CYW20721B1KUMLG Overview
The CYW20721B1KUMLG is a highly integrated Bluetooth solution designed for advanced wireless applications in industrial and consumer electronics. This device combines Bluetooth connectivity with efficient power management, enabling robust wireless communication in compact designs. With a focus on reliability and versatile integration, it supports a wide range of use cases, from IoT nodes to smart home devices. Its small form factor and comprehensive connectivity make it a preferred choice for engineers seeking seamless implementation. For more details, visit IC Manufacturer.
CYW20721B1KUMLG Technical Specifications
| Parameter | Details |
|---|---|
| Device Type | Bluetooth IC |
| Connectivity | Bluetooth |
| Package / Case | 56-VFBGA |
| Operating Temperature Range | -40??C to +85??C |
| Mounting Type | Surface Mount |
| Integrated Features | Wireless Transceiver |
| Core Architecture | Single Chip |
| RoHS Status | Compliant |
CYW20721B1KUMLG Key Features
- Bluetooth wireless transceiver with seamless connectivity, enabling reliable data transmission for a broad range of applications.
- Compact 56-VFBGA package supports high-density PCB layouts and helps reduce overall solution footprint.
- Wide operating temperature range from -40??C to +85??C ensures dependable performance in demanding industrial and commercial environments.
- Surface mount design simplifies assembly and integration into automated production lines.
- RoHS compliant construction supports eco-friendly manufacturing and global regulatory compatibility.
- Single-chip architecture reduces BOM cost and design complexity, streamlining the development process for embedded system designers.
CYW20721B1KUMLG Advantages vs Typical Alternatives
Compared to typical alternatives, this Bluetooth IC stands out with its robust single-chip integration, which reduces board space and design complexity. The wide operating temperature range enhances reliability for industrial use. Additionally, the 56-VFBGA surface-mount package provides flexibility for compact designs, supporting high-density layouts and automated assembly processes with efficient connectivity and integrated wireless functions.
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Typical Applications
- Wireless sensor nodes in industrial IoT systems, where robust Bluetooth connectivity and compact design are essential for reliable data acquisition and communication.
- Smart home devices such as wireless lighting controls and access systems, leveraging the chip??s surface mount package and Bluetooth integration.
- Wearable electronics that require low power wireless connectivity and a small PCB footprint for user comfort and extended battery life.
- Consumer electronics including remote controls and audio accessories, where RoHS compliance and reliable Bluetooth performance are key factors.
CYW20721B1KUMLG Brand Info
The CYW20721B1KUMLG is a specialized product within its brand??s portfolio, engineered for dependable wireless communication in diverse electronic applications. It reflects a commitment to integrating advanced Bluetooth technology into compact, efficient chip designs. The RoHS-compliant manufacturing approach reinforces the brand??s dedication to environmental standards and global market needs. This device is recognized for its versatility and suitability in a wide range of industrial and consumer electronic designs.
FAQ
What is the primary function of the CYW20721B1KUMLG?
This device functions as a Bluetooth wireless IC, enabling seamless connectivity and data exchange in embedded systems. It is designed to support robust wireless communication in various industrial, commercial, and consumer applications where reliable Bluetooth performance is required.
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Which environments are suitable for deploying this component?
The wide operating temperature range from -40??C to +85??C allows deployment in both industrial and commercial environments. Its reliability under harsh conditions makes it ideal for applications in factories, warehouses, smart buildings, and outdoor devices.
What benefits does the single-chip design offer?
The single-chip architecture streamlines system design by minimizing external component requirements, reducing the bill of materials (BOM), and simplifying PCB layouts. This compact integration supports greater design flexibility and ease of manufacturing for engineers.
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How does the packaging of this IC contribute to design goals?
The 56-VFBGA surface-mount package enables high-density board designs, which is critical for products requiring a small footprint. Surface mounting also supports automated assembly processes, reducing production time and cost.
Is the CYW20721B1KUMLG compliant with environmental regulations?
Yes, the device is RoHS compliant, ensuring it meets international environmental and safety standards. This compliance allows manufacturers to create eco-friendly products suitable for global markets while maintaining high performance and reliability.
