CYW20721B1KUMLGT Bluetooth Module, MCU, QFN Package

CYW20721B1KUMLGT Overview

The CYW20721B1KUMLGT is a highly integrated single-chip solution designed for advanced wireless connectivity in industrial and consumer electronic applications. With robust support for Bluetooth communication, this device delivers reliable short-range wireless performance, optimized for low power operation and high efficiency. Its compact form factor and versatile feature set make it suitable for embedded systems requiring seamless data exchange and control. The CYW20721B1KUMLGT is well-suited for next-generation designs where space, power consumption, and wireless integration are critical. For more details, visit the IC Manufacturer.

CYW20721B1KUMLGT Technical Specifications

CYW20721B1KUMLGT Key Features

• Bluetooth protocol support ensures seamless wireless connectivity for a wide range of devices, enabling robust data transmission and reliable communication.
• Surface mount package (56-VFQFN Exposed Pad) allows for compact PCB designs and simplifies automated assembly, which is ideal for high-density applications.
• Wide operating temperature range (-40??C to +85??C) enhances reliability in industrial and outdoor environments, supporting stable performance in demanding conditions.
• Highly integrated single-chip design reduces bill of materials and streamlines the overall system layout, promoting cost-effective and efficient product development.

CYW20721B1KUMLGT Advantages vs Typical Alternatives

This device stands out due to its robust Bluetooth integration, compact VFQFN package, and reliable surface mount capability. The extended operating temperature range ensures dependable operation in harsh environments, supporting industrial-grade applications. Its single-chip design streamlines integration, offering enhanced efficiency, reduced component count, and improved system reliability compared to many standard RF transceivers.

Typical Applications

• Wireless communication modules for industrial automation, where stable Bluetooth connectivity is required for machine-to-machine data exchange and control systems.
• Consumer electronics such as wireless headsets, speakers, and smart home devices, benefiting from low power consumption and streamlined integration.
• Medical device interfaces, enabling secure and efficient wireless data transfer between monitoring equipment and control units.
• Point-of-sale and portable terminal devices, which require reliable short-range wireless communication in compact, ruggedized form factors.

CYW20721B1KUMLGT Brand Info

The CYW20721B1KUMLGT is part of a family of advanced RF transceiver ICs tailored for modern Bluetooth connectivity. Engineered for integration into both industrial and consumer products, this device exemplifies a commitment to wireless performance and design flexibility. Its robust platform provides a dependable foundation for product developers seeking streamlined wireless solutions in challenging environments.

FAQ

What type of wireless protocol does the CYW20721B1KUMLGT support?

This model supports Bluetooth connectivity, making it suitable for a wide array of wireless communication applications where reliable short-range data transmission is essential.

What package type is used for this device?

The CYW20721B1KUMLGT comes in a 56-VFQFN Exposed Pad package, which facilitates efficient heat dissipation and allows for compact, high-density PCB layouts in end products.

Is this device suitable for industrial environments?

Yes, with its wide operating temperature range from -40??C to +85??C, this device is designed to maintain stable performance in both industrial and outdoor settings where reliability is crucial.

What are the integration benefits of this device?

Being a single-chip Bluetooth solution, the CYW20721B1KUMLGT reduces component count, streamlines board design, and can lower overall system costs, making it easier to develop compact and efficient wireless systems.

Can this chip be used in consumer electronics?

Absolutely. Its compact package, Bluetooth capabilities, and support for automated surface mount assembly make it ideal for integration into consumer devices such as wireless audio products, home automation systems, and portable terminals.