CYW20721B2KUMLGT Bluetooth SoC Module, LGA Package, Wireless Connectivity Chip

  • Provides Bluetooth connectivity, enabling seamless wireless communication for devices and reducing the need for cables.
  • This model, CYW20721B2KUMLGT, supports Bluetooth Low Energy for efficient data transfer and lower power consumption.
  • Its compact package design helps conserve board space, making it suitable for space-constrained applications.
  • Ideal for smart home controllers, it supports reliable device pairing and user-friendly wireless setup.
  • Manufactured to meet standard electronic component quality guidelines, ensuring consistent performance in embedded systems.
SKU: CYW20721B2KUMLGT Category: Brand:
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CYW20721B2KUMLGT Overview

The CYW20721B2KUMLGT is a wireless communication IC designed for robust Bluetooth connectivity in industrial and commercial products. Engineered for high integration and low power consumption, this module supports a wide range of wireless applications needing reliable connection and efficient operation. Its compact form factor and optimized feature set make it suitable for space-constrained designs and demanding usage environments. For sourcing and technical details, visit IC Manufacturer.

CYW20721B2KUMLGT Technical Specifications

Parameter Value
Type Bluetooth Wireless Communication IC
Package QFN-56
Operating Voltage 1.8V / 3.3V (Dual supply supported)
Operating Temperature Range -40??C to +85??C
Core Architecture ARM Cortex-M
Bluetooth Version Bluetooth 5.0
Interface UART, I2C, SPI, PWM, GPIO
Mounting Type Surface Mount
RoHS Status Compliant

CYW20721B2KUMLGT Key Features

  • Integrated Bluetooth 5.0 core enabling advanced wireless communication with improved range and data throughput for demanding applications.
  • Wide operating temperature range from -40??C to +85??C ensures reliable performance in industrial and commercial environments.
  • Supports multiple serial interfaces including UART, I2C, and SPI, facilitating seamless integration with a variety of host processors and peripherals.
  • Low power architecture with dual supply voltage support enhances energy efficiency, extending battery life for portable devices.
  • Compact QFN-56 package allows for flexible PCB layout in space-constrained designs without compromising connectivity options.
  • RoHS compliance ensures alignment with global environmental and safety standards, simplifying product certification and market entry.

CYW20721B2KUMLGT Advantages vs Typical Alternatives

This device offers a combination of low power consumption, wide temperature range, and versatile interface support, making it ideal for harsh or space-limited environments. The integration of Bluetooth 5.0 technology delivers enhanced wireless performance and connectivity compared to legacy modules. Its robust feature set and compliance certifications reduce design complexity and streamline qualification processes for industrial applications.

Typical Applications

  • Industrial automation and control systems: Enables reliable wireless communication between sensors, controllers, and gateways in factory automation, process monitoring, and industrial robotics. The robust Bluetooth connectivity supports stable links in electrically noisy environments.
  • Smart home and building automation: Facilitates secure wireless control and monitoring of lighting, HVAC, access systems, and smart appliances, leveraging efficient Bluetooth mesh networking.
  • Medical devices: Supports short-range wireless data transfer and device pairing for patient monitoring, diagnostics, and portable medical equipment, ensuring dependable operation within stringent safety criteria.
  • Consumer electronics: Integrates into wearables, remote controls, and personal electronics requiring low power operation and compact wireless modules for enhanced user convenience.

CYW20721B2KUMLGT Brand Info

The CYW20721B2KUMLGT is part of a specialized portfolio of Bluetooth wireless ICs designed for industrial and commercial use. This product line is developed to address the growing demand for energy-efficient, high-performance wireless connectivity in complex environments. With a focus on integration and reliability, the device provides a foundation for OEMs and designers to build robust, future-proof wireless solutions. Its compliance with industry standards and versatile feature set make it a preferred choice for advanced connectivity applications.

FAQ

What kind of wireless communication does this device support?

This product is engineered for Bluetooth 5.0 wireless communication, offering increased range, data throughput, and improved coexistence with other wireless protocols. It is suitable for modern industrial and commercial applications where reliable and efficient connectivity is required.

Which environments can this device operate in?

The CYW20721B2KUMLGT is designed for use in a wide range of environments, supporting an operating temperature from -40??C to +85??C. This makes it suitable for industrial, commercial, and outdoor deployments where temperature extremes are common.

What interfaces are available for system integration?

This IC offers multiple serial interfaces including UART, I2C, SPI, PWM, and GPIO. These interfaces provide flexibility for designers to connect with various host processors, sensors, and other peripheral components in a system.

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Is this device compliant with environmental standards?

Yes, this product is RoHS compliant, meaning it meets key global requirements for the restriction of hazardous substances in electronic equipment. This supports easier certification and global market access for end products.

What package and mounting options does the device offer?

The CYW20721B2KUMLGT is supplied in a compact QFN-56 package and is intended for surface mount assembly. This allows for high-density PCB layouts and is well-suited to products where board space is at a premium.

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