CYW20710A1KUBXGT Bluetooth MCU Module ÿ Wireless SoC, 40-QFN Package

  • Provides Bluetooth connectivity, enabling wireless communication between devices for data transfer and control applications.
  • Features a KUBXGT package, supporting compact PCB layouts and helping reduce overall board space requirements.
  • Low-power operation is suitable for battery-powered products, extending device uptime between charges.
  • Ideal for use in smart home systems where reliable wireless links improve user convenience and system flexibility.
  • Manufactured to meet quality standards, ensuring dependable performance in various embedded environments.
SKU: CYW20710A1KUBXGT Category: Brand:
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CYW20710A1KUBXGT Overview

The CYW20710A1KUBXGT is a highly integrated, Bluetooth-enabled IC designed for robust wireless communication in industrial and commercial environments. Engineered for precision and reliability, this device supports seamless Bluetooth connectivity with optimized power consumption and compact packaging. Its advanced architecture and broad operating temperature range make it suitable for demanding embedded applications. For engineers and sourcing specialists seeking dependable wireless solutions, the CYW20710A1KUBXGT offers a compelling blend of connectivity, integration, and performance. Discover more at IC Manufacturer.

CYW20710A1KUBXGT Technical Specifications

Parameter Specification
Product Category RF Transceiver ICs
Protocol Bluetooth
Package / Case 49-UFBGA, WLCSP
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Operating Temperature Range -40??C to +85??C
Mounting Type Surface Mount
Supplier Device Package 49-WLCSP (3.45×3.50)
ECCN 5A002.a.1
HTS Code 8542.39.0001

CYW20710A1KUBXGT Key Features

  • Bluetooth Protocol Integration: Enables wireless connectivity, facilitating streamlined communication in embedded systems and IoT devices.
  • Wide Operating Temperature Range: Operates reliably from -40??C to +85??C, making it suitable for industrial and outdoor applications where temperature extremes are common.
  • Compact 49-WLCSP Package: Supports high-density layouts and space-constrained designs, increasing design flexibility for modern electronics.
  • Surface Mount Compatibility: Eases automated assembly and improves production efficiency for manufacturers.
  • MSL 3 (168 Hours): Provides adequate protection against moisture during processing, ensuring long-term device reliability.
  • Compliance with ECCN 5A002.a.1: Aligns with international trade and security regulations, simplifying global sourcing and logistics.

CYW20710A1KUBXGT Advantages vs Typical Alternatives

Compared to standard RF transceiver ICs, this device stands out by combining robust Bluetooth protocol support, a broad operating temperature range, and a compact WLCSP package. Its moisture sensitivity rating and compliance with global ECCN/HTS standards further enhance reliability and facilitate international deployment. These function-driven characteristics make it a smart choice for demanding wireless applications.

Typical Applications

  • Industrial Wireless Communication Modules: The CYW20710A1KUBXGT is ideal for factory automation, remote monitoring, and industrial sensor networks requiring reliable Bluetooth connectivity across harsh temperature ranges and tight PCB spaces.
  • Consumer and Medical Devices: Its compact footprint and Bluetooth support suit wearable devices, fitness trackers, and medical monitors where size and wireless reliability are critical.
  • Home Automation and Smart Controls: Designed for integration into smart home gateways, lighting controls, and security systems, enabling seamless device-to-device communication.
  • Asset Tracking and Logistics: Enables efficient wireless data transfer in tracking tags, inventory systems, and logistics sensors demanding robust and secure RF performance.

CYW20710A1KUBXGT Brand Info

This Bluetooth transceiver IC delivers a compact and reliable wireless solution, engineered for applications where connectivity, space, and environmental resilience are paramount. The brand emphasizes quality and compliance, ensuring the CYW20710A1KUBXGT meets global standards for industrial and commercial electronics design. The product is tailored for engineers and OEMs requiring dependable Bluetooth integration within demanding environments.

FAQ

What is the recommended operating temperature range for this device?

The CYW20710A1KUBXGT operates efficiently across a wide temperature span of -40??C to +85??C. This allows it to function reliably in industrial, automotive, and outdoor deployments where environmental conditions can fluctuate significantly.

Which package type does the CYW20710A1KUBXGT utilize?

This part is provided in a 49-UFBGA, WLCSP package, specifically a 49-WLCSP with dimensions of 3.45 x 3.50 mm. This compact packaging is suitable for miniaturized designs requiring high component density.

Is the CYW20710A1KUBXGT suitable for automated assembly processes?

Yes, the device supports surface mount technology, making it compatible with modern automated PCB assembly lines. This enhances production speed and consistency for high-volume manufacturing environments.

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What regulatory classifications apply to this component?

The IC is classified under ECCN 5A002.a.1 and HTS Code 8542.39.0001. These designations are important for export control, compliance, and global trade, streamlining international sourcing and logistics operations.

How does the moisture sensitivity level affect handling and storage?

With an MSL rating of 3 (168 hours), the device requires proper handling to prevent moisture-induced damage during soldering. This rating indicates it must be processed within 168 hours of opening its moisture barrier packaging to maintain long-term reliability.

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