CYW20703UA1KFFB1GT Bluetooth Module, Wireless Transceiver, FBGA Package

  • Enables wireless connectivity, allowing seamless data transfer between devices in personal and industrial environments.
  • Supports Bluetooth technology, ensuring compatibility with a wide range of wireless products and accessories.
  • Features a compact module design, making it suitable for applications with strict space constraints on circuit boards.
  • Well-suited for use in smart home devices, enhancing user control and automation through wireless communication.
  • Manufactured for consistent performance, reducing the likelihood of connectivity failures during extended operation.
SKU: CYW20703UA1KFFB1GT Category: Brand:
Infineon logo
产品上方询盘

CYW20703UA1KFFB1GT Overview

The CYW20703UA1KFFB1GT is a wireless communication IC designed for high-performance Bluetooth connectivity in industrial and commercial applications. This device integrates advanced wireless functionality with robust design elements, making it ideal for demanding environments where reliable data transmission is required. Featuring a highly integrated architecture in a compact 56-VFBGA package, this solution streamlines board design and minimizes overall system footprint. For sourcing and technical details, refer to IC Manufacturer.

CYW20703UA1KFFB1GT Technical Specifications

Parameter Value
Part Number CYW20703UA1KFFB1GT
Device Type RF Integrated Circuit (Bluetooth)
Mounting Type Surface Mount
Package / Case 56-VFBGA
RoHS Status RoHS Compliant
ECCN Code 5A002.a.1
Supplier Device Package 56-VFBGA (6×6)
Lead Free Status Lead Free
Application Bluetooth Wireless Communication

CYW20703UA1KFFB1GT Key Features

  • Highly integrated Bluetooth RF IC, enabling robust wireless connectivity in space-constrained designs.
  • Surface mount 56-VFBGA package supports automated assembly and reliable PCB integration, reducing production complexity.
  • RoHS compliance and lead-free construction meet global environmental and safety standards, supporting sustainable manufacturing.
  • Designed for industrial-grade reliability, ensuring consistent performance in challenging operational conditions.

CYW20703UA1KFFB1GT Advantages vs Typical Alternatives

This wireless IC stands out by offering a combination of compact packaging, high integration, and RoHS compliance, all of which enhance reliability and ease of assembly. Compared to standard alternatives, it streamlines manufacturing processes and provides robust connectivity in demanding industrial or commercial environments, making it a strong choice for next-generation wireless system designs.

Typical Applications

  • Wireless industrial automation systems benefit from the IC??s reliable Bluetooth connectivity, enabling efficient, real-time data exchange between sensors, controllers, and monitoring devices.
  • Consumer electronics, such as smart home devices, use this component for seamless wireless communication with minimal power consumption and high integration.
  • Medical wearable devices leverage its compact VFBGA package and robust design for secure, continuous wireless data transfer in health monitoring solutions.
  • Asset tracking and logistics equipment employ this IC to maintain stable Bluetooth links for real-time inventory and location management.

CYW20703UA1KFFB1GT Brand Info

The CYW20703UA1KFFB1GT belongs to a portfolio of advanced wireless integrated circuits engineered for high-performance Bluetooth applications. With a focus on industrial and commercial reliability, this device exemplifies the brand??s commitment to innovation, quality, and compliance with leading environmental standards. Its design supports demanding use cases where robust connectivity and minimal board footprint are critical.

FAQ

What type of applications can benefit most from the CYW20703UA1KFFB1GT?

This device is particularly well-suited for applications that require reliable Bluetooth wireless communication, such as industrial automation, medical wearables, asset tracking, and consumer electronics. Its compact package and robust feature set support a wide range of wireless solutions in space-constrained and demanding environments.

Is the CYW20703UA1KFFB1GT compliant with environmental regulations?

Yes, this wireless IC is RoHS compliant and lead-free, making it suitable for global markets and manufacturing environments where strict environmental and safety standards are required. This ensures both the safety of end products and the sustainability of the supply chain.

What packaging does the CYW20703UA1KFFB1GT use and why is it important?

The device comes in a 56-VFBGA (Very Fine Ball Grid Array) package, measuring 6×6 mm. This compact packaging enables high-density PCB layouts, supports automated assembly, and provides reliable electrical and thermal performance for industrial and portable applications.

📩 Contact Us

产品中间询盘

Which industry standards relate to the CYW20703UA1KFFB1GT??s export or use?

The IC is categorized under ECCN 5A002.a.1, which is relevant for export control regulations concerning encryption or security-enabled devices. Users should ensure compliance with applicable trade and export laws when sourcing or deploying this part globally.

Does the CYW20703UA1KFFB1GT support automated manufacturing processes?

Yes, the surface-mount VFBGA package is specifically designed for compatibility with automated pick-and-place assembly lines, streamlining manufacturing and reducing the potential for manual handling errors. This enhances production efficiency and product reliability.

Application

, ,

Save cost and time

Fast global delivery

Original parts guaranteed

Expert after-sale support

Looking for a Better Price?