CYW20706UA1KFFB4G Overview
The CYW20706UA1KFFB4G is a highly integrated Bluetooth module widely used in industrial, consumer, and commercial electronics. With its compact form factor and on-board RF circuitry, it streamlines wireless connectivity solutions for applications requiring robust short-range communication. This module is engineered for seamless integration, offering excellent reliability and consistent performance in demanding environments. Its optimized design reduces development complexity, supporting efficient deployment in a variety of wireless systems. For additional product sourcing and information, visit IC Manufacturer.
CYW20706UA1KFFB4G Technical Specifications
| Parameter | Value |
|---|---|
| Type | Bluetooth Module |
| Mounting Style | Surface Mount |
| Package / Case | 48-VFQFN Exposed Pad |
| Core Architecture | ARM |
| Core Sub-Architecture | Cortex-M3 |
| Operating Temperature Range | -40??C to 85??C |
| Data Rate | Up to 3 Mbps |
| Supply Voltage | 1.8V / 3.3V |
| Frequency | 2.4 GHz ISM Band |
CYW20706UA1KFFB4G Key Features
- Highly integrated Bluetooth transceiver with embedded ARM Cortex-M3 core, enabling streamlined system design and reduced external component count.
- Extended operating temperature range from -40??C to 85??C ensures reliable performance in industrial and harsh ambient environments.
- Surface-mount 48-VFQFN package allows for compact PCB layouts, supporting miniaturization and dense assembly.
- Dual supply voltage support (1.8V/3.3V) offers flexibility for diverse system power architectures.
CYW20706UA1KFFB4G Advantages vs Typical Alternatives
Compared to typical Bluetooth modules, this device provides enhanced integration by consolidating RF and controller functions into a single package. Its ARM Cortex-M3 core delivers efficient processing, while the wide temperature range and surface-mount package increase deployment flexibility and long-term reliability. These characteristics make it a strong choice for demanding industrial and commercial wireless designs.
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Typical Applications
- Industrial automation systems benefit from its robust wireless connectivity, providing reliable machine-to-machine communication in environments with strong temperature variations and electromagnetic interference.
- Consumer electronics, such as smart home devices and wearable technology, utilize the compact form factor to enable wireless features in space-constrained designs.
- Medical devices can leverage its high integration and surface-mount compatibility to meet stringent reliability and size requirements for wireless patient monitoring solutions.
- Commercial point-of-sale (POS) terminals employ the module for secure, short-range data transmission between peripherals and host systems.
CYW20706UA1KFFB4G Brand Info
This Bluetooth module is part of a widely recognized series designed for industrial-grade wireless communication. The product is tailored for high-performance embedded applications, offering a combination of ARM Cortex-M3 processing and advanced RF integration. Its design philosophy emphasizes ease of integration, reliability, and adaptability to a range of applications from demanding industrial installations to compact consumer electronics. The brand’s focus on quality ensures consistent performance and long-term support for engineering teams worldwide.
FAQ
What package type is used, and how does it benefit PCB design?
The component is supplied in a 48-VFQFN exposed pad package, which is ideal for surface-mount assembly. This footprint supports compact board layouts and efficient heat dissipation, making it suitable for high-density and thermally demanding designs.
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What temperature range can this device reliably operate in?
The module is specified for continuous operation between -40??C and 85??C. This wide range ensures reliable performance in both industrial environments and outdoor applications subject to temperature extremes.
Which processor architecture does this module utilize?
It incorporates an ARM Cortex-M3 core, which is well-regarded for its balance of processing power and energy efficiency. This architecture is widely supported and eases integration into embedded systems development flows.
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What voltage levels are supported for system integration?
The device supports both 1.8V and 3.3V supply voltages, providing flexibility when interfacing with different system power domains or adapting to specific application requirements.
Is this module suitable for harsh industrial environments?
Yes, thanks to its robust operating temperature range, integrated RF design, and reliable surface-mount package, it is well-suited for industrial automation, instrumentation, and other mission-critical applications where reliability is paramount.
