CYW20707UA1KFFB4GT Bluetooth Module, Wireless MCU, QFN-40 Package

  • Enables Bluetooth wireless connectivity for seamless device communication and data exchange.
  • Supports UART interface, allowing straightforward integration with microcontrollers for efficient data transfer.
  • Offered in a compact 32-VFQFN package, conserving valuable board space in space-constrained designs.
  • Ideal for use in smart home devices, providing reliable wireless links for automation and control applications.
  • Manufactured with standard industry practices to ensure dependable performance and operational stability.
SKU: CYW20707UA1KFFB4GT Category: Brand:
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产品上方询盘

CYW20707UA1KFFB4GT Overview

The CYW20707UA1KFFB4GT is a single-chip Bluetooth solution designed for robust wireless communication in demanding industrial and commercial environments. With its advanced connectivity capabilities, this device supports Bluetooth Classic, making it suitable for a wide range of embedded and IoT applications. The integration of a high-performance RF subsystem, efficient power management, and a compact 56-VFBGA (6×6) package allows for streamlined design and reduced footprint. This solution is ideal for engineers seeking high reliability and flexibility in wireless designs. Learn more at IC Manufacturer.

CYW20707UA1KFFB4GT Technical Specifications

Parameter Value
Bluetooth Version Bluetooth Classic
Protocol Bluetooth
Package / Case 56-VFBGA, 6×6
Mounting Type Surface Mount
Operating Temperature Range -40??C to 85??C
Base Product Number CYW20707
Number of Pins 56
Operating Supply Voltage Supported (refer to official datasheet)

CYW20707UA1KFFB4GT Key Features

  • Fully integrated Bluetooth Classic wireless connectivity for seamless device-to-device communication and simplified system design.
  • Compact 56-VFBGA (6×6) package reduces PCB footprint, which allows for space-constrained applications while maintaining robust performance.
  • Wide operating temperature range from -40??C to 85??C ensures reliable operation in industrial and commercial installations.
  • Surface mount package streamlines manufacturing and supports automated assembly processes, enhancing production efficiency.

CYW20707UA1KFFB4GT Advantages vs Typical Alternatives

This Bluetooth device stands out due to its combination of industrial-grade temperature tolerance and compact VFBGA package, offering superior integration and design flexibility compared to standard modules. The robust RF performance and surface mount compatibility provide enhanced reliability, making it well-suited for applications where space and dependable connectivity are critical.

Typical Applications

  • Industrial wireless control systems benefit from reliable Bluetooth connectivity, enabling robust data exchange between sensors, actuators, and controllers even in harsh environments.
  • Consumer electronics devices such as wireless peripherals and audio accessories, where compact size and stable Bluetooth Classic performance are essential.
  • Medical devices that require secure, interference-resistant wireless connections for data transmission between instruments and monitoring equipment.
  • Home automation products needing seamless integration of wireless control for smart locks, lighting, and other connected solutions.

CYW20707UA1KFFB4GT Brand Info

The CYW20707UA1KFFB4GT is part of a trusted line of Bluetooth solutions recognized for their reliability and ease of integration. The product leverages proven Bluetooth Classic technology and is packaged to meet the needs of modern, high-density circuit board layouts. Its design supports rigorous industrial standards, making it a preferred choice for engineers and sourcing specialists seeking a dependable wireless communication component.

FAQ

What type of Bluetooth connectivity does this device support?

This component supports Bluetooth Classic, which is ideal for applications needing robust, reliable wireless communication and compatibility with a wide base of Bluetooth-enabled devices.

What advantages does the 56-VFBGA package offer?

The 56-VFBGA (6×6) package provides a compact footprint, enabling designers to implement the device in space-constrained environments while maintaining signal integrity and thermal performance.

Is this device suitable for use in harsh environments?

Yes, its operating temperature range of -40??C to 85??C ensures dependable performance in industrial, outdoor, and commercial settings where environmental conditions may fluctuate.

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产品中间询盘

Can this device be used in automated assembly processes?

Absolutely. The surface mount design of this Bluetooth solution supports automated pick-and-place assembly, streamlining high-volume manufacturing and ensuring consistent quality.

What are some common use cases for this Bluetooth solution?

It is frequently used in industrial automation, consumer electronics, medical devices, and smart home systems, enabling wireless communication and data exchange across diverse connected environments.

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