CYW20705B0KWFBGT Overview
The CYW20705B0KWFBGT is a highly integrated Bluetooth solution designed for demanding industrial and commercial applications where both reliability and compact size are critical. Featuring a robust architecture and advanced connectivity, this device offers engineers a seamless pathway to add Bluetooth functionality into their products. Its compact footprint, combined with flexible voltage requirements and surface-mount packaging, make it ideal for space-constrained designs. With a focus on performance and integration, this component enables efficient wireless communication in a wide range of environments. For additional details and sourcing information, visit IC Manufacturer.
CYW20705B0KWFBGT Technical Specifications
| Parameter | Details |
|---|---|
| Device Type | Bluetooth Integrated Circuit |
| Mounting Style | Surface Mount |
| Package / Case | 40-VFBGA |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Operating Temperature Range | -40??C to +85??C |
| Voltage – Supply | 1.62V to 3.63V |
| Core Architecture | Bluetooth Core |
CYW20705B0KWFBGT Key Features
- Robust Bluetooth functionality enables high-quality wireless communication, ensuring reliable connectivity in various environments.
- Wide operating temperature range (-40??C to +85??C) supports industrial and commercial deployments where environmental resilience is essential.
- Compact 40-VFBGA package helps minimize board space, supporting dense PCB layouts and modern product form factors.
- Flexible supply voltage (1.62V to 3.63V) allows easy integration into systems with diverse power rails, improving design versatility.
- Surface mount design streamlines automated assembly, supporting efficient and scalable manufacturing processes.
- RoHS compliance ensures the device meets today??s environmental and regulatory standards for global markets.
- Moisture Sensitivity Level 3 (MSL3) rating provides dependable performance and facilitates safe handling during assembly.
CYW20705B0KWFBGT Advantages vs Typical Alternatives
This Bluetooth IC stands out due to its compact VFBGA footprint and extended temperature range, providing reliable wireless performance in space-constrained and industrial applications. Its broad supply voltage range and RoHS compliance add design flexibility and global market readiness. The combination of robust connectivity, flexible integration, and manufacturing-friendly packaging makes it advantageous over less integrated or less rugged alternatives.
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Typical Applications
- Industrial wireless control systems: The device??s robust Bluetooth connectivity and wide temperature range make it ideal for remote equipment monitoring, machine communication, and sensor networks in industrial automation environments.
- Consumer electronics: Its small size and efficient power requirements support integration into portable devices, wireless audio peripherals, and smart home products.
- Medical devices: The compact package and reliable wireless performance suit it for patient monitoring, fitness wearables, and other healthcare electronics that demand secure, stable communications.
- Asset tracking and logistics: Enables secure, real-time tracking solutions in warehouses and distribution centers, leveraging Bluetooth for precise asset location and data transfer.
CYW20705B0KWFBGT Brand Info
The CYW20705B0KWFBGT is part of a portfolio recognized for delivering high-performance Bluetooth solutions tailored to industrial, commercial, and consumer sectors. This device is engineered for applications that require stable wireless connectivity, reliable assembly, and compliance with modern environmental standards. Its brand stands for robust design, integration flexibility, and a commitment to quality, making it a trusted component for engineers building advanced wireless systems.
FAQ
What is the primary use case for the CYW20705B0KWFBGT?
This device is typically used to add reliable Bluetooth connectivity to embedded systems across industrial, medical, and consumer applications. Its robust design makes it suitable for environments that demand stable connections and operational resilience.
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What type of package does the CYW20705B0KWFBGT use?
The component comes in a 40-VFBGA package. This very fine ball grid array format provides a compact footprint, ideal for space-constrained PCB designs and high-density layouts.
How does the CYW20705B0KWFBGT handle varying operating environments?
With an extended operating temperature range from -40??C to +85??C, the device is well-suited for both industrial and commercial installations where temperature fluctuations are common, ensuring consistent performance.
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Is the CYW20705B0KWFBGT compliant with environmental regulations?
Yes, it is RoHS compliant, meeting global standards for hazardous substance restrictions. This simplifies compliance for OEMs and ensures market access in regions with strict environmental regulations.
What is the recommended moisture sensitivity level during assembly?
The device has a Moisture Sensitivity Level (MSL) rating of 3, which means it can be safely exposed to ambient conditions for up to 168 hours before solder reflow, supporting typical industrial assembly processes.
