes in a 63-WFBGA, WLCSP package, which is well-suited for applications requiring high component density and compact board layouts. The package type also supports automated surface mount manufacturing processes.

What operating temperature range does the CYW20721B2KWB9GT support?

The module operates reliably from -40??C to +85??C, making it suitable for both standard and demanding industrial environments. This wide range ensures stable performance in applications exposed to extreme temperatures.

What wireless standard does this Bluetooth module support?

It is designed for Bluetooth 5.0, providing improved data rates, extended range, and energy efficiency compared to earlier Bluetooth versions. This makes it ideal for modern wireless communication requirements.

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Which interfaces are supported for system integration?

The CYW20721B2KWB9GT supports UART, SPI, I2C, PCM, and I2S interfaces. These options offer flexibility for connecting to a wide variety of microcontrollers and peripheral devices in embedded systems.

Is the CYW20721B2KWB9GT RoHS compliant?

Yes, this module is RoHS compliant, aligning with global environmental standards for hazardous substances. This facilitates its use in products sold worldwide and supports responsible manufacturing practices.

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